Abstract: A wafer inspection apparatus includes a linear stage configured to support a chuck on which a wafer is disposed and to move the chuck along a guide rail, wherein the guide rail extends in a first direction, an image sensor module overlapping the linear stage, and a rotary stage supported by the linear stage. The rotary stage is configured to rotate the chuck in a state where a center of the wafer is aligned with the image sensor module. The image sensor module includes a light source directing light onto the wafer, and an image sensor extending in a second direction crossing the first direction.

Abstract: A wafer inspection apparatus includes a linear stage configured to support a chuck on which a wafer is disposed and to move the chuck along a guide rail, wherein the guide rail extends in a first direction, an image sensor module overlapping the linear stage, and a rotary stage supported by the linear stage. The rotary stage is configured to rotate the chuck in a state where a center of the wafer is aligned with the image sensor module. The image sensor module includes a light source directing light onto the wafer, and an image sensor extending in a second direction crossing the first direction.

Abstract: A position measurement device includes a light source, a reflector coupled to a test object, a light detector between the light source and reflector, and a controller to measure a position of the test object based on an interference pattern generated by a reference beam and a measurement beam output from the light detector. The controller also controls a temperature of the light detector by generating signals for a heat exchanger having a Peltier region coupled to the light detector. The signals including a first signal to cause the heat exchanger to remove heat from the light receiver and a second signal to cause the heat exchanger to apply heat to the light receiver.