Abstract: A light-emitting element includes a first semiconductor layer doped to have a first polarity, a second semiconductor layer doped to have a second polarity different from the first polarity, a light-emitting layer disposed between the first and second semiconductor layers, a shell layer formed on side surfaces of the first semiconductor layer, the light-emitting layer, and the second semiconductor layer, the shell layer including a divalent metal element, and an insulating film covering an outer surface of the shell layer and surrounding the side surface of the light-emitting layer.

Abstract: A pouch for in-vitro diagnostic items having a pocket portion of a diagnosis item with a storage space of the diagnosis item therein, including a buffer supporter formation portion, wherein the buffer supporter formation portion is formed by extending in a plate shape from one side of the pocket portion of the diagnosis item, a buffer support hole is formed penetratingly in a thickness direction in one area of the buffer supporter formation portion, and a buffer supporter is formed by bending motion in the buffer supporter formation portion separated from the pocket portion of the diagnosis item, wherein the buffer supporter includes a buffer-mounted shelf for mounting the buffer, a left leg portion for supporting shelf to support the left end of the buffer-mounted shelf against the bottom, and a right leg portion for supporting shelf to support the right end of the buffer-mounted shelf against the bottom.

Abstract: Provided is a stack molding machine including an upper mold having formed therein a first runner and a first gate serving as a path of a resin material, a first intermediate plate provided under and combined with the upper mold, and having formed therein a first molding connected to the first gate to mold at least a portion on a first substrate placed under the first intermediate plate, a dummy plate provided under and spaced a certain distance apart from the first intermediate plate, a second intermediate plate provided under the dummy plate, and having formed therein a second molding connected to a second gate to mold at least a portion under a second substrate placed under the dummy plate, and a lower mold having formed therein a second runner and the second gate serving as a path of the resin material, and combined with the second intermediate plate.

Abstract: A method of fabricating a battery protection circuit package according to one aspect of the present invention includes forming a first mounting structure by mounting battery protection circuit elements on a printed circuit board (PCB), forming a second mounting structure by mounting the first mounting structure on a lead frame which comprises an input/output terminal portion for external connection and at least one metal tab for battery cell connection, forming an encapsulation structure by encapsulating the second mounting structure with a molding material to encapsulate at least a part of the battery protection circuit elements while exposing the input/output terminal portion and the at least one metal tab of the lead frame, and bonding at least one flexible printed circuit board (FPCB) to the input/output terminal portion of the encapsulation structure.

Abstract: Provided is a battery protection circuit module package capable of easily achieving high integration and size reduction. The battery protection circuit module package includes a terminal lead frame including a first internal connection terminal lead and a second internal connection terminal lead provided at two edges of the terminal lead frame and electrically connected to electrode terminals of a battery bare cell, and a plurality of external connection terminal leads provided between the first and second internal connection terminal leads and serving as a plurality of external connection terminals, and a device package including a substrate mounted on the terminal lead frame to be electrically connected to the terminal lead frame, and providing a battery protection circuit device thereon.

Abstract: A method of fabricating a battery protection circuit package according to one aspect of the present invention includes forming a first mounting structure by mounting battery protection circuit elements on a printed circuit board (PCB), forming a second mounting structure by mounting the first mounting structure on a lead frame which comprises an input/output terminal portion for external connection and at least one metal tab for battery cell connection, forming an encapsulation structure by encapsulating the second mounting structure with a molding material to encapsulate at least a part of the battery protection circuit elements while exposing the input/output terminal portion and the at least one metal tab of the lead frame, and bonding at least one flexible printed circuit board (FPCB) to the input/output terminal portion of the encapsulation structure.

Abstract: Provided is a battery protection circuit module package capable of easily achieving high integration and size reduction. The battery protection circuit module package includes a terminal lead frame including a first internal connection terminal lead and a second internal connection terminal lead provided at two edges of the terminal lead frame and electrically connected to electrode terminals of a battery bare cell, and a plurality of external connection terminal leads provided between the first and second internal connection terminal leads and serving as a plurality of external connection terminals, and a device package including a substrate mounted on the terminal lead frame to be electrically connected to the terminal lead frame, and providing a battery protection circuit device thereon.

Abstract: Disclosed is a battery protection module package (PMP). The battery PMP according to an embodiment of the present invention includes a lead frame provided with a plurality of external terminals thereon, a printed circuit board stacked on the lead frame, and a plurality of internal terminals, a protection integrated chip (IC), a field effect transistor (FET), resistors, and capacitors disposed on the printed circuit board and electrically connected to each other, wherein the resistors and the capacitors are mounted on a pattern of the printed circuit board using surface mount technology (SMT), and wherein the plurality of internal terminals are electrically connected to the plurality of external terminals.

Abstract: Disclosed is a battery protection circuit module package capable of easily achieving high integration and size reduction. The battery protection circuit module package includes a terminal lead frame including a first internal connection terminal lead and a second internal connection terminal lead provided at two edges of the terminal lead frame and electrically connected to electrode terminals of a battery bare cell, and a plurality of external connection terminal leads provided between the first and second internal connection terminal leads and serving as a plurality of external connection terminals, and a device package including a substrate mounted on the terminal lead frame to be electrically connected to the terminal lead frame, and providing a battery protection circuit device thereon.

Abstract: Disclosed is a battery protection module package (PMP). The battery PMP according to an embodiment of the present invention includes a lead frame provided with a plurality of external terminals thereon, a printed circuit board stacked on the lead frame, and a plurality of internal terminals, a protection integrated chip (IC), a field effect transistor (FET), resistors, and capacitors disposed on the printed circuit board and electrically connected to each other, wherein the resistors and the capacitors are mounted on a pattern of the printed circuit board using surface mount technology (SMT), and wherein the plurality of internal terminals are electrically connected to the plurality of external terminals.

Abstract: The present invention relates to an immunochromatographic strip and a kit comprising the same.