Abstract: A semiconductor light emitting device includes: first and second conductive type semiconductor layers; an active layer disposed between the first and second conductive type semiconductor layers; and first and second electrodes disposed on one surface of each of the first and second conductive type semiconductor layers, respectively, wherein at least one of the first and second electrodes includes a pad part and a finger part formed to extend from the pad part, and the end of the finger part has an annular shape. Because a phenomenon in which current is concentrated in a partial area of the finger part is minimized, tolerance to electrostatic discharge (ESD) can be strengthened and light extraction efficiency can be improved.

Abstract: Disclosed is a motor. The motor includes a rotor case, a ring member mounted on the rotor case and including an encoder on a bottom surface thereof extending outside of the rotor case, and an encoder sensor detecting speed information of the rotor case from the encoder such that the rotor case rotates at low speeds enabling a LightScribe operation.

Abstract: A motor in which a coupling structure between a sleeve holder and a base plate is improved. The motor may include a base plate including at least one protrusion supporting part formed therein; and a sleeve holder including a cylindrical shaped body part to which a sleeve is fastened in an inside of the sleeve holder, an extension part protruded such that an outer diameter is extended along an outer circumferential surface of the body part, and a flange part vertically protruded in an outer diameter direction from a lower end portion of the extension part so as to make surface contact with an upper surface of the base plate, where the sleeve holder is fastened to the base plate while an outer circumferential surface of the protrusion supporting part is brought into contact with an inner circumferential surface of the extension part.

Abstract: There is provided a motor formed to have a simple coupling structure between a base plate and a sleeve holder, thereby implementing a simple structure and reducing costs and processes taken for manufacturing the motor, and an optical disc drive using the same. To this end, the motor includes a base plate having at least one protrusion formed therein, and a sleeve holder having a body part, of which the shape is cylindrical and in which a sleeve is fitted, and a flange protrudingly formed from a lower end of the body part in such a manner as to make surface-to-surface contact with an upper surface of the base plate, wherein the flange is formed to have at least one insertion hole, through which the protrusion is inserted so that the sleeve holder is coupled to the base plate.

Abstract: Disclosed herein is an assembly structure of a bearing and a holder of a brushless DC motor. The bearing is forcibly fitted into a hollow space formed through the holder. A beveled mouth edge is formed on the upper end of the circumferential inner surface of the holder through which the bearing enters the holder. Therefore, the assembly structure can enhance the workability of the process of assembling the bearing with the holder.

Abstract: The present invention is related to a semiconductor package and method for fabricating the same wherein the semiconductor package includes a die pad having a semiconductor die mounted thereto, and two or more sets of leads or I/O pads which extend at least partially about the die pad in spaced relation thereto and to each other. The formation of the die pad and the leads of the leadframe are facilitated by the completion of multiple plating and chemical etching processes in a prescribed sequence. The present invention is further related to a semiconductor package and method for fabricating the same wherein the semiconductor package includes a semiconductor die electrically connected a plurality of leads or I/O pads via a flip chip type connection, each of the leads being formed by the completion of multiple plating and chemical etching processes in a prescribed sequence.

Abstract: Disclosed is a lead frame and a semiconductor device including the same. The lead frame is provided with a die pad, and first, second and third lands sequentially arranged on an outer circumferential edge. The lead frame can separate the first and second lands or the die pad and the first land using a plating layer formed on the lead frame as a mask, instead of using a separate mask by etching after the application of the encapsulant. As a result thereof, a plurality of lands can be formed at low cost, in comparison with a conventional method. Additionally, the first, second and third lands are exposed to the outside through a lower portion of an encapsulant, and can be surface mounted on an external device through the first, second and third lands.

Abstract: A semiconductor light emitting device includes: first and second conductive type semiconductor layers; an active layer disposed between the first and second conductive type semiconductor layers; and first and second electrodes disposed on one surface of each of the first and second conductive type semiconductor layers, respectively, wherein at least one of the first and second electrodes includes a pad part and a finger part formed to extend from the pad part, and the end of the finger part has an annular shape. Because a phenomenon in which current is concentrated in a partial area of the finger part is minimized, tolerance to electrostatic discharge (ESD) can be strengthened and light extraction efficiency can be improved.

Abstract: A semiconductor light emitting device includes: a light emission structure in which a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer are sequentially stacked; a first electrode formed on the first conductive semiconductor layer; an insulating layer formed on the second conductive semiconductor layer and made of a transparent material; a reflection unit formed on the insulating layer and reflecting light emitted from the active layer; a second electrode formed on the reflection unit; and a transparent electrode formed on the second conductive semiconductor layer, the transparent electrode being in contact with the insulating layer and the second electrode.

Abstract: There is provided a motor formed to have a simple coupling structure between a base plate and a sleeve holder, thereby implementing a simple structure and reducing costs and processes taken for manufacturing the motor, and an optical disc drive using the same. To this end, the motor includes a base plate having at least one protrusion formed therein, and a sleeve holder having a body part, of which the shape is cylindrical and in which a sleeve is fitted, and a flange protrudingly formed from a lower end of the body part in such a manner as to make surface-to-surface contact with an upper surface of the base plate, wherein the flange is formed to have at least one insertion hole, through which the protrusion is inserted so that the sleeve holder is coupled to the base plate.

