Abstract: An electronic component and a mounting substrate thereof provide metal frames that reduce stress transmission while occupying only a limited mounting area. The electronic component includes a body, and first and second external electrodes respectively disposed on opposite ends of the body. A first metal frame includes a first support portion bonded to the first external electrode and a first mounting portion extending from a lower end of the first support portion toward the second external electrode. A second metal frame includes a second support portion bonded to the second external electrode and a second mounting portion extending form a lower end of the second support portion away from the first external electrode.

Abstract: An electronic component and a board having the same mounted thereon are provided. The electronic component includes: a body; an electrode disposed on an end of the body in a first direction; a metal frame including a support layer bonded to the external electrode, a mounting portion extending in the first direction in a lower end of the support layer and having a protruding portion on a lower surface, and a coating film formed to cover an upper surface of the protruding portion on an upper surface of the mounting portion and including titanium (Ti).

Abstract: An electronic component includes: a first frame, including a first support portion and a plurality of first extension portions, extended from the first support portion in a first direction; a second frame, including a second support portion disposed to face the first support portion and a plurality of second extension portions, extended from the second support portion in a second direction opposite to the first direction and disposed to alternate with and be spaced apart from the first extension portions in the first direction; and a plurality of capacitors disposed on first and second extension portions adjacent to each other by a predetermined interval so that first and second external electrodes are adhered thereto, respectively.

Abstract: An electronic component includes a body; external electrodes respectively disposed on opposing surfaces of the body in a first direction thereof; and a pair of metal frames connected to the external electrodes, respectively, in which each of the metal frames includes a support portion bonded to the external electrodes, and a mounting portion extending in the first direction from a lower end of the support portion and spaced apart from the body and the external electrodes, and a length of the mounting portion in a second direction perpendicular to the first direction is greater than a length of the body in the second direction.

Abstract: An electronic component is provided, and the electronic component includes: a capacitor array in which a plurality of multilayer capacitors are stacked, the plurality of multilayer capacitors including a body, and first and second external electrodes; first and second metal frames including first and second support portions bonded to the first and second external electrodes of the capacitor array, first and second mounting portions located below the first and second external electrodes and having first and second protrusions protruding downwardly, and first and second connection portions connecting the first and second support portions to the first and second mounting portions, respectively; and a capsule portion encapsulating the capacitor array to expose the first mounting portion of the first metal frame and the second mounting portion of the second metal frame, and having a lower surface provided with a plurality of protruding portions are formed at predetermined intervals.

Abstract: An electronic component and a board having the same mounted thereon are provided. The electronic component includes: a body; an electrode disposed on an end of the body in a first direction; a metal frame including a support layer bonded to the external electrode, a mounting portion extending in the first direction in a lower end of the support layer and having a protruding portion on a lower surface, and a coating film formed to cover an upper surface of the protruding portion on an upper surface of the mounting portion and including titanium (Ti).

Abstract: An electronic component and a mounting substrate thereof provide metal frames that reduce stress transmission while occupying only a limited mounting area. The electronic component includes a body, and first and second external electrodes respectively disposed on opposite ends of the body. A first metal frame includes a first support portion bonded to the first external electrode and a first mounting portion extending from a lower end of the first support portion toward the second external electrode. A second metal frame includes a second support portion bonded to the second external electrode and a second mounting portion extending form a lower end of the second support portion away from the first external electrode.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors disposed in a vertical direction, among the multilayer capacitors, adjacent multilayer capacitors including opposing external electrodes, including band portions bonded to each other, the external electrodes being disposed in such a manner that a band portion disposed on a bonding surface has an area relatively larger than an area of a band portion disposed on a further surface, and a pair of metal frames, each including a vertical portion bonded to a head portion of an external electrode of a lowermost multilayer capacitor and a mounting portion bent at a lower end of the vertical portion to extend.

Abstract: An electronic component includes: a capacitor body; an external electrode disposed on an end of the capacitor body in a first direction and containing copper (Cu) as a main component; a metal frame electrically connected to the external electrode; and a bonding member disposed between the external electrode and the metal frame. The bonding member includes a tin (Sn)-based solder layer; a tin-copper based alloy solder layer disposed between the tin-based solder layer and the external electrode; and a tin-based alloy solder layer disposed between the tin-based solder layer and the metal frame.

Abstract: A multilayer electronic component includes first and second frame terminals, and first and second electronic components. The first frame terminal includes a first side frame and a first bottom frame extended from a lower end of the first side frame. The second frame terminal includes a second side frame facing the first side frame and a second bottom frame extended from a lower end of the second side frame. The first electronic component is disposed between the first and second side frames, and the second electronic component is stacked on the first electronic component and disposed between the first and second side frames. Conductive adhesives are provided between the first and second side frames and the first and second electronic components, but a conductive adhesive is not formed between the first and second side frames and portions of the first electronic component close to a mounting surface.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors disposed in a vertical direction, among the multilayer capacitors, adjacent multilayer capacitors including opposing external electrodes, including band portions bonded to each other, the external electrodes being disposed in such a manner that a band portion disposed on a bonding surface has an area relatively larger than an area of a band portion disposed on a further surface, and a pair of metal frames, each including a vertical portion bonded to a head portion of an external electrode of a lowermost multilayer capacitor and a mounting portion bent at a lower end of the vertical portion to extend.

