Abstract: A display panel includes an amorphous silicon gate driver in which a lower voltage than the gate-off voltage output from the gate driver is applied to an adjacent stage as a low voltage transmission signal.

Abstract: The semiconductor device includes a substrate, a stack structure including gate patterns and interlayer insulating films that are alternately stacked on the substrate, an insulating pillar extending in a thickness direction of the substrate within the stack structure, a polycrystalline metal oxide film extending along a sidewall of the insulating pillar between the insulating pillar and the stack structure, a liner film having a transition metal between the insulating pillar and the polycrystalline metal oxide film, and a tunnel insulating film, a charge storage film, and a blocking insulating film which are disposed in order between the polycrystalline metal oxide film and the gate patterns.

Abstract: The present invention relates to a vagus nerve stimulation device for animals, the device comprising an electrode that contacts the animal's skin to transmit electrical stimuli and a power source for generating electrical stimuli transmitted to the electrode. The present invention has an excellent effect of stabilizing the psychological state of an animal by stimulating the vagus nerve from the outside of the animal. For companion animals, the present invention has the effect of eliminating aggression, relieving and stress, reducing separation anxiety. In the case of livestock animals, there are the effects of improving meat quality and increasing milk production by reducing breeding stress even without the aid of drugs or the like. For leisure animals or sports animals, the excellent effects of imparting psychological stability to reduce the risk of accidents due to psychological stability, improving recovery from fatigue, and improving exercise ability can be brought about.

Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a first dissolution-controlling agent including at least one of compounds represented by the following Chemical Formula 1 or Chemical Formula 2; (D) a second dissolution-controlling agent including a compound represented by the following Chemical Formula 3; and (E) a solvent, and a photosensitive resin film and a display device using the same.

Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin, (B) a photosensitive diazoquinone compound, (C) a thermosetting cross-linking agent represented by the following Chemical Formula 1, wherein each substituent of Chemical Formula 1 is the same as defined in the detailed description, and (D) a solvent, a photosensitive resin film using the same, and a display device.

Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin, (B) a photosensitive diazoquinone compound, (C) a thermosetting cross-linking agent represented by the following Chemical Formula 1, wherein each substituent of Chemical Formula 1 is the same as defined in the detailed description, and (D) a solvent, a photosensitive resin film using the same, and a display device.

Abstract: Disclosed are a positive photosensitive resin composition including (A) a polybenzoxazole precursor having a polydispersity of about 1 to about 1.6; (B) a photosensitive diazoquinone compound; (C) a thermal acid generator; and (D) a solvent, a photosensitive resin film using the same, and a display device.

Abstract: A photosensitive resin composition for an insulating film of a display device includes (A) an alkali soluble resin including a polybenzoxazole precursor, polyamic acid, polyimide, or a combination thereof; (B) a photosensitive diazoquinone compound; (C) an ultraviolet (UV) absorber having a maximum absorption wavelength of about 300 to about 400 nm; and (D) a solvent. An insulating film and a display device can include the photosensitive resin composition.

Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a first dissolution-controlling agent including at least one of compounds represented by the following Chemical Formula 1 or Chemical Formula 2; (D) a second dissolution-controlling agent including a compound represented by the following Chemical Formula 3; and (E) a solvent, and a photosensitive resin film and a display device using the same.

Abstract: A photosensitive resin composition for an insulating film of a display device includes (A) an alkali soluble resin including a polybenzoxazole precursor, polyamic acid, polyimide, or a combination thereof; (B) a photosensitive diazoquinone compound; (C) an ultraviolet (UV) absorber having a maximum absorption wavelength of about 300 to about 400 nm; and (D) a solvent. An insulating film and a display device can include the photosensitive resin composition.

Abstract: A method and apparatus for manufacturing a tonewheel for vehicles. The method includes machining a material into a tonewheel shape, manufacturing a semi-finished tonewheel product having a sensing part in which a plurality of sensing holes is formed at regular intervals in a circumferential direction of the sensing part, by machining the tonewheel shape manufactured at the forming step, and manufacturing a finished tonewheel product having a sensing part of which deformation is recovered, by processing the sensing part of the semi-finished tonewheel product, which is deformed to be curved at the sensing-hole machining step, through a restrike mold. The apparatus is capable of performing the method.

Abstract: Disclosed herein is a method and apparatus for manufacturing a tonewheel for vehicles. The present invention is capable of manufacturing a tonewheel having high precision and quality, thus enhancing the performance of the ABS, TCS, or VDC using the tonewheel.

Abstract: An improved process for bonding a semiconductor chip to a substrate is disclosed. In the process, a gold bump is formed on an aluminum bond pad of the chip thus forming a flip chip. A screen with an opening is placed on the substrate prior to dotting insulating epoxy on the opening. The epoxy is bladed with a printing blade thus forming an epoxy layer having a predetermined area and uniform thickness. The flip chip is, thereafter, placed on the substrate such that the gold bump is brought into electrical contact with a lead finger of the substrate through thermocompression bonding. Then the chip and substrate are put in an oven in order to permanently cure the epoxy layer. It is preferable to precure the epoxy layer prior to the permanent curing step thereby allowing thermal stress to be distributed to both the gold bump and the precured epoxy layer.