Abstract: The present invention relates to a light emitting element package manufacturing method and a display apparatus manufacturing method. According to an embodiment of the present invention, a light emitting element package manufacturing method may be provided, the method comprising the steps of: providing a substrate having, on one surface, a plurality of first pads and a plurality of second pads; arranging a plurality of light emitting elements on the substrate so that the light emitting elements are electrically connected to the plurality of second pads, respectively; arranging a plurality of joint parts on the one surface of the substrate so that the joint parts are electrically connected to the plurality of first pads, respectively; and sawing the substrate so as to form a light source that has at least one of the plurality of light emitting elements.

Abstract: A power module includes: a first substrate having metal plates formed on one surface thereof; a second substrate spaced apart from the first substrate and having metal plates formed on one surface thereof facing the metal plates of the first substrate; a plurality of power elements disposed between the first substrate and the second substrate; a first electrode formed on the first substrate of each of the plurality of power elements; and a second electrode formed on the second surface of each of the plurality of power elements, where the plurality of power elements comprise a first power element in which the first electrode is bonded to the metal plates of the second substrate; and a second power element in which the first electrode is bonded to the metal plates of the first substrate.

Abstract: A power module includes: a first substrate having metal plates formed on one surface thereof; a second substrate spaced apart from the first substrate and having metal plates formed on one surface thereof facing the metal plates of the first substrate; a plurality of power elements disposed between the first substrate and the second substrate; a first electrode formed on the first substrate of each of the plurality of power elements; and a second electrode formed on the second surface of each of the plurality of power elements, where the plurality of power elements comprise a first power element in which the first electrode is bonded to the metal plates of the second substrate; and a second power element in which the first electrode is bonded to the metal plates of the first substrate.

Abstract: A power module includes a first substrate including a first metal plate, a second substrate spaced apart from the first substrate and having a second metal facing the first substrate, a plurality of power elements that are disposed between the first substrate and the second substrate and include a first electrode and a second electrode. The plurality of power elements include a first power element having the first electrode bonded to the second metal plate, and a second power element having the first electrode bonded to the first metal plate.

Abstract: A power module includes a first substrate including a first metal plate, a second substrate spaced apart from the first substrate and having a second metal facing the first substrate, a plurality of power elements that are disposed between the first substrate and the second substrate and include a first electrode and a second electrode. (New) The plurality of power elements include a first power element having the first electrode bonded to the second metal plate, and a second power element having the first electrode bonded to the first metal plate.