Patents by Inventor Jae-kang KOH

Jae-kang KOH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10644008
    Abstract: A first bit line structure is disposed between a first contact structure and a second contact structure. A first air spacer is interposed between the first contact structure and the first bit line structure. A first separation space is connected to an air entrance of the first air spacer and interposed between the first contact structure and the first bit line structure. A cover insulating pattern with a gap portion is interposed between the first contact structure and the second contact structure. The gap portion has a downwardly-decreasing width. An air capping pattern covers the cover insulating pattern to seal the first separation space.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: May 5, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun-won Lee, Jae-kang Koh, Geum-bi Mun, Byoung-deog Choi
  • Publication number: 20190067294
    Abstract: A first bit line structure is disposed between a first contact structure and a second contact structure. A first air spacer is interposed between the first contact structure and the first bit line structure. A first separation space is connected to an air entrance of the first air spacer and interposed between the first contact structure and the first bit line structure. A cover insulating pattern with a gap portion is interposed between the first contact structure and the second contact structure. The gap portion has a downwardly-decreasing width. An air capping pattern covers the cover insulating pattern to seal the first separation space.
    Type: Application
    Filed: January 15, 2018
    Publication date: February 28, 2019
    Inventors: Jun-won LEE, Jae-kang KOH, Geum-bi MUN, Byoung-deog CHOI