Abstract: There are provided a motor in which a coupling structure between a sleeve holder and a base plate is improved to thereby reduce manufacturing costs and manufacturing process of the motor, and to an optical disc drive using the same. The motor may include a base plate including at least one protrusion supporting part formed therein; and a sleeve holder including a cylindrical shaped body part to which a sleeve is fastened in an inside of the sleeve holder, an extension part protruded such that an outer diameter is extended along an outer circumferential surface of the body part, and a flange part vertically protruded in an outer diameter direction from a lower end portion of the extension part so as to make surface contact with an upper surface of the base plate, wherein the sleeve holder is fastened to the base plate while an outer circumferential surface of the protrusion supporting part is brought into contact with an inner circumferential surface of the extension part.

Abstract: There is provided a motor and an optical disc drive using the same, more particularly, a motor having an improved coupling structure between a rotor and a stator, and an optical disc drive using the same. The motor includes: a shaft; a sleeve supporting the shaft so as to be rotatable; a stator coupled to an outer circumferential surface of the sleeve and extended outwardly in an outer diameter direction of the sleeve; and a base plate coupled to the outer circumferential surface of the sleeve under the stator and supporting the stator.

Abstract: The present invention is related to a semiconductor package and method for fabricating the same wherein the semiconductor package includes a die pad having a semiconductor die mounted thereto, and two or more sets of leads or I/O pads which extend at least partially about the die pad in spaced relation thereto and to each other. The formation of the die pad and the leads of the leadframe are facilitated by the completion of multiple plating and chemical etching processes in a prescribed sequence. The present invention is further related to a semiconductor package and method for fabricating the same wherein the semiconductor package includes a semiconductor die electrically connected a plurality of leads or I/O pads via a flip chip type connection, each of the leads being formed by the completion of multiple plating and chemical etching processes in a prescribed sequence.

Abstract: A semiconductor light emitting device includes a substrate, a plurality of light emitting cells, a connection part, and a concavo-convex part. The light emitting cells are arrayed on the top surface of the substrate. Each of the light emitting cells has a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer that are sequentially stacked on the top surface of the substrate. The connection part is formed to connect the light emitting cells in series, parallel or series-parallel. The concavo-convex part is formed in at least one of the bottom surface of the substrate and the top surface of an isolation region between the light emitting cells.

Abstract: Disclosed herein is an assembly structure of a bearing and a holder of a brushless DC motor. The bearing is forcibly fitted into a hollow space formed through the holder. A beveled mouth edge is formed on the upper end of the circumferential inner surface of the holder through which the bearing enters the holder. Therefore, the assembly structure can enhance the workability of the process of assembling the bearing with the holder.

Abstract: Disclosed herein is an assembly structure of a bearing and a holder of a brushless DC motor. The bearing is forcibly fitted into a hollow space formed through the holder. A beveled mouth edge is formed on the upper end of the circumferential inner surface of the holder through which the bearing enters the holder. Therefore, the assembly structure can enhance the workability of the process of assembling the bearing with the holder.

Abstract: Disclosed is a motor. The motor includes a rotor case, a ring member mounted on the rotor case and including an encoder on a bottom surface thereof extending outside of the rotor case, and an encoder sensor detecting speed information of the rotor case from the encoder such that the rotor case rotates at low speeds enabling a LightScribe operation.

Abstract: A brushless DC motor. The motor includes a rotating shaft, a bearing rotatably supporting the rotating shaft in radial directions, a support holder made of a plastic material and supporting both the lower end of the rotating shaft and the outer circumferential surface of the bearing, a rotor casing having a rotor magnet therein and rotated along with the rotating shaft, a stator mounted to the outer circumferential surface of the support holder so as to face the rotor magnet and rotating the rotor casing by mutual cooperation with the rotor magnet in response to electricity applied from an external power source, and a plate, to which the support holder is locked using a locking screw. The brushless DC motor has a simple structure and reduces the material cost and assembly cost.

Abstract: A semiconductor package has an insulative layer having at least one channel formed on a first surface thereof. A conductive pattern conforming to the at least one channel and exposed to a bottom surface of the semiconductor package is formed. A semiconductor die is electrically connected to the conductive patterns. An encapsulant is used to at least partially filling the at least one channel.

Abstract: The present invention relates to a magnetic nanocomposite, a process for production thereof, a reusable protein-binding agent for separation of a protein including the magnetic nanocomposite, and a process for selective binding, separation and purification of a protein using the magnetic nanocomposite. In particular, the present invention is directed to a magnetic nanocomposite with a magnetic nanoparticle core of a magnetic nanoparticle, a silica shell coating said core, and a nanoparticle layer of a fourth period transition metal oxide, which coats said silica shell, a process for production of the magnetic nanocomposite, a reusable protein-binding agent the magnetic nanocomposite, and a process for selective binding, separation and purification of a protein using the magnetic nanocomposite.