Patents by Inventor Jae-Hyug Cha

Jae-Hyug Cha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7547744
    Abstract: The present invention relates to a thermoplastic resin composition. In more particular, a thermoplastic resin of graft ABS polymer and heat-resistant copolymer contains acryl-based resin, peroxide-based additive, or cross-linking additive, so that the thermoplastic resin composition of the present invention is effective in processing of a colored heat resistant ABS resin by having excellent cold stress whitening reduction and strength property, without lowering other properties as well as giving excellence in hot-tool weldability, pigmentation and paint spread property which are more important in post process, and maintaining the mechanical property as well as giving excellent heat-resistance and low gloss property.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: June 16, 2009
    Assignee: LG Chem, Ltd.
    Inventors: Jae-Hyug Cha, Seung-Hun Chae, Seong-Lyong Kim, Jun-Tae Lee, Byung-Tae Yang
  • Publication number: 20060211817
    Abstract: The present invention relates to a thermoplastic resin composition. In more particular, a thermoplastic resin of graft ABS polymer and heat-resistant copolymer contains acryl-based resin, peroxide-based additive, or cross-linking additive, so that the thermoplastic resin composition of the present invention is effective in processing of a colored heat resistant ABS resin by having excellent cold stress whitening reduction and strength property, without lowering other properties as well as giving excellence in hot-tool weldability, pigmentation and paint spread property which are more important in post process, and maintaining the mechanical property as well as giving excellent heat-resistance and low gloss property.
    Type: Application
    Filed: April 30, 2004
    Publication date: September 21, 2006
    Inventors: Jae-Hyug Cha, Seung-Hun Chae, Seong-Lyong Kim, Jun-Tae Lee, Byung-Tae Yang