Patents by Inventor Jae Ho Baik

Jae Ho Baik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11947089
    Abstract: An optical imaging system includes a first lens having an image-side surface that is concave; a second lens having a refractive power; a third lens having an object-side surface that is convex; a fourth lens having an image-side surface that is concave; a fifth lens having a refractive power; and a sixth lens having a refractive power and an image-side surface having an inflection point, wherein the first lens through the sixth lens are sequentially disposed in numerical order from an object side of the optical imaging system toward an imaging plane of the optical imaging system, and the optical imaging system satisfies TL/(2Y)?1.01 and 1.2?tan ?, where TL is a distance from an object-side surface of the first lens to the imaging plane, 2Y is a diagonal length of the imaging plane, and ? is half a field of view of the optical imaging system.
    Type: Grant
    Filed: March 6, 2023
    Date of Patent: April 2, 2024
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Youn Lee, Jae Hyun Baik, Yong Joo Jo, Phil Ho Jung
  • Publication number: 20230012973
    Abstract: A camera module is provided. The camera module includes a carrier; a lens holder accommodated in the carrier; an optical image stabilization (OIS) cover coupled to the carrier and disposed on the lens holder; and first buffer members coupled to the OIS cover, wherein a distance between the lens holder and the first buffer member is less than a distance between the lens holder and the OIS cover.
    Type: Application
    Filed: June 24, 2022
    Publication date: January 19, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soo Cheol LIM, Sang Hun HAN, Jae Ho BAIK, Ik Sun LEE
  • Patent number: 10459493
    Abstract: An electronic device according to one embodiment may include: a first housing including a first side; a second housing including a second side facing the first side; at least one first magnetic member configured to be rotatably disposed inside the first housing and adjacent to the first side; and at least one second magnetic member configured to be rotatably disposed inside the second housing and adjacent to the second side, wherein the first housing and the second housing are rotatably coupled to each other by a magnetic force between the at least one first magnetic member and the at least one second magnetic member. Various other embodiments are also possible.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: October 29, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-Won Lee, Jang-Woon Kim, Chung-Ha Kim, Jae-Ho Baik, Hyun-Keun Son, Seung-Ho Jang
  • Patent number: 10194062
    Abstract: A camera module may include a lens barrel supporting a lens, a frame in which the lens barrel is provided, and a housing accommodating the frame. The frame may be pressed toward one surface of the housing to thereby be relatively aligned in the housing so that an optical axis of the lens is positioned perpendicularly with respect to an image formation surface of an image sensor.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: January 29, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Hoon Kim, Po Chul Kim, Jung Seok Lee, Jae Ho Baik
  • Patent number: 10171636
    Abstract: An electronic device is provided. The electronic device includes a housing including a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a side surface extending between and along a perimeter of the first surface and the second surface, a cover glass corresponding to at least the first surface, a display panel disposed under the cover glass and including an active area exposed through the cover glass, an inactive area surrounding the active area, and a printed circuit board connection portion connected to one end of the inactive area, wherein at least one opening or at least one cutaway portion is formed in the display panel, and a camera module disposed in a space formed by the at least one opening or the at least one cutaway portion and exposed through the cover glass.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: January 1, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Jung Hee Yeo, Kuk Hwan Kim, Dong Kyun Kim, Jae Ho Baik, Sung Jin Yum, Ji Young Lee, Jin Sang Hwang, Woon Geun Kwak, Jung Sik Park, Byoung Uk Yoon, Yong Seok Lee, Jung Won Lee, Min Su Jung, Seung Min Choi, Hyun Ju Hong
  • Publication number: 20180356864
    Abstract: An electronic device according to one embodiment may include: a first housing including a first side; a second housing including a second side facing the first side; at least one first magnetic member configured to be rotatably disposed inside the first housing and adjacent to the first side; and at least one second magnetic member configured to be rotatably disposed inside the second housing and adjacent to the second side, wherein the first housing and the second housing are rotatably coupled to each other by a magnetic force between the at least one first magnetic member and the at least one second magnetic member. Various other embodiments are also possible.
    Type: Application
    Filed: June 11, 2018
    Publication date: December 13, 2018
    Inventors: Jun-Won LEE, Jang-Woon KIM, Chung-Ha KIM, Jae-Ho BAIK, Hyun-Keun SON, Seung-Ho JANG
  • Publication number: 20180259740
    Abstract: There is provided a lens actuator, including: a lens barrel in which at least one lens is provided on an optical axis; a magnetic part provided on one surface of the lens barrel; and a printed circuit board in which a coil pattern part generating electromagnetic force is provided, the printed circuit board having one surface facing the magnetic part, wherein magnetic material is provided on the other surface of the printed circuit board.
    Type: Application
    Filed: May 10, 2018
    Publication date: September 13, 2018
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Ho BAIK, Hoon Heo, Jung Seok Lee, Jae Hyuk Lee, Yong Joon Park, Jung Wook Hwang
  • Patent number: D825507
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: August 14, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Ho Baik, Sun-Keun Park, Min-Hyouk Lee
  • Patent number: D825508
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: August 14, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Ho Baik, Sun-Keun Park, Min-Hyouk Lee
  • Patent number: D831605
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: October 23, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Ho Baik, Mi-Ri Lee, Jong-Bo Jung, Seon-Keun Park
  • Patent number: D835597
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: December 11, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Ji Young Lee, Kuk Hwan Kim, Jae Ho Baik, Jung Hee Yeo, Dong Kyun Kim, Sung Jin Yum, Jinie Ryu, Soyeon Lee
  • Patent number: D839250
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: January 29, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Ho Baik, Mi-Ri Lee, Jong-Bo Jung, Seon-Keun Park
  • Patent number: D839251
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: January 29, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Ho Baik, Mi-Ri Lee, Jong-Bo Jung, Seon-Keun Park
  • Patent number: D839848
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: February 5, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Ho Baik, Mi-Ri Lee, Jong-Bo Jung, Seon-Keun Park
  • Patent number: D841646
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: February 26, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-Keun Son, Jun-Won Lee, Jang-Woon Kim, Chung-Ha Kim, Jae-Ho Baik, Seung-Ho Jang
  • Patent number: D862407
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: October 8, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Kuk Hwan Kim, Jae Ho Baik, Jung Hee Yeo, Dong Kyun Kim, Sung Jin Yum, Jinie Ryu, Soyeon Lee
  • Patent number: D896210
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: September 15, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyun-Keun Son, Bum-Soo Park, Jae-Ho Baik
  • Patent number: D896211
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: September 15, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang-Sin Cho, Hyun-Keun Son, Min-Young Park, Jae-Ho Baik
  • Patent number: D897327
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: September 29, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Ho Baik, Mi-Ri Lee, Jong-Bo Jung, Seon-Keun Park
  • Patent number: D915371
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: April 6, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang-Sin Cho, In-Shik Kim, Baek-Ki Kim, Jae-Ho Baik