Patents by Inventor Jae-joon Lee

Jae-joon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11529217
    Abstract: A dental implant includes a fixture implanted into an alveolar bone, an abutment fixed to an upper part of the fixture and having a core hole formed in a center of an upper surface of the abutment, a crown bonded to an upper outer side of the abutment and having a passage vertically formed through a center of the crown, and a cover screw having a screw screw-fastened to the core hole and a head in close contact between an upper surface of the abutment and a lower surface of the crow to cover the core hole, in which, when the screw is released by a tool passing through the passage, the head moves up so that the cover screw provides a separating force to the crown. The dental implant may facilitate a separation of the crown and prevent binding force from weakening, thereby enabling an efficient procedure and management.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: December 20, 2022
    Inventor: Jae-joon Lee
  • Publication number: 20200337812
    Abstract: A dental implant includes a fixture implanted into an alveolar bone, an abutment fixed to an upper part of the fixture and having a core hole formed in a center of an upper surface of the abutment, a crown bonded to an upper outer side of the abutment and having a passage vertically formed through a center of the crown, and a cover screw having a screw screw-fastened to the core hole and a head in close contact between an upper surface of the abutment and a lower surface of the crow to cover the core hole, in which, when the screw is released by a tool passing through the passage, the head moves up so that the cover screw provides a separating force to the crown. The dental implant may facilitate a separation of the crown and prevent binding force from weakening, thereby enabling an efficient procedure and management.
    Type: Application
    Filed: December 27, 2018
    Publication date: October 29, 2020
    Inventor: Jae-joon LEE
  • Publication number: 20140124434
    Abstract: A filter is disclosed. The filter in accordance with an embodiment of the present invention is installed in a conduit through which resin mixed with filler passes, and includes a plate having an area corresponding to a horizontal section of the conduit and having a plurality of openings formed therein for filtering the filler. Each of the plurality of openings includes a first opening area and the second opening area that intersect with each other and are each elongated in one direction and have a predetermined width for filtering the filler.
    Type: Application
    Filed: October 3, 2013
    Publication date: May 8, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae-Joon Lee, Kyo-Young Son, Choon-Keun Lee, Joung-Gul Ryu
  • Patent number: 8422248
    Abstract: An electromagnetic bandgap structure, including: a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, having one end part which is connected to the first metal layer; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer, whereas the other end part of the via is connected to a via land which is placed in a hole formed in the metal plate, and the via land is connected to the metal plate through a metal line.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: April 16, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Han Kim, Jae-Joon Lee, Mi-Ja Han, Dae-Hyun Park
  • Publication number: 20110303452
    Abstract: An electromagnetic bandgap structure, including: a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, having one end part which is connected to the first metal layer; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer, whereas the other end part of the via is connected to a via land which is placed in a hole formed in the metal plate, and the via land is connected to the metal plate through a metal line.
    Type: Application
    Filed: August 22, 2011
    Publication date: December 15, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Han Kim, Jae-Joon Lee, Mi-Ja Han, Dae-Hyun Park
  • Patent number: 8035991
    Abstract: Disclosed are an electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit. The electromagnetic bandgap structure in which a first metal layer, a first dielectric layer, a second dielectric layer and a second metal layer are stacked can include a first metal plate, formed between the first dielectric layer and the second dielectric layer; a second metal plate, formed on a same planar surface as the first metal plate, accommodated into a hole which is formed in the first metal plate and electrically connected to the first metal plate through a metal line; and a via, connecting the second metal plate to any one of the first metal layer and the second metal layer. With the present invention, the electromagnetic bandgap structure can be not only miniaturized but also have a low bandgap frequency.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: October 11, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Han Kim, Jae-Joon Lee, Mi-Ja Han, Dae-Hyun Park
  • Publication number: 20110214723
    Abstract: Provided are a dye-sensitized solar cell and a method for manufacturing the dye-sensitized solar cell using a carbon nanotube (CNx) doped with nitrogen, wherein the dye-sensitized solar cell using the carbon nanotube (CNx) doped with nitrogen has an improved conductivity and open circuit voltage as compared to those using the carbon nanotube (CNT) and also a high connectivity between a transparent electrode and an oxide semiconductor
    Type: Application
    Filed: July 23, 2010
    Publication date: September 8, 2011
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jeung-Ku Kang, Ga-In Lee, Weon-Ho Shin, Jae-Joon Lee, Narayan Chandra Deb Nath, Subrata Sarker
  • Patent number: 7965521
    Abstract: An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size.
