Abstract: A nonvolatile memory device including a mold structure including a plurality of gate electrodes on a substrate, the plurality of gate electrodes including first, second, and third string selection lines sequentially stacked on the substrate; a channel structure that penetrates the mold structure and intersects each of the gate electrodes; a first cutting region that cuts each of the gate electrodes; a second cutting region that is spaced apart from the first cutting region in a first direction and cuts each of the gate electrodes; a first cutting line that cuts the first string selection line between the first cutting region and the second cutting region; a second cutting line that cuts the second string selection line between the first cutting region and the second cutting region; and a third cutting line that cuts the third string selection line between the first cutting region and the second cutting region.

Abstract: An embodiment of the present specification discloses a display device including a display panel including a display area and a non-display area adjacent to the display area and a metal dam disposed in the non-display area to surround at least three surfaces of the display panel. The display panel includes a substrate, a pixel driving circuit disposed on the substrate, and a light emitting element driven by the pixel driving circuit, the metal dam may be spaced a selected distance from an edge of the display panel, the metal dam may be formed of a plurality of metal layers connected through at least one hole, and the metal dam may include a first metal dam, a second metal dam, and a third metal dam that are disposed in the non-display area while surrounding at least three surfaces of the display area.

Abstract: A bronchoscopy simulator includes: a main body part which is formed to be similar to the bronchial tree of the human body; and a bleeding producing part which is provided on the main body part to create a situation where bleeding occurs bronchial tree inside the main body part, thereby enabling practice of a response process for bleeding situations occurring during bronchoscopy. A control method for the bronchoscope simulator, includes: a bleeding occurrence step in which bleeding occurs inside a main body part by a bleeding simulation part; and a bleeding stop step, after hemostasis responding to the bleeding is performed, in which the bleeding is stopped by the bleeding simulation part.

Abstract: A manufacturing method of a bronchoscopy simulator, includes: a base part printing step in which a base part is printed by a 3D printer; a plastic dipping step in which plastic dipping is applied to the outside of the base part; a through-hole forming step in which a through-hole is formed in the base part; and a liquid passing step in which liquid passes through the through-hole to melt away only the base part while leaving the plastic dipping intact.

Abstract: A display apparatus according to an exemplary embodiment is disclosed. A display apparatus according to an exemplary embodiment includes a substrate having a bending region between an active area and a pad area. The display apparatus includes a planarization film on the active area and the pad area in the substrate. The display apparatus includes a first organic film coated on the planarization film, a second organic film coated on the first organic film, and a third organic film coated on the second organic film. The third organic film is formed such that an upper surface thereof is flattened in the active region. The display apparatus includes a plurality of light-emitting elements disposed on the third organic film.

Abstract: A mother substrate for a display panel and a display panel using the same are disclosed. A mother substrate for a display panel includes a conductive ring disposed in a non-display area outside the display area and surrounding each of the display areas, and one or more dummy pixel driving circuits disposed in a non-display area outside the display area. An electrostatic discharge (ESD) prevention structure inside the dummy pixel driving circuit can prevent defects of display panels due to ESD occurring in the manufacturing process of the display panel.

Abstract: An embodiment discloses a display apparatus. The display apparatus includes a plurality of first electrodes and a contact electrode disposed on a substrate. The display apparatus includes a plurality of light-emitting elements disposed on the plurality of first electrodes. The display apparatus includes a first optical layer disposed between the plurality of light-emitting elements. The display apparatus includes a second electrode disposed on the plurality of light-emitting elements. The second electrode includes a first area disposed on the plurality of light-emitting elements and a second area extending outward from the first optical layer and electrically connected to the contact electrode. A plurality of signal wires connected to the plurality of first electrodes are provided, the second area of the second electrode comprises protruding portions extending to at least one of areas between the plurality of signal wires, and one of the protruding portions is connected to the contact electrode.

Abstract: A display device includes a plurality of first electrodes and a contact electrode on a substrate; a plurality of light-emitting elements on the plurality of first electrodes; a first optical layer between the plurality of light-emitting elements; and a second electrode on the plurality of light-emitting elements, the second electrode including a first region that is on the plurality of light-emitting elements and a second region that extends past an end the first optical layer and is in contact with the contact electrode.

Abstract: A mother substrate for a display panel and a display panel using the same are disclosed. The mother substrate comprises a plurality of display area including a plurality of light-emitting areas configured to receive light-emitting elements, a plurality of wirings, and a plurality of pads connected to the plurality of wirings; a conductive ring in a non-display area that surrounds the display area such that each of the display areas is surrounded by the conductive ring and electrically connected to the pads; a photoresist pattern covering the plurality of display areas and the non-display area; and a first metal layer covering the photoresist pattern. The conductive ring includes an electrostatic blocking area.

Abstract: A display device includes a display panel including a first surface which displays images and a second surface opposite to the first surface, a supporter disposed on the second surface of the display panel, a roller to which a first end of the display panel and a first end of the supporter are connected and on which the display panel and the supporter are wound, a first case to which a second end of the display panel opposite to the first end of the display panel is connected, a second case which is disposed on the first case and to which an end of the roller is connected, and an elasticity member connected between the first case and the second case, where the second case and the first case at least partly overlap each other and slide.

