Abstract: Provided are a device and method for detecting input features of an artificial neural network model. The method includes comparing an output of an artificial neural network model with a first input to extract a first local attribution for a feature of the first input, extracting a portion of the first local attribution of which an absolute value is a threshold or more using a mask extractor, and updating the first input with a second input by applying an extraction result to the first input.

Abstract: An embodiment vehicle air conditioner includes an air conditioning device connected to a blower device to receive air supplied from the blower device, a heat exchange core provided in the air conditioning device and disposed in parallel with a flow direction of the air supplied from the blower device, a partition wall disposed to divide the heat exchange core into a first core part disposed to be close in distance to the blower device and a second core part disposed to be distant from the blower device, such that the air supplied from the blower device is distributed and supplied to the first core part and the second core part, and an air guide provided in a connection portion between the blower device and the air conditioning device and configured to guide the air to be supplied to the second core part of the heat exchange core.

Abstract: An embodiment mounting and demounting device for a wireless electronic device includes a pair of holder wings arranged symmetrically to each other and configured to press both sides of the wireless electronic device, a holder wing adjusting device configured to apply a force to adjust a gap between the holder wings using a driving force of a drive motor, a lifting implementing device configured to interlock with the holder wing adjusting device to lift the wireless electronic device upward in a case in which the holder wings are spread apart by a predetermined reference gap or more, a lower housing wrapped around a lower side of the holder wings, the holder wing adjusting device, and the lifting implementing device, and an upper housing coupled to an upper side of the lower housing and configured to allow the wireless electronic device to pass through in an up and down direction.

Abstract: A method of providing an explanation of an artificial intelligence model based on a plug-and-plug mode includes a service provider server setting a type of an artificial intelligence model, a plug-and-play manager recognizing an artificial intelligence model and creating a list of available explanation modules on the basis of a recognition result when the artificial intelligence model is input, the service provider server providing key information on explanation modules to a user terminal, the user terminal selecting one of the explanation modules and notifying the service provider server of the selected explanation module, the plug-and-play manager deriving the selected explanation module from among the explanation modules in the list, and the derived explanation module providing an explanation of the input artificial intelligence model to the user terminal.

Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.

Abstract: An air conditioning device for a vehicle includes: a housing having an inside divided into an inflow space, a heat exchange space, and an outflow space, which are straightly arranged, and having a plurality of discharge ports, which communicates with an interior, at the inflow space; a blowing unit disposed at the inflow space of the housing and configured to blow air; a heat exchange unit disposed at the heat exchange space of the housing and configured to adjust a temperature of conditioned air by exchanging heat with air; and an opening-closing door disposed at the outflow space of the housing and configured to open and close the plurality of discharge ports such that conditioned air at an adjusted temperature selectively flows to the plurality of discharge ports. The air conditioning device adjusts the temperature of conditioned air for respective modes and reduces a flow resistance of air.

Abstract: A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.

Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.

Abstract: The present disclosure provides a split heater apparatus and a method of manufacturing the same, the split heater apparatus being capable of dividing a heating region into zones, heating the zones individually, and having components capable of being simply assembled, such that the number of components and the number of assembly processes are reduced.

Abstract: Disclosed is a method and apparatus for extracting data in a deep learning model. The method includes receiving an input query, determining a first decision boundary set being a subset of a decision boundary set corresponding to a target layer of the deep learning model, extracting a decision region including the input query based on the first decision boundary set, and extracting data included in the decision region.

Abstract: An embodiment vehicle air conditioner includes an air conditioning device connected to a blower device to receive air supplied from the blower device, a heat exchange core provided in the air conditioning device and disposed in parallel with a flow direction of the air supplied from the blower device, a partition wall disposed to divide the heat exchange core into a first core part disposed to be close in distance to the blower device and a second core part disposed to be distant from the blower device, such that the air supplied from the blower device is distributed and supplied to the first core part and the second core part, and an air guide provided in a connection portion between the blower device and the air conditioning device and configured to guide the air to be supplied to the second core part of the heat exchange core.

Abstract: A vehicle air-conditioning apparatus includes a filter case configured to accommodate a filter, and a filter cover configured to couple to an open upper end of the filter case. The filter case defines an inner space configured to accommodate the filter therein and having the open upper end to receive and discharge the filter therethrough. The inner space is inclined with respect to a vertical direction to allow the filter to be received into and discharged from the filter case in an inclined state. The filter cover includes a fixing protrusion protruding from a lower surface of the filter cover facing the inner space of the filter case and being configured to press and fix the filter in the inner space.

Abstract: An embodiment air conditioner for a vehicle includes a blower unit on an outer surface of a dash panel, the outer surface being opposite an inner surface facing an interior space of the vehicle, the blower unit including a blower fan and a filter, an air conditioning unit on the outer surface of the dash panel and coupled to a side of the blower unit between the blower unit and the interior space of the vehicle, and a distribution unit disposed on the inner surface of the dash panel and located between the air conditioning unit and air conditioning ducts provided in the interior space of the vehicle, wherein each of the blower unit, the air conditioning unit, and the distribution unit is coupled to be individually detachable.

Abstract: An air conditioner for a vehicle, includes a blower unit, having a blower fan and a filter, disposed on an outer surface opposite to an interior space in a dash panel of the vehicle. The air conditioner includes a HVAC unit disposed on the outer surface opposite to the interior space to introduce air from the blower unit. The HVAC unit has a cooler and a heater therein to divide the air introduced from the blower unit into cold air and hot air through the cooler and the heater and to discharge the air and has a distribution unit disposed on an inner surface facing the interior space to introduce the cold air and the hot air generated by the HVAC unit. The distribution unit has front and rear seat doors configured to adjust a degree of mixing of the cold air and the hot air.

Abstract: A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.

Abstract: A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.

Abstract: An air conditioning device for a vehicle and a method of controlling the same are provided. The air conditioning device includes a touch input unit which is configured to be touched, rotated by 360 degrees, and dragged by a user. A touch sensor unit includes three channel regions formed by trisecting a rotational region of 360 degrees and is configured to detect capacitance in accordance with touch areas of a first channel, a second channel, and a third channel at predetermined positions in the three channel regions. Three channel signal output units output signals from the respective channels in accordance with the recognized capacitance.

Abstract: A semiconductor package includes a first metal interconnection disposed in a semiconductor chip, a first bump group configured to be connected to the first metal interconnection, a first inner lead pattern group configured to be connected to the first bump group, a second metal interconnection disposed in the semiconductor chip, a second bump group configured to be connected to the second metal interconnection; and a second inner lead pattern group configured to be connected to the second bump group, wherein a density of the first metal interconnection is greater than a density of the second metal interconnection, such that a first pitch of the first lead pattern group is greater than a second pitch of the second lead pattern group.

Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.

Abstract: A semiconductor die forming method includes preparing a wafer, forming a low-k dielectric layer on the wafer, forming a metal pad on the low-k dielectric layer, forming a passivation layer on the metal pad, patterning the passivation layer, laser grooving the low-k dielectric layer using an ultrashort pulse laser, and cutting the wafer by mechanical sawing to form one or more semiconductor dies.