Patents by Inventor Jae Yool SON

Jae Yool SON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LEAD-FREE SOLDER ALLOY AND METHOD OF MANUFACTURING ELECTRONIC DEVICE USING THE SAME
    Publication number: 20230111798
    Abstract: A lead-free solder alloy includes bismuth (Bi), content of which is equal to or greater than 56 wt % and equal to or less than 57.5 wt %, indium (In), content of which is equal to or greater than 0.05 wt % and equal to or less than 1.0 wt %, and the balance of tin (Sn) and another unavoidable impurity. The lead-free solder alloy of the disclosure may enable bonding with improved ductility and thermal shock reliability while not having a large melting point change compared to an Sn-58Bi alloy.
    Type: Application
    Filed: October 4, 2022
    Publication date: April 13, 2023
    Applicant: MK ELECTRON CO., LTD.
    Inventors: Young Woo LEE, Seul Gi LEE, Hui Joong KIM, Jae Yool SON, Jae Hun SONG, Jeong Tak MOON