Abstract: A propulsion module of an air mobility vehicle may include a door provided in the housing and opening or closing the opening portion of the housing by a sliding motion of the door; a propeller for providing propulsion to the air mobility vehicle; a link assembly having a first end portion connected to the housing and a second end portion connected to the propeller to pull the propeller into the internal space of the housing through the opening portion or pull the propeller outside the internal space through the opening portion; and a door opening and closing portion coupled to the door and configured for providing an opening and closing force to the door according to an inward-pulling motion or an outward-pulling motion of the propeller.

Abstract: The present invention relates to a fan shroud provided in a cooling module, and an object of the present invention is to provide a fan shroud assembly in which a baffle is selectively provided in some sections between a plurality of fixing members provided in a ventilation port of a fan shroud, thereby reducing deterioration in rigidity and durability of the fan shroud and effectively reducing BPF noise.

Abstract: Disclosed are a metal thin film precursor composition, a method of forming a thin film using the metal thin film precursor composition, and a semiconductor substrate fabricated using the method. The metal thin film precursor composition includes a metal thin film precursor compound and a growth regulator including a predetermined terminal group and structure. In a thin film deposition process, by using the metal thin film precursor composition, side reactions may be suppressed and thin film growth rate may be controlled appropriately. Since process by-products in a thin film are removed, even when the thin film is formed on a substrate having a complicated structure, step coverage and the thickness uniformity and resistivity characteristics of the thin film may be greatly improved. In addition, corrosion or deterioration may be prevented, and the crystallinity of the thin film may be improved, thereby improving the electrical properties of the thin film.

Abstract: A railess variable seatback type rear seat includes: a linear movement device configured to convert a rotation of a motor into a linear movement; a sliding movement device configured to convert the linear movement into a sliding movement in which a seat cushion is pushed forward or backward; and a reclining angle change device configured to convert the sliding movement into a reclining movement, and to fold a seatback, which is connected to the seat cushion, forward or to recline the seatback backward.

Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on a winding axis to define a core and an outer circumference. The first electrode includes a first active material portion coated with an active material layer and a first uncoated portion not coated with an active material layer along a winding direction. At least a part of the first uncoated portion is defined as an electrode tab by itself. The first uncoated portion includes a first portion adjacent to the core of the electrode assembly, a second portion adjacent to the outer circumference of the electrode assembly, and a third portion interposed between the first portion and the second portion. The first portion or the second portion has a smaller height than the third portion in the winding axis direction.

Abstract: The present invention relates to an auxiliary precursor, a thin film precursor composition, a method of forming a thin film using the thin film precursor composition, and a semiconductor substrate fabricated using the method. The present invention provides the thin film precursor composition including a thin film precursor compound and a compound having a predetermined structure that exhibits reaction stability as the auxiliary precursor. By using the thin film precursor composition in a thin film deposition process, side reactions may be suppressed, and thin film growth rate may be appropriately controlled. In addition, since process by-products are removed from a thin film, even when a thin film is formed on a substrate having a complicated structure, step coverage and the thickness uniformity and resistivity characteristics of the thin film may be greatly improved.

Abstract: A battery includes an electrode assembly including a first electrode, a second electrode and a separator between the first electrode and the second electrode, the first electrode, the second electrode and the separator being wound around a winding axis to define a core and an outer peripheral surface. The first electrode and the second electrode include a first uncoated region and a second uncoated region along a winding direction, respectively, and an active material layer coating is absent in the first uncoated region and the second uncoated region. The battery further includes a housing receiving the electrode assembly through an opening formed at a bottom, a first current collector coupled to the first uncoated region and disposed within the housing, a cap covering the opening, a spacer interposed between the cap and the electrode assembly to fix the electrode assembly and seal the housing, and a terminal electrically connected to the second uncoated region.

Abstract: A battery includes an electrode assembly including a first uncoated region and a second uncoated region; a battery housing accommodating the electrode assembly and electrically connected to the second uncoated region; a cap to cover an open portion on bottom of the battery housing; a first electrode terminal passing through a partially closed portion of the battery housing and being electrically isolated from the battery housing; and a first current collector coupled to the first uncoated region and connected to the first electrode terminal.

Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.

Abstract: Embodiments relate to laser welding methods, monitoring methods, and monitoring systems for a secondary battery. A laser welding method for a secondary battery includes performing laser welding on a positive electrode base having a thin-film shape in which a plurality of positive electrode base tabs are formed at a side, a negative electrode base having a thin-film shape in which a plurality of negative electrode base tabs are formed at a side, and a thin-film multi-tab to be joined to each of the positive electrode base and the negative electrode base, a welded portion in which the multi-tab is welded with the positive electrode base and the negative electrode base being melting-joined by using a laser such that a plurality of welding spots is formed on the welded portion.

Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on an axis to define a core and an outer circumference. The first electrode includes an uncoated portion at a long side end thereof and exposed out of the separator along a winding axis direction of the electrode assembly. A part of the uncoated portion is bent in a radial direction of the electrode assembly to form a bending surface region that includes overlapping layers of the uncoated portion, and in a partial region of the bending surface region, the number of stacked layers of the uncoated portion is 10 or more in the winding axis direction of the electrode assembly.

Abstract: A battery includes an electrode assembly including a first electrode, a second electrode and a separator between the first electrode and the second electrode wound around a winding axis to define a core and an outer circumferential surface, the first electrode including a first uncoated region in which an active material layer is not coated along a winding direction; a housing accommodating the electrode assembly through an open portion at a lower end thereof; a first current collector coupled to the first uncoated region and disposed in the housing; a cap to cover the open portion; and a spacer between the first current collector and the cap and having a height corresponding to a distance between the first current collector and the cap.

Abstract: An airbag system includes a seat belt; at least one airbag disposed in at least a portion of the seat belt; and an inflator connected to the at least one airbag and supplying gas to the airbag so that the airbag is inflatable.

Abstract: Provided herein are a semiconductor memory device and a method of operating the same. The semiconductor memory device may include a memory cell array, a peripheral circuit, and a control logic. The memory cell array may include a plurality of memory cells. The peripheral circuit may perform a program operation on selected memory cells coupled to a selected word line among the plurality of memory cells. The control logic may control the program operation of the peripheral circuit. The program operation may include a plurality of program loops. Each of the program loops may include a program phase and a verify phase. The verify phase may include one or more verify operations. The control logic may be further configured to count a number of the verify operations performed by the peripheral circuit in the verify phase included in one of the plurality of program loops during the program operation.

Abstract: A vehicle includes a user interface; and a controller configured to determine a predicted place where an image is predicted to have been captured according to an output of a place prediction neural network for the image selected by a user, and control the user interface to perform a route guide to the predicted place, wherein the place prediction neural network is learned from an image tagged with place information.

Abstract: An optical imaging system includes a first lens having an image-side surface that is concave; a second lens having a refractive power; a third lens having an object-side surface that is convex; a fourth lens having an image-side surface that is concave; a fifth lens having a refractive power; and a sixth lens having a refractive power and an image-side surface having an inflection point, wherein the first lens through the sixth lens are sequentially disposed in numerical order from an object side of the optical imaging system toward an imaging plane of the optical imaging system, and the optical imaging system satisfies TL/(2Y)?1.01 and 1.2?tan ?, where TL is a distance from an object-side surface of the first lens to the imaging plane, 2Y is a diagonal length of the imaging plane, and ? is half a field of view of the optical imaging system.

Abstract: A chip-on-film package includes: a lower base film including a first surface and a second surface, which are opposite to each other; an upper base film including a third surface and a fourth surface, which are opposite to each other, and is disposed on the lower base film; a first semiconductor chip mounted on the second surface of the lower base film; a second semiconductor chip mounted on the third surface of the upper base film; and an interposer film interposed between the lower and upper base films, wherein the second and third surfaces face each other.

Abstract: A light device including a substrate, and first and second light emitters spaced apart from each other, and a power source to control the first light emitter and the second light emitter, in which the first and second light emitters include a light emitting region, a wavelength conversion layer disposed on the light emitting region, and a lateral reflection layer covering a region of a side of the light emitting region and the wavelength conversion layer, the first light emitter and the second light emitter are configured to output the same or different magnitudes of power by receiving the same or different magnitudes of current, the first and second light emitters are respectively configured to emit first light and second light, the first light emitter is electrically connected to the second light emitter through a common electrode.

Abstract: A memory device, and a method of operating the memory device, includes a memory block in which a plurality of cell pages are coupled to each of word lines. The memory device also includes a peripheral circuit configured to adjust a time point at which a verify voltage is applied to a selected word line among the word lines according to an order of performing a program operation during a verify operation of a selected cell page. The memory device further includes a control logic circuit configured to transmit, to the peripheral circuit, an operation code for adjusting a time point at which the verify voltage is output.

Abstract: The semiconductor device includes a substrate having a cell area and a via area; a transistor and a logic interconnection disposed over the substrate; a lower insulating layer covering the transistor and the logic interconnection; a lower conductive layer on the lower insulating layer in the cell area; a support pattern disposed on the lower insulating layer in the via area; a lower via plug having a side surface in contact with the support pattern and a bottom surface in contact with the logic interconnection; a word line stack disposed on the lower conductive layer in the cell area; an dielectric layer stack disposed on the support pattern in the via area; a vertical channel pillar penetrating the word line stack to be connected to the lower conductive layer; and an upper via plug penetrating the dielectric layer stack to be vertically aligned with the lower via plug.