Patents by Inventor Jae-Ki Sim

Jae-Ki Sim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11333607
    Abstract: Provided is a fluorescent signal detection apparatus including a reaction unit including a kit loading part in which a diagnostic kit is inserted to one area, a light source unit including a light source and a first barrel configured to surround the light source, a light receiving unit provided at one side of the light source unit and including a detection part and a second barrel configured to surround the detection part, and a case configured to surround the reaction unit, the light source unit, and the light receiving unit. Here, the diagnostic kit includes measuring parts and microstructures configured to accommodate a target to be measured, which is labeled by a fluorescent dye, and the microstructures are provided on the measuring parts.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: May 17, 2022
    Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, YD Diagnostics Co., Ltd.
    Inventors: Dae-Sik Lee, Mi Ran Kang, Sung Mo Hwang, Jae Ki Sim
  • Publication number: 20200103348
    Abstract: Provided is a fluorescent signal detection apparatus including a reaction unit including a kit loading part in which a diagnostic kit is inserted to one area, a light source unit including a light source and a first barrel configured to surround the light source, a light receiving unit provided at one side of the light source unit and including a detection part and a second barrel configured to surround the detection part, and a case configured to surround the reaction unit, the light source unit, and the light receiving unit. Here, the diagnostic kit includes measuring parts and microstructures configured to accommodate a target to be measured, which is labeled by a fluorescent dye, and the microstructures are provided on the measuring parts.
    Type: Application
    Filed: October 2, 2019
    Publication date: April 2, 2020
    Inventors: Dae-Sik LEE, Mi Ran KANG, Sung Mo HWANG, Jae Ki SIM
  • Patent number: 10088412
    Abstract: Provided is an apparatus for analyzing a bio-material. According to an embodiment of the inventive concept, the apparatus may include a light distribution part having grooves, a reflective layer provided on the grooves, and a light emitting part configured to emit light to the light distribution part. The grooves may be recessed from a top surface of the light distribution part, and sidewalls of the grooves may be inclined with respect to the top surface of the light distribution part. The grooves may include a first groove and a second groove. A distance between the light emitting part and the second groove may be greater than that between the light emitting part and the first groove, and a bottom surface of the second groove may be disposed at a level lower than that of a bottom surface of the first groove.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: October 2, 2018
    Assignee: ELECTRONICS & TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Dae-Sik Lee, Moon Youn Jung, Jae-Ki Sim
  • Publication number: 20180088030
    Abstract: Provided is an apparatus for analyzing a bio-material. According to an embodiment of the inventive concept, the apparatus may include a light distribution part having grooves, a reflective layer provided on the grooves, and a light emitting part configured to emit light to the light distribution part. The grooves may be recessed from a top surface of the light distribution part, and sidewalls of the grooves may be inclined with respect to the top surface of the light distribution part. The grooves may include a first groove and a second groove. A distance between the light emitting part and the second groove may be greater than that between the light emitting part and the first groove, and a bottom surface of the second groove may be disposed at a level lower than that of a bottom surface of the first groove.
    Type: Application
    Filed: August 24, 2017
    Publication date: March 29, 2018
    Inventors: Dae-Sik LEE, Moon Youn JUNG, Jae-Ki SIM
  • Patent number: 7090742
    Abstract: A device for producing inductively coupled plasma and method thereof, wherein a coil is uniformly and dispersedly arranged on a lateral wall in a chamber, instead of the prior device of a permanent magnet mounted on an external wall of the chamber, and the coil is so disposed as to allow a magnetic field formed from the coil to be mutually reinforced at a central portion of the coil, such that charged particles created inside the chamber are effectively isolated relative to the lateral wall of the chamber, thereby enabling to produce plasmas of high density and high uniformity. Intensity and frequency of power source applied to the coil are adjusted to enable to adjust the density and uniformity of plasmas produced in the chamber according to required process characteristics in etching or depositing process using plasmas such that flexibility is provided to the process using the plasmas and design of new process can be free from restriction calling for process chamber configure.
    Type: Grant
    Filed: February 7, 2003
    Date of Patent: August 15, 2006
    Inventors: Kwang-Ho Kwon, Jae-Ki Sim
  • Publication number: 20050130450
    Abstract: A device for producing inductively coupled plasma and method thereof, wherein a coil is uniformly and dispersedly arranged on a lateral wall in a chamber, instead of the prior device of a permanent magnet mounted on an external wall of the chamber, and the coil is so disposed as to allow a magnetic field formed from the coil to be mutually reinforced at a central portion of the coil, such that charged particles created inside the chamber are effectively isolated relative to the lateral wall of the chamber, thereby enabling to produce plasmas of high density and high uniformity. Intensity and frequency of power source applied to the coil are adjusted to enable to adjust the density and uniformity of plasmas produced in the chamber according to required process characteristics in etching or depositing process using plasmas such that flexibility is provided to the process using the plasmas and design of new process can be free from restriction calling for process chamber configure.
    Type: Application
    Filed: February 7, 2003
    Publication date: June 16, 2005
    Applicant: Kwang-Ho KWON
    Inventors: Kwang-Ho Kwon, Jae-Ki Sim