Patents by Inventor Jae Hwan Kang

Jae Hwan Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240158705
    Abstract: The present disclosure provides a method and device for refining waste plastic pyrolysis oil, the method including (S1) subjecting a waste plastic pyrolysis oil feedstock to a heat treatment by charging the waste plastic pyrolysis oil feedstock into a rotary kiln reactor and increasing a temperature of the rotary kiln reactor to form a product; (S2) recovering a gas component from the product of step (S1); (S3) separating a high boiling point wax component from the recovered gas component and re-supplying the separated high boiling point wax component to the rotary kiln reactor in step (S1); and (S4) recovering refined oil from the gas component from which the high boiling point wax component is removed.
    Type: Application
    Filed: November 13, 2023
    Publication date: May 16, 2024
    Inventors: Sang Hwan Jo, Soo Kil Kang, Ik Hwan Na, Ho Won Lee, Jae Heum Jung, Se Rah Moon, Hee Young Jeon
  • Publication number: 20240149751
    Abstract: A dual release actuator for a vehicle seat includes a motor, a cable carrier configured to receive power of the motor, thereby rotating to selectively pull one of two different cables, a Hall sensor to sense rotation of the motor, and a controller configured to count a sensing pulse of the Hall sensor for controlling rotation of the motor.
    Type: Application
    Filed: May 17, 2023
    Publication date: May 9, 2024
    Inventors: Jae Wook Kim, Sang Soo Lee, Deok Soo Lim, Hyun Wook Lim, Sang Ho Lee, Sang Hark Lee, Hak Cheol Lee, Deok Ki Kim, Byeong Deok Choi, Hoe Cheon Kim, Hwa Young Mun, Seung Yeop Lee, Cheol Hwan Yoon, Jung Bin Lee, Byung Ju Kang
  • Publication number: 20240145346
    Abstract: A semiconductor device includes a substrate with a conductive pattern. A semiconductor die is electrically connected to the substrate and both the semiconductor die and the substrate are at least partially covered by a package body. In some examples, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In some examples, through-mold vias are included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. In some examples, an interposer is electrically connected to the through-mold vias and may be covered by the package body and/or disposed in spaced relation thereto. In some examples, the interposer may not be electrically connected to the through-mold vias but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd
    Inventors: Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM, Jae Dong KIM, Yeon Soo JUNG, Sung Hwan CHO
  • Patent number: 11962022
    Abstract: Disclosed is a miniaturized battery module in which a space except for a space of a battery cell is minimized and the number of components is reduced. The miniaturized battery module includes a cell assembly configured by assembling a plurality of battery cells, an upper frame inserted into an outer upper surface of the cell assembly, a lower frame inserted into an outer lower surface of the cell assembly and fastened to the upper frame, and first and second endplates fastened to two opposite ends of the cell assembly and configured to fix the plurality of battery cells. In this case, at least two or more of the plurality of the battery cells are arranged side by side, and the upper frame and the lower frame are fastened by welding.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: April 16, 2024
    Assignee: HL GREENPOWER INC.
    Inventors: Jae-Yeon Ryu, Gil-Sup Kim, Sung-Joo Kang, Jae-Nyeon Kim, Jin-Su Han, Jung-Hwan Kim
  • Patent number: 11961775
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Publication number: 20240114221
    Abstract: A camera module includes a housing, a reflective member positioned in the housing and changing a direction of light to a direction of an optical axis, a carrier carrying the reflective member and rotatable about a first axis with respect to the housing, and a first ball group disposed between the housing and the carrier, wherein the first ball group includes a main ball member providing the first axis of the carrier, and an auxiliary ball member disposed away from the first axis, and one or both of the housing and the carrier partially accommodates the auxiliary ball member, and includes an auxiliary guide groove extended in a circumferential direction of the first axis.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 4, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Hwan KWON, Nam Ki PARK, Young Bok YOON, Soon Seok KANG, Jae Won JUNG
  • Publication number: 20240112002
    Abstract: Disclosed is an interface system including a first neuron cluster that outputs a first neuron signal including a first neuron request and first neuron data by performing a first arithmetic operation, and a first interface circuit that stores the first neuron data and outputs a first response, in response to the first neuron request. The first neuron cluster outputs a second neuron signal including a second neuron request and second neuron data by performing a second arithmetic operation, in response to the first response. Before the first data is transmitted to a second neuron cluster different from the first neuron cluster, the first interface circuit outputs the first response in response to a fact that the first neuron data is stored.
