Abstract: An apparatus for treating a substrate includes a housing having a treatment space inside, a gas supply unit that supplies a hydrophobic gas into the treatment space to hydrophobicize the substrate, and a support unit that supports the substrate in the treatment space. The support unit includes a support plate, a heating member that heats the substrate placed on the support plate, and a height adjustment member that changes a position of the substrate between a first position spaced apart upward from an upper surface of the support plate by a first distance and a second position spaced apart upward from the upper surface of the support plate by a second distance, and the second position is a higher position than the first position.

Abstract: A cooling unit for cooling a substrate includes a plate having a fluid channel formed therein and a fluid supply member that supplies a fluid into the fluid channel. The fluid channel includes a plurality of first fluid channels, each of which is connected with the fluid supply member at one end thereof and a second fluid channel that is connected with opposite ends of the plurality of first fluid channels and that discharges the fluid. A buffer space that connects the opposite ends of the plurality of first fluid channels and one end of the second fluid channel is formed inside the plate.

Abstract: Disclosed is a method for manufacturing a cooling plate for cooling a substrate, including an operation of manufacturing a coolant pipe by using a tubular pipe, an operation of inserting the coolant pipe into a casting mold that defines a plate, and an operation of casting the cooling plate by injecting a molten metal into the casting mold.

Abstract: A supporting unit is provided to support a substrate. The supporting unit includes a supporting plate including a pressure reducing fluid passage formed inside the supporting plate, and a flanger provided in a groove formed in a top surface of the supporting plate. A lower area of the flanger is connected to the pressure reducing fluid passage in the groove, and the flanger moves up and down by reduced pressure applied through the pressure reducing fluid passage.

Abstract: Embodiments of the inventive concept provides an apparatus for treating a substrate. An embodiment of the inventive concept comprises a housing having a process space therein; and a supporting unit supporting a substrate in the process space, and the supporting unit comprises a supporting plate supporting the substrate; a heater member provide in the supporting plate and heating the substrate; and a cooling unit provided below the heater member and cooling the supporting plate, the cooling unit comprises a cooling plate spaced apart from the heater member; and a nozzle provided in the cooling plate, and supplying a cooling gas to a bottom surface of the heater member; and a driver moving the cooling plate between a standby position spaced a first distance apart from the heater member and a cooling position spaced a second distance apart from the heater member, the second distance is shorter than the first distance.

Abstract: An apparatus for treating a substrate includes a housing having a treatment space inside, a gas supply unit that supplies a hydrophobic gas into the treatment space to hydrophobicize the substrate, and a support unit that supports the substrate in the treatment space. The support unit includes a support plate, a heating member that heats the substrate placed on the support plate, and a height adjustment member that changes a position of the substrate between a first position spaced apart upward from an upper surface of the support plate by a first distance and a second position spaced apart upward from the upper surface of the support plate by a second distance, and the second position is a higher position than the first position.

Abstract: A cooling unit for cooling a substrate includes a plate having a fluid channel formed therein and a fluid supply member that supplies a fluid into the fluid channel. The fluid channel includes a plurality of first fluid channels, each of which is connected with the fluid supply member at one end thereof and a second fluid channel that is connected with opposite ends of the plurality of first fluid channels and that discharges the fluid. A buffer space that connects the opposite ends of the plurality of first fluid channels and one end of the second fluid channel is formed inside the plate.

Abstract: A supporting unit is provided to support a substrate. The supporting unit includes a supporting plate including a pressure reducing fluid passage formed inside the supporting plate, and a flanger provided in a groove formed in a top surface of the supporting plate. A lower area of the flanger is connected to the pressure reducing fluid passage in the groove, and the flanger moves up and down by reduced pressure applied through the pressure reducing fluid passage.