Abstract: An electronic component includes: a capacitor body; an external electrode disposed on an end of the capacitor body in a first direction and containing copper (Cu) as a main component; a metal frame electrically connected to the external electrode; and a bonding member disposed between the external electrode and the metal frame. The bonding member includes a tin (Sn)-based solder layer; a tin-copper based alloy solder layer disposed between the tin-based solder layer and the external electrode; and a tin-based alloy solder layer disposed between the tin-based solder layer and the metal frame.

Abstract: An electronic component includes a body; external electrodes respectively disposed on opposing surfaces of the body in a first direction thereof; and a pair of metal frames connected to the external electrodes, respectively, in which each of the metal frames includes a support portion bonded to the external electrodes, and a mounting portion extending in the first direction from a lower end of the support portion and spaced apart from the body and the external electrodes, and a length of the mounting portion in a second direction perpendicular to the first direction is greater than a length of the body in the second direction.

Abstract: An electronic component, a board having the same, and a method of manufacturing a metal frame for the electronic component. The electronic component includes a multilayer ceramic capacitor including a plurality of external electrodes formed on opposing surfaces of a capacitor body, respectively; and metal frames bonded to the external electrodes, respectively, wherein each of the metal frames includes an inner support portion, an outer support portion disposed on an outer surface of the inner support portion, and a connecting portion connecting portions of the inner support portion and the outer support portion to each other.

Abstract: An electronic component includes: a first frame, including a first support portion and a plurality of first extension portions, extended from the first support portion in a first direction; a second frame, including a second support portion disposed to face the first support portion and a plurality of second extension portions, extended from the second support portion in a second direction opposite to the first direction and disposed to alternate with and be spaced apart from the first extension portions in the first direction; and a plurality of capacitors disposed on first and second extension portions adjacent to each other by a predetermined interval so that first and second external electrodes are adhered thereto, respectively.

Abstract: An electronic component is provided to include: a capacitor array having a structure in which a plurality of capacitors are arranged; a pair of metal frames disposed on side surfaces of the capacitor array, connected to external electrodes of the plurality of capacitors, and including penetration portions formed in positions in which the pair of metal frames are connected to the external electrodes; and a plating member filling the penetration portions. A manufacturing method thereof is further provided.

Abstract: A multilayer electronic component includes first and second frame terminals, and first and second electronic components. The first frame terminal includes a first side frame and a first bottom frame extended from a lower end of the first side frame. The second frame terminal includes a second side frame facing the first side frame and a second bottom frame extended from a lower end of the second side frame. The first electronic component is disposed between the first and second side frames, and the second electronic component is stacked on the first electronic component and disposed between the first and second side frames. Conductive adhesives are provided between the first and second side frames and the first and second electronic components, but a conductive adhesive is not formed between the first and second side frames and portions of the first electronic component close to a mounting surface.

Abstract: An electronic component is provided to include: a capacitor array having a structure in which a plurality of capacitors are arranged; a pair of metal frames disposed on side surfaces of the capacitor array, connected to external electrodes of the plurality of capacitors, and including penetration portions formed in positions in which the pair of metal frames are connected to the external electrodes; and a plating member filling the penetration portions. A manufacturing method thereof is further provided.

Abstract: An electronic component, a board having the same, and a method of manufacturing a metal frame for the electronic component. The electronic component includes a multilayer ceramic capacitor including a plurality of external electrodes formed on opposing surfaces of a capacitor body, respectively; and metal frames bonded to the external electrodes, respectively, wherein each of the metal frames includes an inner support portion, an outer support portion disposed on an outer surface of the inner support portion, and a connecting portion connecting portions of the inner support portion and the outer support portion to each other.

Abstract: In accordance with the present invention, there is provided multiple embodiments of a reduced size stackable semiconductor package. In a basic embodiment of the present invention, the semiconductor package comprises a bulk layer having at least one first bond pad formed therein. At least one active layer is formed on the bulk layer and electrically coupled to the first bond pad. Additionally, at least one second bond pad is formed on the active layer and is electrically coupled thereto. A protection layer is formed on that surface of the active layer having the second bond pad formed thereon, the protection layer also partially encapsulating the second bond pad. In other embodiments of the present invention, the above-described semiconductor package is provided in a stacked arrangement and in a prescribed pattern of electrical communication with one or more additional, identically configured semiconductor packages.