Abstract: According to the present disclosure, a network protection device includes: a communication device; a storage device configured to store a white list that defines access rights between a plurality of first terminals belonging to a target network; and a control device configured to modulate an address resolution protocol (ARP) table of each of the plurality of first terminals using an ARP packet so that a first communication flow generated between the plurality of first terminals is received by the communication device, and block the first communication flow or transmit the first communication flow to a destination based on the white list when the first communication flow is received.

Abstract: An embodiment of the present invention provides a coating composition comprising a composite in which a dissociated natural polymer compound is bound onto at least a portion of the surface of acrylic polymer particles.

Abstract: The present disclosure relates to an LED display device, and more particularly, to an LED display device including a repair structure for a deteriorated pixel. In the present disclosure, a sub LED electrically coupled to first and second connecting electrodes for applying a voltage to a LED is disposed on a deteriorated LED. Thus, deterioration of a display quality due to a deteriorated pixel is prevented. Since it is not required to remove a deteriorated LED, a fabrication cost is reduced and a process efficiency is improved.

Abstract: The present disclosure relates to an apparatus for transferring a light emitting diode (LED). The apparatus for transferring an LED includes: a pick-up unit configured to pick up at least some of multiple light emitting diodes (LEDs) arranged on one substrate, and, according to a received control signal, put down LEDs selected from among the picked-up LEDs on another substrate; and a controller configured to transmit the control signal to the pick-up unit so as to enable the pick-up unit to individually pick up or put down each of the multiple LEDs.

Abstract: An LED display apparatus with a simplified manufacturing process is provided. The LED display apparatus includes a common electrode layer on a first substrate, a second substrate including a first pixel driving device and a second pixel driving device, and a first light emitting device and a second light emitting device on the common electrode layer. The first light emitting device includes a first n-type semiconductor layer, a first active layer, and a first p-type semiconductor layer. The second light emitting device includes a second n-type semiconductor layer, a second active layer, and a second p-type semiconductor layer. As such, it is possible to provide an LED display apparatus with improved manufacturing reliability having at least one unit pixel composed of pixels by using at least one light emitting device integrated with the common electrode layer and at least two individual light emitting devices.

Abstract: The present disclosure relates to an LED display device, and more particularly, to an LED display device including a repair structure for a deteriorated pixel. In the present disclosure, a sub LED electrically coupled to first and second connecting electrodes for applying a voltage to a LED is disposed on a deteriorated LED. Thus, deterioration of a display quality due to a deteriorated pixel is prevented. Since it is not required to remove a deteriorated LED, a fabrication cost is reduced and a process efficiency is improved.

Abstract: The present disclosure relates to an apparatus for transferring a light emitting diode (LED). The apparatus for transferring an LED includes: a pick-up unit configured to pick up at least some of multiple light emitting diodes (LEDs) arranged on one substrate, and, according to a received control signal, put down LEDs selected from among the picked-up LEDs on another substrate; and a controller configured to transmit the control signal to the pick-up unit so as to enable the pick-up unit to individually pick up or put down each of the multiple LEDs.

Abstract: An embodiment of the present invention provides a coating composition comprising a composite in which a dissociated natural polymer compound is bound onto at least a portion of the surface of acrylic polymer particles.

Abstract: A process for fabrication of a power semiconductor device is disclosed in which a single photomask is used to define each of p-conductivity well regions and n-conductivity type source regions. In the process a single photomask is deposited on a layer of polysilicon on a wafer, the polysilicon layer is removed from first regions of the power semiconductor device where the p-conductivity well regions and the n-conductivity type source regions are to be formed, and both p-conductivity type and n-conductivity type dopants are introduced into the wafer through the first regions.

Abstract: A process for fabrication of a power semiconductor device is disclosed in which a single photomask is used to define each of p-conductivity well regions and n-conductivity type source regions. In the process a single photomask is deposited on a layer of polysilicon on a wafer, the polysilicon layer is removed from first regions of the power semiconductor device where the p-conductivity well regions and the n-conductivity type source regions are to be formed, and both p-conductivity type and n-conductivity type dopants are introduced into the wafer through the first regions.

Abstract: A process for fabrication of a power semiconductor device is disclosed in which a single photomask is used to define each of p-conductivity well regions and n-conductivity type source regions. In the process a single photomask is deposited on a layer of polysilicon on a wafer, the polysilicon layer is removed from first regions of the power semiconductor device where the p-conductivity well regions and the n-conductivity type source regions are to be formed, and both p-conductivity type and n-conductivity type dopants are introduced into the wafer through the first regions.

