Abstract: An electronic device is provided. The electronic device includes an outer housing that comprises a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a side surface surrounding a space between the first surface and the second surface, a display adapted to expose at least a portion of the display through the first surface of the outer housing, a PCB arranged between the second surface and the display in an interior of the outer housing, a communication circuit arranged on or over the PCB, a first conductive structure formed of at least one of the first surface or at least a portion of the side surface is electrically connected to the communication circuit, and a second conductive structure formed of the portion of the display electrically connected to the first conductive structure.

Abstract: Provided are an optical module, and an optical printed circuit board and a method of manufacturing the same. The optical module includes an optical fiber, a first ferrule coupled to one end of the optical fiber, and a second ferrule coupled to the other end of the optical fiber. The optical printed circuit board includes a first board, an optical transmitter module and an optical receiver module, which are disposed on the first board, an optical fiber passing through the first board, the optical fiber extending integrally from a lower side of the optical transmitter module to a lower side of the optical receiver module, first and second ferrules coupled to one end and the other end of the optical fiber, respectively, the first and second ferrules being supported by the first board, and a second board through which the optical fiber passes, the second board being disposed below the first board.

Abstract: An optical printed circuit board is provided. The optical printed circuit board includes an insulation member, an optical fiber disposed in the insulation member and having opposite end portions exposed to a side of the insulation member, and at least one supporting member provided with a guide portion coupled to the opposite end portions of the optical fiber and guiding bending of the optical fiber.

Abstract: The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.

Abstract: An optical printed circuit board (PCB) and a method of fabricating the same wherein the optical PCB is mounted with an alignment pattern area whose particular area of an integral optical connection module embedded in the optical PCB is exposed, and the alignment pattern area is formed with a sill lower than a surface of the optical PCB, whereby a transmission/reception module automatically aligned via the alignment pattern area is eased to increase the alignment accuracy between an optical connection module and the transmission/reception module and to increase the efficiency of alignment.

Abstract: Provided are an optical printed circuit board and a method for manufacturing the same. The optical printed circuit board includes a printed circuit board and an optical connecting module. The printed circuit board is provided with at least one or more inner layers, and a circuit pattern electrically connecting the inner layers. The optical connecting module is embedded in the printed circuit board and includes an optical transmitting portion, an optical receiving portion, and an optical waveguide connecting the optical transmitting portion and the optical receiving portion. The printed circuit board defines an align pattern region, such that tops of the optical transmitting portion and the optical receiving portion are formed lower than a surface of the printed circuit board.

Abstract: Disclosed are an embedded capacitor and a method of fabricating the same. The capacitor includes a metallic substrate, a metallic oxide layer on the metallic substrate, a first electrode layer on a first surface of the metallic oxide layer, and a second electrode layer on a second surface of the metallic oxide layer.

Abstract: The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.

Abstract: Provided is a method of manufacturing a printed circuit board including, disposing first and second insulating members and first and second conductive films on both sides of a separating member to perform a thermocompression bonding process on the first and second insulating members and the first and second conductive films on the both sides of the separating member, so as to attach the first member to the second member with the separating member therebetween and attach the first insulating member to the first conductive film and attach the second insulating member to the second conductive film, selectively removing the first and second conductive films to form first and second circuit patterns, and cutting the separating member and the first and second insulating members to separate the first and second insulating members with the first and second circuit patterns from the separating member.

Abstract: Disclosed is a printed circuit board including an insulation member on which a first region and a second region are defined, a circuit pattern formed on the first region, and a support member formed on the second region.

Abstract: Provided are a photovoltaic apparatus and a manufacturing method thereof. The photovoltaic apparatus includes: substrate; a back electrode layer disposed on the substrate; a plurality of first intermediate layers disposed on the back electrode layer; a plurality of second intermediate layers disposed on the back electrode layer and each disposed between the first intermediate layers; light absorbing layers disposed on the first intermediate layers and the second intermediate layers; and a front electrode layer disposed on the light absorbing layer.

Abstract: Provided are an optical printed circuit board and a method for manufacturing the same. The optical printed circuit board includes a printed circuit board and an optical connecting module. The printed circuit board is provided with at least one or more inner layers, and a circuit pattern electrically connecting the inner layers. The optical connecting module is embedded in the printed circuit board and includes an optical transmitting portion, an optical receiving portion, and an optical waveguide connecting the optical transmitting portion and the optical receiving portion. The printed circuit board defines an align pattern region, such that tops of the optical transmitting portion and the optical receiving portion are formed lower than a surface of the printed circuit board.

Abstract: A liquid crystal panel includes a first type pixel and a second type pixel that are formed adjacent to each-other. The first type pixel has a first layout of respective first and second sub-pixels, and the second type pixel has a second layout of respective first and second sub-pixels. The first layout is different from the second layout such that the liquid crystal panel is driven according to dot inversion with alternating first and second sub-pixels determining the image displayed on the liquid crystal panel for preventing vertical faults.

Abstract: The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.

Abstract: Provided are an optical module, and an optical printed circuit board and a method of manufacturing the same. The optical module includes an optical fiber, a first ferrule coupled to one end of the optical fiber, and a second ferrule coupled to the other end of the optical fiber. The optical printed circuit board includes a first board, an optical transmitter module and an optical receiver module, which are disposed on the first board, an optical fiber passing through the first board, the optical fiber extending integrally from a lower side of the optical transmitter module to a lower side of the optical receiver module, first and second ferrules coupled to one end and the other end of the optical fiber, respectively, the first and second ferrules being supported by the first board, and a second board through which the optical fiber passes, the second board being disposed below the first board.

Abstract: An optical printed circuit board is provided. The optical printed circuit board includes an insulation member, an optical fiber disposed in the insulation member and having opposite end portions exposed to a side of the insulation member, and at least one supporting member provided with a guide portion coupled to the opposite end portions of the optical fiber and guiding bending of the optical fiber.

Abstract: Disclosed are an embedded capacitor and a method of fabricating the same. The capacitor includes a metallic substrate, a metallic oxide layer on the metallic substrate, a first electrode layer on a first surface of the metallic oxide layer, and a second electrode layer on a second surface of the metallic oxide layer.

Abstract: Disclosed is a printed circuit board including an insulation member on which a first region and a second region are defined, a circuit pattern formed on the first region, and a support member formed on the second region.

Abstract: Provided is a method of manufacturing a printed circuit board including, disposing first and second insulating members and first and second conductive films on both sides of a separating member to perform a thermocompression bonding process on the first and second insulating members and the first and second conductive films on the both sides of the separating member, so as to attach the first member to the second member with the separating member therebetween and attach the first insulating member to the first conductive film and attach the second insulating member to the second conductive film, selectively removing the first and second conductive films to form first and second circuit patterns, and cutting the separating member and the first and second insulating members to separate the first and second insulating members with the first and second circuit patterns from the separating member.

Abstract: A liquid crystal panel includes a first type pixel and a second type pixel that are formed adjacent to each-other. The first type pixel has a first layout of respective first and second sub-pixels, and the second type pixel has a second layout of respective first and second sub-pixels. The first layout is different from the second layout such that the liquid crystal panel is driven according to dot inversion with alternating first and second sub-pixels determining the image displayed on the liquid crystal panel for preventing vertical faults.