Patents by Inventor Jae Hyeok Park

Jae Hyeok Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11939505
    Abstract: Provided are a silicon nitride film etching composition, a method of etching a silicon nitride film using the same, and a manufacturing method of a semiconductor device. Specifically, a silicon nitride film may be stably etched with a high selection ratio relative to a silicon oxide film, and when the composition is applied to an etching process at a high temperature and a semiconductor manufacturing process, not only no precipitate occurs but also anomalous growth in which the thickness of the silicon oxide film is rather increased does not occur, thereby minimizing defects and reliability reduction.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: ENF Technology Co., Ltd.
    Inventors: Dong Hyun Kim, Hyeon Woo Park, Sung Jun Hong, Myung Ho Lee, Myung Geun Song, Hoon Sik Kim, Jae Jung Ko, Myong Euy Lee, Jun Hyeok Hwang
  • Patent number: 6470030
    Abstract: An OFDM receiver system for performing precise OFDM demodulation is provided. The OFDM receiver system performs demodulation by sharing memories and operators in a time-divisional manner. FFT-processed data is separated into specific pilot signals and data according to the timing indicated by a controller to then be rearranged and stored, thereby facilitating extraction of corresponding pilot signals and data for various synchronization and equalization steps. Therefore, the demodulation system having an optimal structure can be realized in view of resource utilization efficiency and chip areas, the cost and time for fabricating and designing the system can be reduced, and verification of the system can be easily performed.
    Type: Grant
    Filed: March 3, 1999
    Date of Patent: October 22, 2002
    Assignee: Daewoo Electronics Co., Ltd.
    Inventors: Jae Hyeok Park, Yeong Sang Kim, Jean Jacques Michel, Francois Langinieux, Olivier Dejonghe