Abstract: A three-dimensional semiconductor device includes a first gate group on a lower structure and a second gate group on the first gate group. The first gate group includes first pad regions that are: (1) lowered in a first direction that is parallel to an upper surface of the lower structure and (2) raised in a second direction that is parallel to an upper surface of the lower structure and perpendicular to the first direction. The second gate group includes second pad regions that are sequentially raised in the first direction and raised in the second direction.

Abstract: A nonvolatile memory device including a substrate extending in a first direction, a ground selection line extending in the first direction on the substrate, a plurality of word lines stacked sequentially on the ground selection line and extending in the first direction, a landing pad spaced apart from the ground selection line and the plurality of word lines in the first direction, a rear contact plug connected to a lower face of the landing pad and extending in a second direction intersecting the first direction, a front contact plug connected to an upper face of the landing pad opposite the lower face and extending in the second direction, an input/output pad electrically connected to the rear contact plug, and an upper bonding pad electrically connected to the front contact plug and connected to at least a part of a plurality of circuit elements of the nonvolatile memory device.

Abstract: A display device includes: a first module including a first housing and a first roller portion; a plurality of support portions having first end portions fixed to the first roller portion and extending in a first direction; a display panel disposed to overlap the support portions and including a first surface and a second surface opposite to the first surface; and a second module including a second housing to which second end portions of the support portions are fixed. The support portions are disposed on the second surface, the support portions include a first support portion, and a second support portion spaced apart from the first support portion in a second direction intersecting the first direction, the first support portion includes a concave pattern concave in a direction facing the second surface, and the second support portion includes a convex pattern convex in the direction facing the second surface.

Abstract: A method may include detecting a transfer event for loading articles within a wash chamber of the washing machine appliance. The method may also include transmitting a push notification to a remote device spaced apart from the washing machine appliance in response to detecting the transfer event. The push notification may prompt an image capture event at the remote device.

Abstract: A semiconductor memory device comprising: a first semiconductor chip including an upper input/output pad, a second semiconductor chip including a lower input/output pad, and a substrate attachment film attaching the first and second semiconductor chips. The first and second semiconductor chips each include a first substrate including a first side facing the substrate attachment film and a second side, a mold structure including gate electrodes, a channel structure penetrating the mold structure and intersecting the gate electrodes, a second substrate including a third side facing the first side and a fourth side, a first circuit element on the third side of the second substrate, and a contact via penetrating the first substrate and connected to the first circuit element. The upper and lower input/output pads are on the second sides of the first and second semiconductor chip, respectively, and contact the contact vias of the first and second semiconductor chips.

Abstract: A nonvolatile memory device including a substrate extending in a first direction, a ground selection line extending in the first direction on the substrate, a plurality of word lines stacked sequentially on the ground selection line and extending in the first direction, a landing pad spaced apart from the ground selection line and the plurality of word lines in the first direction, a rear contact plug connected to a lower face of the landing pad and extending in a second direction intersecting the first direction, a front contact plug connected to an upper face of the landing pad opposite the lower face and extending in the second direction, an input/output pad electrically connected to the rear contact plug, and an upper bonding pad electrically connected to the front contact plug and connected to at least a part of a plurality of circuit elements of the nonvolatile memory device.

Abstract: A domestic appliance may include a cabinet and a controller mounted to the cabinet. The controller may be configured to direct a diagnostic operation that includes receiving a dense diagnostic signal, transmitting historical use data from a plurality of historical memory slots from the controller of the domestic appliance, clearing the historical use data from the plurality of historical memory slots following transmitting historical use data, designating the plurality of historical memory slots as a unified logging slot for a single diagnostic cycle following clearing, initiating the single diagnostic cycle at the domestic appliance to collect single-cycle data within the unified logging slot, and transmitting the collected single-cycle data from the controller of the domestic appliance.

Abstract: A three-dimensional semiconductor device includes a first gate group on a lower structure and a second gate group on the first gate group. The first gate group includes first pad regions that are: (1) lowered in a first direction that is parallel to an upper surface of the lower structure and (2) raised in a second direction that is parallel to an upper surface of the lower structure and perpendicular to the first direction. The second gate group includes second pad regions that are sequentially raised in the first direction and raised in the second direction.

Abstract: A semiconductor memory device comprising: a first semiconductor chip including an upper input/output pad, a second semiconductor chip including a lower input/output pad, and a substrate attachment film attaching the first and second semiconductor chips. The first and second semiconductor chips each include a first substrate including a first side facing the substrate attachment film and a second side, a mold structure including gate electrodes, a channel structure penetrating the mold structure and intersecting the gate electrodes, a second substrate including a third side facing the first side and a fourth side, a first circuit element on the third side of the second substrate, and a contact via penetrating the first substrate and connected to the first circuit element. The upper and lower input/output pads are on the second sides of the first and second semiconductor chip, respectively, and contact the contact vias of the first and second semiconductor chips.

Abstract: A three-dimensional semiconductor device includes a first gate group on a lower structure and a second gate group on the first gate group. The first gate group includes first pad regions that are: (1) lowered in a first direction that is parallel to an upper surface of the lower structure and (2) raised in a second direction that is parallel to an upper surface of the lower structure and perpendicular to the first direction. The second gate group includes second pad regions that are sequentially raised in the first direction and raised in the second direction.