Patents by Inventor Jaehyuk Choi

Jaehyuk Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220251164
    Abstract: A glucagon-like peptide-2 (GLP-2) derivative, a conjugate thereof, and a use thereof are disclosed. Additionally, a method for preparing a glucagon-like peptide-2 (GLP-2) derivative and a conjugate thereof is disclosed.
    Type: Application
    Filed: April 14, 2022
    Publication date: August 11, 2022
    Applicant: HANMI PHARM. CO., LTD.
    Inventors: Jaehyuk Choi, Min Young Kim, In Young Choi, Sung Youb Jung
  • Publication number: 20220236415
    Abstract: A light detection and ranging (LiDAR) device and a method of measuring a distance are provided. The LiDAR device includes: a light transmitter configured to transmit light to an object; a light receiver that includes a plurality of sub-light receiving regions that are included in one light receiving region corresponding to one pixel, each of the plurality of sub-light receiving regions including a light detection element configured to receive the light reflected from the object; and a processor configured to determine a time of flight (ToF) of the light that is transmitted to and then reflected from the object by varying a time window according to a measurement condition.
    Type: Application
    Filed: October 12, 2021
    Publication date: July 28, 2022
    Applicants: SAMSUNG ELECTRONICS CO., LTD., RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Jungwoo KIM, Jaehyuk CHOI, Hyeongseok SEO, Gihwan CHO
  • Patent number: 11376469
    Abstract: Disclosed is an electronic device capable of automatically identifying a workout environment, such as a swimming pool environment or outdoor environment, based on position-associated information of the electronic device and providing workout information per the workout environment.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: July 5, 2022
    Inventors: Wonhee Lee, Jaehyuk Choi
  • Patent number: 11235675
    Abstract: A charging cable includes a first connector including a first proximity detection pin and a first power pin; a second connector comprising a second proximity detection pin and a second power pin; and a cable electrically connecting the first power pin of the first connector and the second power pin of the second connector, wherein the cable may not connect the first proximity detection pin and the second proximity detection pin.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: February 1, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Jaehyuk Choi, Jaewon Lee, Byeong Seob Song, Samgyun Kim, Na Lae Kwon, Hyun Soo Park, Soung Han Noh
  • Publication number: 20210366743
    Abstract: A semiconductor packaging apparatus and methods of manufacturing semiconductor devices using the same. The semiconductor packaging apparatus includes a process unit, and a controller associated with the process unit. The process unit includes a bonding part that bonds a semiconductor substrate and a carrier substrate to each other to form a bonded substrate, a cooling part that cools the bonded substrate, and a detection part in the cooling part and configured to detect a defect of the bonded substrate. The controller is configured to control the process unit using data obtained from the detection part.
    Type: Application
    Filed: June 3, 2021
    Publication date: November 25, 2021
    Inventors: JUNGHYUN CHO, SANG-GEUN PARK, DONGSEOK BAEK, JAEHYUK CHOI
  • Patent number: 11153491
    Abstract: The electronic device according to an embodiment includes: a camera; a display; a memory storing one or more instructions; and a processor configured to execute the one or more instructions stored in the memory to: determine a size of a wall surface to be photographed to be output to an image display apparatus; control the display to display, on a preview image, a guideline indicating a region corresponding to the size of the wall surface to be photographed, based on a distance between the electronic device and the wall surface; control the camera to capture an image indicating the wall surface, based on the output guideline; and transmit the captured image to the image display apparatus such that the captured image is output to the image display apparatus.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: October 19, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Jaehyuk Choi
  • Publication number: 20210247502
    Abstract: A light detection and ranging (LiDAR) device may sequentially select each of a plurality of memory cells based on a coarse clock synchronized with a start signal generated when light is transmitted, may supply power to a plurality of memory cells based on a stop signal generated when light is received, and may calculate a time of flight (ToF) of light based on information of the power accumulated in the plurality of memory cells.
    Type: Application
    Filed: December 29, 2020
    Publication date: August 12, 2021
    Applicants: SAMSUNG ELECTRONICS CO., LTD., RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Jungwoo KIM, Hyeongseok SEO, Jaehyuk CHOI
  • Patent number: 11062924
    Abstract: A semiconductor packaging apparatus and methods of manufacturing semiconductor devices using the same. The semiconductor packaging apparatus includes a process unit, and a controller associated with the process unit. The process unit includes a bonding part that bonds a semiconductor substrate and a carrier substrate to each other to form a bonded substrate, a cooling part that cools the bonded substrate, and a detection part in the cooling part and configured to detect a defect of the bonded substrate. The controller is configured to control the process unit using data obtained from the detection part.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: July 13, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Junghyun Cho, Sang-Geun Park, Dongseok Baek, Jaehyuk Choi
  • Publication number: 20210179624
    Abstract: A secondary battery includes a protection module package including a tab bridge, an input/output terminal, and an insulating body that includes a middle block and side block, the middle block having the input/output terminal therein, the side block being spaced apart from the middle block, and the tab bridge connecting the middle block to the side block; and a bare cell including an electrode that is electrically connected to the tab bridge.