    Type: Grant
    Filed: January 25, 2008
    Date of Patent: June 21, 2011
    Assignee: Samsung Electro-Mechantics Co., Ltd.
    Inventors: Mi-Ja Han, Han Kim, Dae-Hyun Park, Jae-Joon Lee
  • Publication number: 20100148348
    Abstract: A package substrate is disclosed. The package substrate as a printed circuit board, in which a semiconductor chip is mounted on one side thereof and the other side thereof is mounted on a main board, can include a substrate part, a first pad, which is formed on one side of the substrate part such that the first pad is electrically connected to the semiconductor chip, and a first solder resist layer, which is formed on one surface of the substrate part such that the first pad is exposed. Here, the first solder resist layer is divided into a pad portion and a dummy portion, the first pad is exposed in the pad portion, and the dummy portion is thinner than the pad portion. The package substrate can contribute to the formation of a structure in which thermal expansion coefficients are symmetrical between the top and bottom, thus preventing the warpage.
    Type: Application
    Filed: June 8, 2009
    Publication date: June 17, 2010
    Inventors: Jae-Joon LEE, Jin-Yong An, Ki-Hwan Kim, Seok-Kyu Lee
  • Publication number: 20100126765
    Abstract: A method of manufacturing a multi-layer PCB having external contact pads formed on one side can include: forming an outermost insulation layer, in which openings are formed corresponding with the external contact pads; forming a mask, in which openings are formed corresponding with the external contact pad and with a circuit pattern, on the outermost insulation layer; forming the external contact pads and the circuit pattern in the openings of the outermost insulation layer and the openings of the mask; removing the mask; forming a build-up layer by stacking layers over the outermost insulation layer such that the external contact pads and the circuit pattern are covered; forming a first solder resist layer on the build-up layer; and forming a second solder resist layer on an opposite side of the outermost insulation layer; and forming openings in the second solder resist layer such that the external contact pads are exposed.
    Type: Application
    Filed: September 29, 2009
    Publication date: May 27, 2010
    Inventors: Ki-Hwan KIM, Jin-Yong An, Jae-Joon Lee
  • Publication number: 20090283302
    Abstract: Disclosed are a printed circuit board and a manufacturing method thereof. The printed circuit board in accordance with the present invention includes: a circuit laminate, a solder resist laminated on the circuit laminate, a metal support layer formed on the solder resist, a stiffener formed on the metal support layer.
    Type: Application
    Filed: January 7, 2009
    Publication date: November 19, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seok-Kyu Lee, Shuhichi Okabe, Seung-Hyun Cho, Jae-Joon Lee
  • Patent number: 7620971
    Abstract: A set-top box, which allows a user to input a key command in real time while displaying an animation sequence on an on-screen display (OSD) screen, and a method of outputting the OSD data of the set-top box is provided. The set-top box includes OSD control module that divides OSD animation data into a plurality of subsets, loads each of the subsets in every operating cycle, determines whether a user has input a key command in every operating cycle, and selectively provides the loaded subsets based on the determination result in every operating cycle, wherein the OSD animation data realizes an animation sequence when displayed. The set-top box further includes a combination control module that receives the loaded subsets of the OSD animation data from the OSD control module and overlays the data onto the decoded broadcast signal and provides the overlaid result to a display device.
    Type: Grant
    Filed: June 29, 2005
    Date of Patent: November 17, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jae-joon Lee
  • Publication number: 20090073670
    Abstract: A multilayered printed circuit board and a fabricating method thereof are disclosed. A method that includes repeating processes of forming at least one circuit pattern, and at least one insulation layer that covers the circuit pattern, over a carrier and interconnecting circuit patterns on different layers with vias; stacking a metal stiffener over the insulation layer; repeating processes of forming at least one insulation layer and at least one circuit pattern over the stiffener and interconnecting circuit patterns on different layers with vias; and removing the carrier, can be used to reduce warpage in the board and improve workability.
