Abstract: A display device includes a light emitting element disposed on a substrate to include an emission layer; and a light controller disposed over the light emitting element, the light controller includes light blocking patterns to extend in a first direction and spaced apart in a second direction intersecting the first direction; and a transmission portion disposed between the light blocking patterns to extend in the first direction, and the transmission portion includes a first transparent organic layer; a transparent inorganic layer disposed on the first transparent organic layer; and a second transparent organic layer disposed on the transparent inorganic layer.

Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; a pad disposed on the first insulating layer and having a top surface exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than the top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall includes: a first inner wall extending from the bottom surface and having a first inclination angle; and a second inner wall extending from the first inner wall and having a second inclination angle different from the first inclination angle.

Abstract: A display device according to an embodiment includes a light-emitting device disposed on a substrate and including an emission layer, and a light control layer disposed on the light-emitting device. The light control layer includes a plurality of light blocking patterns extending in a first direction and spaced in a second direction intersecting the first direction, and a transmission layer disposed among the plurality of light blocking patterns and including a transparent organic layer and a transparent inorganic layer that are alternately stacked on each other.

Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.

Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.

Abstract: Disclosed is a battery module, which includes: a battery cell assembly having at least one battery cell; a module case configured to accommodate the battery cell assembly; and at least one injection hole provided in a bottom portion of the module case to inject a thermally conductive adhesive into the module case.

Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a plurality of pads disposed on the first insulating layer and having top surfaces exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than a top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall is perpendicular to top or bottom surface of the second insulating layer, wherein the bottom surface of the cavity includes: a first bottom surface positioned lower than a top surface of the pad and positioned outside an arrangement region of the plurality of pads; and a second bottom surface positioned lower than the top surface of the pad and positioned inside the arrangement region of the plurality of pads, and wherein a height of the first bottom surface is different from a height of the second bottom surface.

Abstract: A display device includes a light-emitting device disposed on a substrate and including an emission layer, and a light controller disposed on the light-emitting device. The light controller includes a plurality of main light blocking patterns extending in a first direction and spaced apart from each other in a second direction intersecting the first direction, and a plurality of sub-light blocking patterns disposed between adjacent ones of the plurality of main light blocking patterns, extending in the first direction, and spaced apart from each other in the second direction. Each of the plurality of main light blocking patterns has a first thickness in a thickness direction of the substrate, and each of the plurality of sub-light blocking patterns has a second thickness that is less than the first thickness in the thickness direction of the substrate.

Abstract: The present disclosure relates to a DC-DC converter, a vehicle, and a control method including the same, and more particularly, to a DC-DC converter, a vehicle, and a control method including the same capable of effectively detecting and responding to an interlock failure of a connector.

Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

Abstract: A light-emitting element includes a first semiconductor layer doped to have a first polarity, a second semiconductor layer doped to have a second polarity different from the first polarity, a light-emitting layer disposed between the first and second semiconductor layers, a shell layer formed on side surfaces of the first semiconductor layer, the light-emitting layer, and the second semiconductor layer, the shell layer including a divalent metal element, and an insulating film covering an outer surface of the shell layer and surrounding the side surface of the light-emitting layer.

Abstract: A method performed by a managing server includes: receiving, from an electronic device, operation data of the electronic device; identifying, by using artificial intelligence (AI), a device usage pattern of the electronic device; identifying, by using the AI, information related to a failure or an abnormal operation of the electronic device and a solution to the failure or the abnormal operation based on the device usage pattern and the operation data received from the electronic device; and transmitting, to a user terminal, the information related to the failure or the abnormal operation of the electronic device and the solution to the failure or the abnormal operation.

Abstract: A pouch film laminate according to the present disclosure may include a base material layer, a gas barrier layer, and a sealant layer. The gas barrier layer may be disposed between the base material layer and the sealant layer. The gas barrier layer may include stainless steel. The pouch film laminate may have a tensile rupture strength of about 130% to about 250% of a tensile rupture strength of the gas barrier layer.

Abstract: A DC-DC converter, a vehicle including the converter, and a controlling method thereof are provided. The DC-DC converter includes a first capacitor connected to a first DC terminal, a second capacitor connected to a second DC terminal, a plurality of converting circuits each including at least an inductor and a plurality of switching elements, and connected to each other in parallel between the first capacitor and the second capacitor, and a controller configured to control an ON/OFF state of the plurality of switching elements provided of each of the converting circuits. When external power connection with respect to each of the first DC terminal and the second DC terminal is disconnected, the controller is configured to control states of the plurality of switching elements to sequentially provide a plurality of different discharge paths between opposite terminals of the second capacitor via the plurality of converting circuits.

Abstract: A method for decoding an image based on an intra prediction, comprising: obtaining a first prediction pixel of a first region in a current block by using a neighboring pixel adjacent to the current block; obtaining a second prediction pixel of a second region in the current block by using the first prediction pixel of the first region; and decoding the current block based on the first and the second prediction pixels.

Abstract: The present disclosure relates to an electronic device, and more specifically, to an electronic device including a printed circuit board including a heat-generating element arranged on one surface thereof, and a heat transfer coin provided such that one surface of the heat transfer coin comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated from the heat-generating element. Accordingly, the present disclosure provides an advantage of improving heat dissipation performance without increasing the thickness of the printed circuit board.

Abstract: A communication apparatus is provided to include an apparatus enclosure that includes a substrate seating surface and at least one or more connection grooves formed on the substrate seating surface, a first printed circuit board disposed on the substrate seating surface, a second printed circuit board disposed on the substrate seating surface on one side of the first printed circuit board, and at least one or more connectors disposed within the connection groove and configured to electrically connect the first printed circuit board and the second printed circuit board.

Abstract: A vehicle is provided that includes a DC converter having a first end connected to a fuel cell, a second end connected to a high-voltage battery, and at least one switching element connected between the first end and the second end, a fuel cell control unit which controls an activation state of a running command for start of the fuel cell based on an on-off state of vehicle start, and a converter controller which controls a running state of the DC converter according to an initial start sequence, a shutdown sequence, or a restart sequence for the fuel cell based on the activation state of the running command.

Abstract: A display device includes: a substrate; a plurality of transistors disposed on the substrate; an insulating layer disposed on the plurality of transistors; a data line and a driving voltage line disposed on the insulating layer; a pixel electrode disposed on the data line or the driving voltage line; a pixel defining layer disposed on the pixel electrode and including a pixel opening that overlaps the pixel electrode; a light emitting element layer disposed in the pixel opening; and a common electrode disposed on the light emitting element layer, wherein the pixel opening includes a first sub-pixel opening and a second sub-pixel opening and a first blocking portion that is disposed between the first sub-pixel opening and the second sub-pixel opening.

Abstract: The present disclosure relates to a preparation method of a super absorbent polymer non-woven fabric and super absorbent polymer fibers prepared therefrom. According to the preparation method of the present disclosure, it is possible to provide super absorbent polymer fibers exhibiting high flexibility and fast absorption rate in the form of long fibers.