Abstract: Disclosed are an automatic abrasion compensation system of a lower plate and a wafer lapping apparatus having the same. The automatic abrasion compensation system reduces wafer misloading and errors in wafer loading inspection occurring when the distance between the lower plate and a transfer robot is gradually increased due to abrasion of the lower plate during a lapping process. The automatic abrasion compensation system includes an ultrasonic sensor provided on the transfer robot, a jig located directly under the ultrasonic sensor and mounted on the lower plate, a controller configured to acquire measurement distance information by measuring a distance from the jig through the ultrasonic sensor, to compare the measurement distance information with set reference distance information and to generate an adjustment control signal, and a driver configured to automatically adjust a Z-axis position of the transfer robot depending on the adjustment control signal transmitted by the controller.

Abstract: Disclosed are an automatic abrasion compensation system of a lower plate and a wafer lapping apparatus having the same. The automatic abrasion compensation system reduces wafer misloading and errors in wafer loading inspection occurring when the distance between the lower plate and a transfer robot is gradually increased due to abrasion of the lower plate during a lapping process. The automatic abrasion compensation system includes an ultrasonic sensor provided on the transfer robot, a jig located directly under the ultrasonic sensor and mounted on the lower plate, a controller configured to acquire measurement distance information by measuring a distance from the jig through the ultrasonic sensor, to compare the measurement distance information with set reference distance information and to generate an adjustment control signal, and a driver configured to automatically adjust a Z-axis position of the transfer robot depending on the adjustment control signal transmitted by the controller.

Abstract: The wafer polishing system is disclosed. The wafer polishing system may comprise a polishing unit; a slurry distribution unit mounted on the polishing unit and distributing a slurry flowing into the polishing unit for wafer polishing; a slurry tank connected to the slurry distribution unit and storing the slurry; a slurry pump connected to the polishing unit and the slurry tank for transferring the slurry from the slurry tank to the polishing unit; a first circulation line in which one side is connected to the slurry tank; a second circulation line in which one side is connected to the other side of the first circulation line and the other side is connected to the slurry distribution unit; and a cleaning liquid supply unit connected to the second circulation line for supplying a cleaning liquid flowing through the second circulation line.

Abstract: The wafer polishing system is disclosed. The wafer polishing system may comprise a polishing unit; a slurry distribution unit mounted on the polishing unit and distributing a slurry flowing into the polishing unit for wafer polishing; a slurry tank connected to the slurry distribution unit and storing the slurry; a slurry pump connected to the polishing unit and the slurry tank for transferring the slurry from the slurry tank to the polishing unit; a first circulation line in which one side is connected to the slurry tank; a second circulation line in which one side is connected to the other side of the first circulation line and the other side is connected to the slurry distribution unit; and a cleaning liquid supply unit connected to the second circulation line for supplying a cleaning liquid flowing through the second circulation line.