Abstract: Provided is an optical Printed Circuit Board (PCB). The PCB includes: an insulation layer; an optical waveguide filled in the insulation layer; and an optical device buried in the insulation layer and disposed on the same plane as the optical waveguide.

Abstract: Provided is an optical Printed Circuit Board (PCB). The PCB includes: an insulation layer; an optical waveguide filled in the insulation layer; and an optical device buried in the insulation layer and disposed on the same plane as the optical waveguide.

Abstract: The present invention relates to a double-sided flexible printed circuit board in which circuit patterns are formed, including an insulating substrate, conduction layers sputtered on both sides of the insulating substrate, a through hole formed to connect circuits formed in the both sides, seed layers formed on the conduction layers of the both sides, and pattern plating layers formed on an inner wall of the through hole and on the respective seed layers, and a method of manufacturing the same. Accordingly, the loss of a circuit width can be minimized because a sputtering-type material not an adhesive is used between the insulating substrate and the thin copper (Cu) layer. Further, productivity can be improved because a roll-to-roll process can be used. In addition, the thickness of a circuit can be controlled and micro circuit patterns can be formed because a semi-additive method is used.