Abstract: A display device includes a display panel having a display region, a pad region, and a bendable region between the display region and the pad region; a protective member on the display region and the bendable region of the display panel; and an adhesive disposed in the bendable region in contact with a top surface of the display panel and a bottom surface of the protective member.

Abstract: A display device is disclosed. In one aspect, the display device includes a protective member, a display panel accommodated in the protective member, a light guide member including a light incident surface, a heat discharge member including a support surface facing the light incident surface, and a light source disposed on the support surface to supply light to the light incident surface. The light source includes a light-emitting device disposed on one surface of a circuit board, the circuit board including a first area substantially overlapping the light-emitting device and a second area adjacent to the first area, a first adhesive member disposed between the other surface of the circuit board and the support surface and substantially overlapping the first area, and a second adhesive member disposed to substantially overlap the second area. The first adhesive member has a higher heat conductivity than the second adhesive member.

Abstract: A display device is disclosed. In one aspect, the display device includes a protective member, a display panel accommodated in the protective member, a light guide member including a light incident surface, a heat discharge member including a support surface facing the light incident surface, and a light source disposed on the support surface to supply light to the light incident surface. The light source includes a light-emitting device disposed on one surface of a circuit board, the circuit board including a first area substantially overlapping the light-emitting device and a second area adjacent to the first area, a first adhesive member disposed between the other surface of the circuit board and the support surface and substantially overlapping the first area, and a second adhesive member disposed to substantially overlap the second area. The first adhesive member has a higher heat conductivity than the second adhesive member.