Patents by Inventor Jae Yeong JUNG

Jae Yeong JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor die pickup apparatus
    Patent number: 12255083
    Abstract: A semiconductor die pickup apparatus according to an aspect of the present disclosure includes a tape peeler for peeling a mount tape from a semiconductor die, and a flipper for holding the semiconductor die, wherein the tape peeler includes a housing part having a groove that faces the mount tape, a cover part covering the groove, a roller part connected to the cover part, and a vacuum part performing vacuum suction within the groove. The roller part moves to wind the cover part.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: March 18, 2025
    Assignee: SK hynix Inc.
    Inventors: Jae Yeong Jung, Jong Kyu Moon
  • SEMICONDUCTOR DIE PICKUP APPARATUS
    Publication number: 20230230860
    Abstract: A semiconductor die pickup apparatus according to an aspect of the present disclosure includes a tape peeler for peeling a mount tape from a semiconductor the, and a flipper for holding the semiconductor die, wherein the tape peeler includes a housing part having a groove that faces the mount tape, a cover part covering the groove, a roller part connected to the cover part, and a vacuum part performing vacuum suction within the groove. The roller part moves to wind the cover part.
    Type: Application
    Filed: June 23, 2022
    Publication date: July 20, 2023
    Applicant: SK hynix Inc.
    Inventors: Jae Yeong JUNG, Jong Kyu MOON