    Type: Application
    Filed: December 9, 2020
    Publication date: June 17, 2021
    Inventor: Jaehyuk CHOI
  • Patent number: 11025161
    Abstract: Disclosed are an electric vehicle capable of improving the charging efficiency of a charging apparatus by reducing the switching loss that may occur in the charging apparatus of an electric vehicle and a charging apparatus thereof. To this end, a power factor correction apparatus of an on board charger includes a first boost circuit receiving AC power through a first inductor to charge a load, a second boost circuit receiving the AC power through a second inductor to charge the load, and a third inductor provided between a leg of the first boost circuit and a leg of the second boost circuit so that parasitic capacitors of the first boost circuit and the second boost circuit are discharged.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: June 1, 2021
    Assignees: Hyundai Motor Company, KIA Motors Corporation, Korea Advanced Institute of Science and Technology
    Inventors: JongPil Kim, Jaehyuk Choi, Woo Young Lee, HanShin Youn, Gun-Woo Moon, Jae-Ii Baek, Jung-Kyu Han, Moo-Hyun Park
  • Publication number: 20210084234
    Abstract: The electronic device according to an embodiment includes: a camera; a display; a memory storing one or more instructions; and a processor configured to execute the one or more instructions stored in the memory to: determine a size of a wall surface to be photographed to be output to an image display apparatus; control the display to display, on a preview image, a guideline indicating a region corresponding to the size of the wall surface to be photographed, based on a distance between the electronic device and the wall surface; control the camera to capture an image indicating the wall surface, based on the output guideline; and transmit the captured image to the image display apparatus such that the captured image is output to the image display apparatus.
    Type: Application
    Filed: December 17, 2018
    Publication date: March 18, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Jaehyuk CHOI
  • Publication number: 20210008994
    Abstract: A charging cable includes a first connector including a first proximity detection pin and a first power pin; a second connector comprising a second proximity detection pin and a second power pin; and a cable electrically connecting the first power pin of the first connector and the second power pin of the second connector, wherein the cable may not connect the first proximity detection pin and the second proximity detection pin.
    Type: Application
    Filed: January 17, 2020
    Publication date: January 14, 2021
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Jaehyuk Choi, Jaewon Lee, Byeong Seob Song, Samgyun Kim, Na Lae Kwon, Hyun Soo Park, Soung Han Noh
  • Publication number: 20210001742
    Abstract: A charging device and a control method are provided. The charging device may include: a battery; a solar panel; a socket electrically connected to a power system; a first connector electrically connected to the vehicle; a transceiver configured to communicate with the power system and the vehicle; a power supply circuit electrically connected to the battery, the solar panel, the socket and the first connector; and a controller configured to control the power supply circuit to supply power that is supplied from at least one of the battery or the solar panel to at least one of the power system or the vehicle when a request for power is received from the power system and the vehicle.
    Type: Application
    Filed: November 11, 2019
    Publication date: January 7, 2021
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Jaehyuk CHOI, Hyunsup KIM, Jae Young JEUN, Byeong Seob SONG
  • Publication number: 20200402955
    Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.
    Type: Application
    Filed: September 1, 2020
    Publication date: December 24, 2020
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: DeokKyung Yang, YongMin Kim, JaeHyuk Choi, YeoChan Ko, HeeSoo Lee
  • Publication number: 20200376337
    Abstract: Disclosed is an electronic device capable of automatically identifying a workout environment, such as a swimming pool environment or outdoor environment, based on position-associated information of the electronic device and providing workout information per the workout environment.
    Type: Application
    Filed: May 29, 2020
    Publication date: December 3, 2020
    Inventors: Wonhee LEE, Jaehyuk CHOI
  • Patent number: 10797024
    Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.
    Type: Grant
    Filed: March 21, 2020
    Date of Patent: October 6, 2020
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: DeokKyung Yang, YongMin Kim, JaeHyuk Choi, YeoChan Ko, HeeSoo Lee
  • Publication number: 20200262888
    Abstract: A glucagon-like peptide-2 (GLP-2) derivative, a conjugate thereof, and a use thereof are disclosed. Additionally, a method for preparing a glucagon-like peptide-2 (GLP-2) derivative and a conjugate thereof is disclosed.
    Type: Application
    Filed: March 27, 2020
    Publication date: August 20, 2020
    Applicant: HANMI PHARM. CO., LTD.
    Inventors: Jaehyuk CHOI, Min Young KIM, In Young CHOI, Sung Youb JUNG
  • Publication number: 20200219847
    Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.
    Type: Application
    Filed: March 21, 2020
    Publication date: July 9, 2020
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: DeokKyung Yang, YongMin Kim, JaeHyuk Choi, YeoChan Ko, HeeSoo Lee
  • Patent number: 10657400
    Abstract: An authentication method includes projecting a near infrared (NIR) ray using a light emitting diode (LED) of a terminal, receiving a light reflected by a vein of a user using an image sensor of the terminal, verifying whether an image generated using the received light exhibits a vein pattern, in response to the image generated using the received light being verified as exhibiting the vein pattern, generating a vein pattern of the vein based on an image generated using the received light, and in response to the generated vein pattern being determined to match a pre-stored vein pattern, authenticating the user as a registered user corresponding to the pre-stored vein pattern.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: May 19, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jungsoon Shin, Namjoon Kim, Joonah Park, Soochul Lim, Jaehyuk Choi, Tae-Sung Jung
  • Patent number: 10636765
    Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: April 28, 2020
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: DeokKyung Yang, YongMin Kim, JaeHyuk Choi, YeoChan Ko, HeeSoo Lee