Patents by Inventor Jae Yoon Um

Jae Yoon Um has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Scribe etch process for semiconductor laser chip manufacturing
    Patent number: 9356422
    Abstract: An improved scribe etch process for semiconductor laser chip manufacturing is provided. A method to etch a scribe line on a semiconductor wafer generally includes: applying a mask layer to a surface of the wafer; photolithographically opening a window in the mask layer along the scribe line; etching a trench in the wafer using a chemical etchant that operates on the wafer through the window opening, wherein the chemical etchant selectively etches through crystal planes of the wafer to generate a V-groove profile associated with the trench; and cleaving the wafer along the etched trench associated with the scribe line through application of a force to one or more regions of the wafer.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: May 31, 2016
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Klaus Alexander Anselm, Rajesh Bikky, Stephen Hu, Greg Pickrell, Nahid Sultana, Jae Yoon Um, Chia Chen David Wong
  • SCRIBE ETCH PROCESS FOR SEMICONDUCTOR LASER CHIP MANUFACTURING
    Publication number: 20150243558
    Abstract: An improved scribe etch process for semiconductor laser chip manufacturing is provided. A method to etch a scribe line on a semiconductor wafer generally includes: applying a mask layer to a surface of the wafer; photolithographically opening a window in the mask layer along the scribe line; etching a trench in the wafer using a chemical etchant that operates on the wafer through the window opening, wherein the chemical etchant selectively etches through crystal planes of the wafer to generate a V-groove profile associated with the trench; and cleaving the wafer along the etched trench associated with the scribe line through application of a force to one or more regions of the wafer.
    Type: Application
    Filed: February 26, 2014
    Publication date: August 27, 2015
    Applicant: Applied Optoelectronics, Inc.
    Inventors: Klaus Alexander Anselm, Rajesh Bikky, Stephen Hu, Greg Pickrell, Nahid Sultana, Jae Yoon Um, Chia Chen David Wong