Abstract: A semiconductor device includes a common source region formed in a semiconductor substrate, a bit line formed over the semiconductor substrate, first and second vertical channel layers coupled between the bit line and the common source region, wherein the first and second vertical channel layers are alternately arranged on the semiconductor substrate, first conductive layers stacked over the semiconductor substrate to surround one side of the first vertical channel layer, second conductive layers stacked over the semiconductor substrate to surround one side of the second vertical channel layer, and a charge storage layer formed between the first vertical channel layer and the first conductive layers and between the second vertical channel layer and the second conductive layers.

Abstract: A semiconductor device includes a common source region formed in a semiconductor substrate, a bit line formed over the semiconductor substrate, first and second vertical channel layers coupled between the bit line and the common source region, wherein the first and second vertical channel layers are alternately arranged on the semiconductor substrate, first conductive layers stacked over the semiconductor substrate to surround one side of the first vertical channel layer, second conductive layers stacked over the semiconductor substrate to surround one side of the second vertical channel layer, and a charge storage layer formed between the first vertical channel layer and the first conductive layers and between the second vertical channel layer and the second conductive layers.

Abstract: A flash memory device is disclosed. The flash memory device includes: a cell array region; an X-decoder region arranged adjacent to the cell array region in a first direction; a discharge transistor region disposed between the cell array region and the X-decoder region; a first metal line formed to pass through the X-decoder region, the discharge transistor region, and the cell array region, and arranged to extend in the first direction; and a second metal line including a first line patterns arranged parallel to the first metal line between the first metal lines, and a second line pattern interconnecting both ends of the first line patterns and extending in a second direction crossing the first direction.

Abstract: A flash memory device is disclosed. The flash memory device includes: a cell array region; an X-decoder region arranged adjacent to the cell array region in a first direction; a discharge transistor region disposed between the cell array region and the X-decoder region; a first metal line formed to pass through the X-decoder region, the discharge transistor region, and the cell array region, and arranged to extend in the first direction; and a second metal line including a first line patterns arranged parallel to the first metal line between the first metal lines, and a second line pattern interconnecting both ends of the first line patterns and extending in a second direction crossing the first direction.

Abstract: A semiconductor device includes a common source region formed in a semiconductor substrate, a bit line formed over the semiconductor substrate, first and second vertical channel layers coupled between the bit line and the common source region, wherein the first and second vertical channel layers are alternately arranged on the semiconductor substrate, first conductive layers stacked over the semiconductor substrate to surround one side of the first vertical channel layer, second conductive layers stacked over the semiconductor substrate to surround one side of the second vertical channel layer, and a charge storage layer formed between the first vertical channel layer and the first conductive layers and between the second vertical channel layer and the second conductive layers.

Abstract: A semiconductor device may include a first transistor, a second transistor connected in series to the first transistor through a first junction, and a third transistor connected in series to the second transistor through a second junction. Here, a high voltage is supplied to one of the first and second junctions, and a turn-off voltage is supplied to a gate of the second transistor.

Abstract: A semiconductor device includes a first gate formed on a substrate, the first gate having a square shape. A first junction and a second junction are formed in the substrate at two opposite sides of the first gate. A third junction is formed in the substrate at one of the other two opposite sides of the first gate.

Abstract: A semiconductor device may include a first transistor, a second transistor connected in series to the first transistor through a first junction, and a third transistor connected in series to the second transistor through a second junction. Here, a high voltage is supplied to one of the first and second junctions, and a turn-off voltage is supplied to a gate of the second transistor.

Abstract: A semiconductor integrated circuit includes a driving unit, a first current path and a second current path. The driving unit applies a power supply voltage to a drive node in response to a control signal. The first current path couples the drive node and an output node. The second current path couples the drive node and the output node. The first current path and the second current path are coupled in parallel between the drive node and the output node.

Abstract: A semiconductor memory device having a sense amplifier control circuit is disclosed. At least two sensing power drivers among the plurality of sensing power drivers for driving sensing power in a selected sense amplifier array block are commonly connected to common sensing power lines by a plurality of switching units controlled according to sensing power supply control signals generated by using block select address signals, thereby improving a driving capacity of the sensing power drivers and a sensing speed.

Abstract: A semiconductor memory device having a sense amplifier control circuit is disclosed. At least two sensing power drivers among the plurality of sensing power drivers for driving sensing power in a selected sense amplifier array block are commonly connected to common sensing power lines by a plurality of switching units controlled according to sensing power supply control signals generated by using block select address signals, thereby improving a driving capacity of the sensing power drivers and a sensing speed.

Abstract: The present invention relates to a sub word line driving circuit for a semiconductor memory device, and said circuit comprises a first word line driving and clearing means for driving and clearing a first word line by applying according to a first word line driving signal a word line boosting voltage or a ground voltage into the first word line; a first word line potential emitting means for rapidly emitting according to a word line boosting bar voltage an electric potential of the first word line into the ground voltage; a second word line driving and clearing means for driving and clearing a second word line by applying according to a second word line driving signal a word line boosting voltage or a ground voltage into the second word line; a second word line potential emitting means for rapidly emitting according to the word line boosting bar voltage an electric potential of the second word line into the ground voltage; and an equalizing means for equalizing according to the word line boosting bar voltage