    Type: Application
    Filed: June 29, 2023
    Publication date: April 4, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Sung Eun KIM, Tae Wook KANG, Hyuk KIM, Young Hwan BAE, Kyung Jin BYUN, Kwang IL OH, Jae-Jin LEE, In San JEON
  • Publication number: 20240097799
    Abstract: Disclosed is an amplification circuit, which includes a first amplifier that receives an external signal and performs first band pass filtering on the external signal to output a first filter signal, and a second amplifier that receives the first filter signal and performs second band pass filtering on the first filter signal to output a second filter signal, and a frequency pass bandwidth of the second band pass filtering is narrower than a frequency pass bandwidth of the first band pass filtering.
    Type: Application
    Filed: June 26, 2023
    Publication date: March 21, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Sung Eun KIM, Tae Wook KANG, Hyuk KIM, Kyung Hwan PARK, Mi Jeong PARK, Hyung-IL PARK, Kyung Jin BYUN, Kwang IL OH, Jae-Jin LEE, In Gi LIM
  • Patent number: 11923124
    Abstract: A coil component includes a body having one surface, and one end surface and the other end surface, respectively connected to the one surface and opposing each other, a support substrate embedded in the body, and a coil portion disposed on the support substrate and including first and second lead-out patterns respectively exposed from surfaces of the body. The first lead-out pattern is exposed from the one surface of the body and the one end surface of the body. The second lead-out pattern is exposed from the one surface of the body and the other end surface of the body. The body includes an anchor portion disposed in each of the first and second lead-out patterns.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: March 5, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Jae Hun Kim, Joung Gul Ryu, Byung Soo Kang, Byeong Cheol Moon, Jeong Gu Yeo
  • Patent number: 11923882
    Abstract: A hybrid communication device, an operation method thereof, and a communication system including the same are provided. The hybrid communication device includes a contact unit that includes an antenna for receiving a first communication signal and an electrode for receiving a second signal, a switch controller that includes a first switch and a second switch and controls the first switch and the second switch based on a change in capacitance of the electrode, and a signal processing unit that receives at least one of the first communication signal and the second communication signal from the contact unit via the first switch and processes the received signal. The first switch is connected to the contact unit, and the signal processing unit is connected to the first switch.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: March 5, 2024
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Tae Wook Kang, Sung Eun Kim, Hyung-Il Park, Jae-Jin Lee, Hyuk Kim, Kyung Hwan Park, Mi Jeong Park, Kyung Jin Byun, Kwang Il Oh, In Gi Lim
  • Patent number: 7395106
    Abstract: Provided are a wearable physiological signal detection module and a measurement apparatus having the same. A physiological signal detection module including a measuring electrode implemented by a dry electrode having good conductivity to detect various physiological signals is detachably disposed inside the clothing closely adhered to user's skin. The measuring electrode can be in stable contact with the user's skin as well as the detection module can be conveniently worn for a long time. The various physiological signals detected by the measuring electrodes are wirelessly transmitted to an external device, thereby conveniently monitoring the physiological signal of the user in real time.
    Type: Grant
    Filed: March 22, 2005
    Date of Patent: July 1, 2008
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Chang Yong Ryu, Seung Chul Shin, Seung Hoon Nam, Jae Hwan Kang, Yoon Seon Song, Tae Gyu Yim, Seunghwan Kim, Yun Tae Kim