Patents by Inventor JaeSick Bae

JaeSick Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereof
    Patent number: 7994625
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing an internal structure substrate having an internal structure substrate cavity; mounting an internal structure die above the internal structure substrate; encapsulating the internal structure die with an internal structure encapsulation to form an internal structure package; forming an internal structure protrusion in the internal structure encapsulation below the internal structure substrate cavity; mounting the internal structure package above a substrate; and encapsulating the internal structure package above the substrate with an encapsulation.
    Type: Grant
    Filed: November 18, 2008
    Date of Patent: August 9, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: DaeSik Choi, DeokKyung Yang, Jong-Woo Ha, Byoung Wook Jang, JaeSick Bae, Seung Won Kim
  • INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING AN INTERNAL STRUCTURE PROTRUSION AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20100123232
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing an internal structure substrate having an internal structure substrate cavity; mounting an internal structure die above the internal structure substrate; encapsulating the internal structure die with an internal structure encapsulation to form an internal structure package; forming an internal structure protrusion in the internal structure encapsulation below the internal structure substrate cavity; mounting the internal structure package above a substrate; and encapsulating the internal structure package above the substrate with an encapsulation.
    Type: Application
    Filed: November 18, 2008
    Publication date: May 20, 2010
    Inventors: DaeSik Choi, DeokKyung Yang, Jong-Woo Ha, Byoung Wook Jang, JaeSick Bae, Seung Won Kim