    Type: Application
    Filed: March 17, 2008
    Publication date: March 19, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong-Kuk Hong, Jin-Yong An, Jae-Joon Lee
  • Publication number: 20080266026
    Abstract: An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size.
    Type: Application
    Filed: January 25, 2008
    Publication date: October 30, 2008
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Mi-Ja Han, Han Kim, Dae-Hyun Park, Jae-Joon Lee
  • Publication number: 20080185179
    Abstract: Disclosed are an electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit. The electromagnetic bandgap structure in which a first metal layer, a first dielectric layer, a second dielectric layer and a second metal layer are stacked can include a first metal plate, formed between the first dielectric layer and the second dielectric layer; a second metal plate, formed on a same planar surface as the first metal plate, accommodated into a hole which is formed in the first metal plate and electrically connected to the first metal plate through a metal line; and a via, connecting the second metal plate to any one of the first metal layer and the second metal layer. With the present invention, the electromagnetic bandgap structure can be not only miniaturized but also have a low bandgap frequency.
    Type: Application
    Filed: January 30, 2008
    Publication date: August 7, 2008
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Han Kim, Jae-Joon Lee, Mi-Ja Han, Dae-Hyun Park
  • Publication number: 20070018335
    Abstract: A flip chip BGA board is disclosed, in which each of the corners of the board is removed to minimize warpage of the board due to heat applied during the manufacturing process. Embodiments of the invention allow the production of thin boards by preventing warpage of the board, and may provide a board high in reliability since the risk of the chip being separated from the board is reduced.
    Type: Application
    Filed: July 11, 2006
    Publication date: January 25, 2007
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung-Hyun Cho, Soon-Jin Cho, Jae-Joon Lee, Se-Jong Oh
  • Publication number: 20060003015
    Abstract: The present invention relates to a food composition effective for the treatment of oral and throat diseases and a method of producing the same, and more particularly to a food composition effective for the treatment of oral and throat diseases, made of crude drug materials exhibiting no side effects to the human body and a method of producing the same. The food composition in accordance with the present invention comprises 25 to 45% by weight burnt alum, 0.001 to 5% by weight croton and 55 to 75% by weight gallnut, and thereby can provide excellent antibacterial and anticancer effects for oral microorganisms and mouth squamous cell carcinoma cell lines KB.
    Type: Application
    Filed: April 11, 2005
    Publication date: January 5, 2006
    Inventor: Jae-joon Lee
  • Publication number: 20060005220
    Abstract: A set-top box, which allows a user to input a key command in real time while displaying an animation sequence on an on-screen display (OSD) screen, and a method of outputting the OSD data of the set-top box. The set-top box includes a reception module that receives digital broadcast signals, a demultiplexer that extracts a broadcast signal of a channel selected by a user from the received digital broadcast signals, a decoding module that decodes the extracted broadcast signal using a predetermined method, an on-screen display (OSD) control module that divides OSD animation data into a plurality of subsets, loads each of the subsets in every operating cycle, determines whether a user has input a key command in every operating cycle, and selectively provides the loaded subsets based on the determination result in every operating cycle, wherein the OSD animation data realizes an animation sequence when displayed.
    Type: Application
    Filed: June 29, 2005
    Publication date: January 5, 2006
    Inventor: Jae-joon Lee
  • Patent number: 5742413
    Abstract: A circuit of duplexing supervisory modules for use in a data transmission system having an optical fiber system, a multiplexer/demultiplexer system, a work station and a personal computer has a primary information collection supervisory circuit connected to the first and second optical fiber systems, for collecting primary information relating to a local site; a secondary information collection supervisory circuit doubly connected to the primary information collection supervisory circuit, for collecting secondary information in dependence upon the first information; and a tertiary information collection supervisory circuit connected to the work station and doubly connected to the secondary information collection supervisory circuit, for collecting tertiary information in dependence upon the secondary information and providing tertiary information to the work station.
    Type: Grant
    Filed: May 28, 1996
    Date of Patent: April 21, 1998
    Assignee: SamSung Electronics Co., Ltd.
    Inventors: Il-Hyunk Yun, Jae-Joon Lee