Abstract: A light emitting diode (LED) package and a method of manufacturing a LED package is provided. The LED package includes a case having first and second lead frames disposed through the case; an LED chip disposed on the case, the LED chip having first and second electrodes directly connected to the first and second lead frames through a eutectic bond, respectively; and a lens disposed over the case covering the LED chip.

Abstract: Provided is an image rotation method and apparatus for rotating an original image of 2n×2n pixels when n is a natural number greater than 1, including loading each row of pixels of the original image into a corresponding load memory vector; and, after the load step, for at least one iteration, performing a transposition operation for each matched load memory vector after matching the load memory vectors and, for zero or more iterations, an interleaving operation between each matched load memory vector after matching the load memory vectors, while the transposition step and the interleaving step are performed a total of n iterations.

Abstract: An air-damped engine mount has a filter module installed in a damping chamber formed by coupling between a main rubber and a main pipe. The air-damped engine mount may include a bolt, a main rubber into which the bolt is fitted and coupled, a hollow main pipe coupled with the main rubber and supporting the main rubber, a cover plate coupled with the main pipe to form a damping chamber between the cover plate and the main rubber, and a filter module coupled with the cover plate and configured to permit air to communicate through the filter module against flow resistance with the damping chamber and the outside, wherein the flow resistance against the air passing through the filter module regulates air pressure inside the damping chamber to reduce vibration in the main rubber.

Abstract: The present invention relates a novel method for preparing an 18F-mefway precursor. The present invention provides an efficient synthetic method of an 18F-mefway precursor, which comprises an improved the acid chloride coupling reaction and proper reduction condition to suppress breakdown of amide bond and can obtain the precursor in high yield.

Abstract: The present invention relates to a droplet jetting apparatus using electrostatic force, a manufacturing method thereof and an ink providing method thereof. The droplet jetting apparatus using electrostatic force includes a lower electrode unit in which a nozzle and a lower electrode positioned in the nozzle equipped in the upper part of a first substrate, and an ink inflow channel equipped in the lower part of the first substrate are integrally formed; an upper electrode unit having an upper electrode formed on the top surface of a second substrate and an ink discharge hole formed by being penetrated to the upper electrode from the bottom surface of the second substrate; and a bonding layer for bonding the lower electrode unit and the upper electrode unit with each other so that the nozzle is vertically aligned with the ink discharge hole.

Abstract: A process for fabrication of a power semiconductor device is disclosed in which a single photomask is used to define each of p-conductivity well regions and n-conductivity type source regions. In the process a single photomask is deposited on a layer of polysilicon on a wafer, the polysilicon layer is removed from first regions of the power semiconductor device where the p-conductivity well regions and the n-conductivity type source regions are to be formed, and both p-conductivity type and n-conductivity type dopants are introduced into the wafer through the first regions.

Abstract: A light emitting diode (LED) package and a method of manufacturing a LED package is provided. The LED package includes a case having first and second lead frames disposed through the case; an LED chip disposed on the case, the LED chip having first and second electrodes directly connected to the first and second lead frames through a eutectic bond, respectively; and a lens disposed over the case covering the LED chip.

Abstract: Provided is an image rotation method and apparatus for rotating an original image of 2n×2n pixels when n is a natural number greater than 1, including loading each row of pixels of the original image into a corresponding load memory vector; and, after the load step, for at least one iteration, performing a transposition operation for each matched load memory vector after matching the load memory vectors and, for zero or more iterations, an interleaving operation between each matched load memory vector after matching the load memory vectors, while the transposition step and the interleaving step are performed a total of n iterations.

Abstract: A method for controlling a washing machine includes comparing a command value of a motor with a predetermined limit value, during spin-drying, to determine whether the motor is overloaded, and controlling driving of the motor in response to the determination. It may be possible to determine a water filling state, an excessive bubble state, or a drainage error state, which may be caused during a spin-drying operation, and to take a proper measure. That is, in the drainage error state, a user is informed of the drainage error. In the water filling state, the spin-drying is normally completed by re-performing the spin-drying operation. In the excessive bubble state, a rinsing or spin-drying operation is added to remove the bubbles. When the bubbles are not removed by the added rinsing or spin-drying operation, the excessive bubble message is displayed to inform a consumer of the excessive bubble state.