Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a first dissolution-controlling agent including at least one of compounds represented by the following Chemical Formula 1 or Chemical Formula 2; (D) a second dissolution-controlling agent including a compound represented by the following Chemical Formula 3; and (E) a solvent, and a photosensitive resin film and a display device using the same.

Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin, (B) a photosensitive diazoquinone compound, (C) a thermosetting cross-linking agent represented by the following Chemical Formula 1, wherein each substituent of Chemical Formula 1 is the same as defined in the detailed description, and (D) a solvent, a photosensitive resin film using the same, and a display device.

Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin, (B) a photosensitive diazoquinone compound, (C) a thermosetting cross-linking agent represented by the following Chemical Formula 1, wherein each substituent of Chemical Formula 1 is the same as defined in the detailed description, and (D) a solvent, a photosensitive resin film using the same, and a display device.

Abstract: Disclosed are a positive photosensitive resin composition including (A) a polybenzoxazole precursor having a polydispersity of about 1 to about 1.6; (B) a photosensitive diazoquinone compound; (C) a thermal acid generator; and (D) a solvent, a photosensitive resin film using the same, and a display device.

Abstract: A photosensitive resin composition for an insulating film of a display device includes (A) an alkali soluble resin including a polybenzoxazole precursor, polyamic acid, polyimide, or a combination thereof; (B) a photosensitive diazoquinone compound; (C) an ultraviolet (UV) absorber having a maximum absorption wavelength of about 300 to about 400 nm; and (D) a solvent. An insulating film and a display device can include the photosensitive resin composition.

Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a first dissolution-controlling agent including at least one of compounds represented by the following Chemical Formula 1 or Chemical Formula 2; (D) a second dissolution-controlling agent including a compound represented by the following Chemical Formula 3; and (E) a solvent, and a photosensitive resin film and a display device using the same.

Abstract: A photosensitive resin composition for an insulating film of a display device includes (A) an alkali soluble resin including a polybenzoxazole precursor, polyamic acid, polyimide, or a combination thereof; (B) a photosensitive diazoquinone compound; (C) an ultraviolet (UV) absorber having a maximum absorption wavelength of about 300 to about 400 nm; and (D) a solvent. An insulating film and a display device can include the photosensitive resin composition.

Abstract: A method and apparatus for manufacturing a tonewheel for vehicles. The method includes machining a material into a tonewheel shape, manufacturing a semi-finished tonewheel product having a sensing part in which a plurality of sensing holes is formed at regular intervals in a circumferential direction of the sensing part, by machining the tonewheel shape manufactured at the forming step, and manufacturing a finished tonewheel product having a sensing part of which deformation is recovered, by processing the sensing part of the semi-finished tonewheel product, which is deformed to be curved at the sensing-hole machining step, through a restrike mold. The apparatus is capable of performing the method.

Abstract: Disclosed herein is a method and apparatus for manufacturing a tonewheel for vehicles. The present invention is capable of manufacturing a tonewheel having high precision and quality, thus enhancing the performance of the ABS, TCS, or VDC using the tonewheel.

Abstract: An improved process for bonding a semiconductor chip to a substrate is disclosed. In the process, a gold bump is formed on an aluminum bond pad of the chip thus forming a flip chip. A screen with an opening is placed on the substrate prior to dotting insulating epoxy on the opening. The epoxy is bladed with a printing blade thus forming an epoxy layer having a predetermined area and uniform thickness. The flip chip is, thereafter, placed on the substrate such that the gold bump is brought into electrical contact with a lead finger of the substrate through thermocompression bonding. Then the chip and substrate are put in an oven in order to permanently cure the epoxy layer. It is preferable to precure the epoxy layer prior to the permanent curing step thereby allowing thermal stress to be distributed to both the gold bump and the precured epoxy layer.