Patents by Inventor JAEGYU CHOI

JAEGYU CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250231846
    Abstract: A storage device including: a nonvolatile memory; and a controller configured to control the nonvolatile memory, wherein the controller is configured to: obtain authority to access an external memory, wherein the external memory is allocated by an external host device; receive a test scenario, which includes a plurality of commands, from the external host device; read a first test code corresponding to a first test check point from the external memory when the first test check point arrives while the test scenario is executed; and execute the first test code.
    Type: Application
    Filed: July 25, 2024
    Publication date: July 17, 2025
    Inventors: WONCHOL KIM, JAEGYU CHOI, TAE-YONG KIM, JIWON PARK
  • Patent number: 12130306
    Abstract: A module substrate for a semiconductor module includes: a wiring substrate having an upper surface and a lower surface opposite to the upper surface, wherein the wiring substrate includes a circuit wiring and a plurality of via holes extending from the upper surface to the lower surface in a thickness direction; a plurality of test terminals respectively provided on the via holes and electrically connected to the circuit wiring, and a fastening thin film provided on the wiring substrate and covering the via holes, wherein the fastening thin film has a predetermined thickness such that a portion of the fastening thin film is penetrated when an interface is pin is inserted into the portion of the fastening thin film through the via hole from the upper surface, and the portion of the penetrated fastening thin film holds the penetrating interface inspection pin.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: October 29, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kwangkyu Bang, Kiljoong Yun, Yun Chang, Jaegyu Choi
  • Publication number: 20240330158
    Abstract: An electronic device includes: a memory in which software code, including a plurality of test positions is loaded; and a processor configured to execute the software code in order according to a control flow, wherein the processor is configured to allocate a test coverage data region in the memory, execute the software code based on a test scenario, when an execution position reaches a target test position among the plurality of test positions, mark a memory position corresponding to the target test position in the test coverage data region in response to a test coverage marking instruction associated with the target test position, and output test coverage data of the test coverage data region in response to an external command.
    Type: Application
    Filed: December 12, 2023
    Publication date: October 3, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Wonchol KIM, Taeyong KIM, Jiwon PARK, Moonwook OH, Jaegyu CHOI
  • Publication number: 20240289026
    Abstract: Embodiments provide a power loss protection (PLP) module that is connected to a first storage device to perform a PLP operation for the first storage device, including: a volatile memory that stores data according to commands of a host; a non-volatile memory that receives and stores data of the volatile memory when the first storage device becomes inaccessible; a capacitor module that supplies a voltage to the volatile memory and the non-volatile memory when the first storage device becomes inaccessible; and a controller that controls operations of the volatile memory, the non-volatile memory, and the capacitor module.
    Type: Application
    Filed: September 13, 2023
    Publication date: August 29, 2024
    Inventors: EOK SOO SHIM, DONGJIN LIM, JAEGYU CHOI
  • Patent number: 12038473
    Abstract: A test socket includes: a first body including a fixing portion configured to receive a sample having a plurality of test terminals; a second body facing the first body and coupled with the first body such that the second body rotates relative to the first body about a hinge pin; a test board provided on the second body and configured to test the sample, wherein the test board has a plurality of first openings provided therein; and a plurality of interface pins penetrating through the first openings, wherein each of the plurality of interface pins includes a contact pin and a spring, wherein the contact pin is provided in a first end portion of each of the plurality of interface pin and is configured to come into contact with a test terminal of the plurality of test terminals, and the spring elastically supports the contact pin.
    Type: Grant
    Filed: May 6, 2022
    Date of Patent: July 16, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kiljoong Yun, Kwangkyu Bang, Yun Chang, Jaegyu Choi
  • Patent number: 12019485
    Abstract: A storage device testing module includes a plate and a test board disposed on the plate and including a storage device receiver, the storage device receiver receiving a storage device to be tested. The storage device testing module further includes a sensor including a plurality of switches disposed on an inner surface of the storage device receiver, the plurality of switches being activated by movement of the storage device into the storage device receiver. The storage device testing module further includes a plurality of plungers disposed on the inner surface, contacting and supporting the storage device.
    Type: Grant
    Filed: May 2, 2022
    Date of Patent: June 25, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yun Chang, Sanggeun Yoo, Kwangkyu Bang, Kiljoong Yun, Songrye Choi, Jaegyu Choi
  • Publication number: 20230213554
    Abstract: A module substrate for a semiconductor module includes: a wiring substrate having an upper surface and a lower surface opposite to the upper surface, wherein the wiring substrate includes a circuit wiring and a plurality of via holes extending from the upper surface to the lower surface in a thickness direction; a plurality of test terminals respectively provided on the via holes and electrically connected to the circuit wiring, and a fastening thin film provided on the wiring substrate and covering the via holes, wherein the fastening thin film has a predetermined thickness such that a portion of the fastening thin film is penetrated when an interface is pin is inserted into the portion of the fastening thin film through the via hole from the upper surface, and the portion of the penetrated fastening thin film holds the penetrating interface inspection pin.
    Type: Application
    Filed: August 10, 2022
    Publication date: July 6, 2023
    Inventors: Kwangkyu BANG, Kiljoong YUN, Yun CHANG, Jaegyu CHOI
  • Publication number: 20230098635
    Abstract: A test socket includes: a first body including a fixing portion configured to receive a sample having a plurality of test terminals; a second body facing the first body and coupled with the first body such that the second body rotates relative to the first body about a hinge pin; a test board provided on the second body and configured to test the sample, wherein the test board has a plurality of first openings provided therein; and a plurality of interface pins penetrating through the first openings, wherein each of the plurality of interface pins includes a contact pin and a spring, wherein the contact pin is provided in a first end portion of each of the plurality of interface pin and is configured to come into contact with a test terminal of the plurality of test terminals, and the spring elastically supports the contact pin.
    Type: Application
    Filed: May 6, 2022
    Publication date: March 30, 2023
    Inventors: Kiljoong YUN, Kwangkyu Bang, Yun Chang, Jaegyu Choi
  • Publication number: 20230087045
    Abstract: A storage device testing module includes a plate and a test board disposed on the plate and including a storage device receiver, the storage device receiver receiving a storage device to be tested. The storage device testing module further includes a sensor including a plurality of switches disposed on an inner surface of the storage device receiver, the plurality of switches being activated by movement of the storage device into the storage device receiver. The storage device testing module further includes a plurality of plungers disposed on the inner surface, contacting and supporting the storage device.
    Type: Application
    Filed: May 2, 2022
    Publication date: March 23, 2023
    Inventors: YUN CHANG, SANGGEUN YOO, KWANGKYU BANG, KILJOONG YUN, SONGRYE CHOI, JAEGYU CHOI