Abstract: In an apparatus for supporting a wafer, the apparatus may remove particles thereon. The apparatus may include a conductive support configured to support the wafer, and a power source electrically connected to the conductive support, the power source configured to provide at least one current to the conductive support to remove particles from the conductive support.

Abstract: In an apparatus for supporting a wafer, the apparatus may remove particles thereon. The apparatus may include a conductive support configured to support the wafer, and a power source electrically connected to the conductive support, the power source configured to provide at least one current to the conductive support to remove particles from the conductive support.

Abstract: In an apparatus for performing an edge exposure process on an edge portion of a photoresist film that is formed on a semiconductor wafer, light provided from a light source is formed to have a ring shape corresponding to a shape of an edge portion of the wafer by an optical unit. The ring-shaped light is irradiated onto the edge portion of the wafer through a ring lens. Thus, the light efficiency is improved. Further, since there is no need to rotate the wafer, a side surface profile of the photoresist film is improved.

Abstract: A layer on a semiconductor substrate is scanned with a stream of heated gas to bake the layer. A baking apparatus includes a stage that supports the semiconductor substrate and a gas injector that expels the stream of the heated gas. The stage and the gas injector are moved relative to one another to scan the substrate with the stream of heated gas and thus, bake the layer that is disposed thereon. Fumes emanating from the layer are removed while the layer is scanned. To this end, the apparatus also includes a vacuum head that is fixed in position relative to the gas injector.