Patents by Inventor Jae-Choon Lee

Jae-Choon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12543787
    Abstract: A heater for a cigarette-like electronic cigarette and a method of manufacturing the heater are provided. The heater is provided with a heat transfer efficiency improved by strengthening a bonding force between a cigarette support portion and a heater portion by thermally pressing and bonding the cigarette support portion and the heater portion together using a heat-dissipating adhesive layer with a heat-dissipating filler added to a high-heat-resistant thermoplastic polyimide resin.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: February 10, 2026
    Assignee: LATTRON CO. LTD.
    Inventors: Jae-choon Lee, Choung-Kook Lee, Young-seong Wang
  • Publication number: 20220079238
    Abstract: Provided is a heater for a ciga-like electronic cigarette with a heat transfer efficiency improved by strengthening a bonding force between a cigarette support portion and a heater portion by thermally pressing and bonding the cigarette support portion and the heater portion together using a heat-dissipating adhesive layer with a heat-dissipating filler added to a high-heat-resistant thermoplastic polyimide resin, and a method of manufacturing the same.
    Type: Application
    Filed: November 14, 2019
    Publication date: March 17, 2022
    Inventors: Jae-choon LEE, Choung-Kook LEE, Young-seong WANG
  • Patent number: 6876171
    Abstract: A driving apparatus of a three-phase induction motor includes: a three-phase power supply unit for supplying three-phase power; a rectifier for rectifying the three phase voltage supplied from the three phase power supply unit; a voltage reducing unit for reducing a DC voltage generated from the rectifier and outputting a stabilized DC voltage; and an inverter unit for varying the DC voltage outputted from the voltage reducing unit to a three-phase AC voltage and driving a three-phase induction motor. A power-factor degradation generated during supplying a DC voltage to the inverter to drive the three-phase induction motor is prevented, a harmonic wave is removed, and because a high-priced inverter component is not necessary, its relevant expense is reduced.
    Type: Grant
    Filed: April 16, 2003
    Date of Patent: April 5, 2005
    Assignee: LG Electronics
    Inventor: Jae-Choon Lee
  • Publication number: 20040075414
    Abstract: A driving apparatus of a three-phase induction motor includes: a three-phase power supply unit for supplying three-phase power; a rectifier for rectifying the three phase voltage supplied from the three phase power supply unit; a voltage reducing unit for reducing a DC voltage generated from the rectifier and outputting a stabilized DC voltage; and an inverter unit for varying the DC voltage outputted from the voltage reducing unit to a three-phase AC voltage and driving a three-phase induction motor. A power-factor degradation generated during supplying a DC voltage to the inverter to drive the three-phase induction motor is prevented, a harmonic wave is removed, and because a high-priced inverter component is not necessary, its relevant expense is reduced.
    Type: Application
    Filed: April 16, 2003
    Publication date: April 22, 2004
    Applicant: LG ELECTRONICS INC.
    Inventor: Jae-Choon Lee
  • Publication number: 20010009504
    Abstract: A one system module in which a ceramic PCB and an epoxy PCB are disposed inside a module body and a power element and a signal element are respectively mounted at the upper portion of each PCB, wherein a groove is made at the lower side surface and at the middle side surface of the module body to support the ceramic PCB and the epoxy PCB formed in a two-story structure, and a power pin for receiving a power signal from an external source is mounted on the ceramic PCB and a signal pin for receiving various signals from an external source is mounted on the epoxy PCB. With this one system module, the ceramic PCB and the epoxy PCB can be firmly supported by the groove made on the module body. And, since the power pin and the signal pin are separately disposed on the two PCBs, use of the socket is reduced, so that the area utility of the PCB is increased as well as acquiring a compact module.
    Type: Application
    Filed: January 19, 2001
    Publication date: July 26, 2001
    Inventors: Jae-Choon Lee, Min-Kyu Hwang