Patents by Inventor Jaesun An

Jaesun An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11974488
    Abstract: A display device including a base layer, a circuit layer, a light emitting device layer, an organic layer, and a touch sensing unit. The base layer includes a display area and a non-display area. A plurality of insulation patterns overlaps the non-display area. The organic layer is disposed on the light emitting device and overlaps the plurality of insulation patterns and the organic light emitting diode. At least a portion of the plurality of touch signal lines overlaps the plurality of insulation patterns.
    Type: Grant
    Filed: October 20, 2022
    Date of Patent: April 30, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Se-ho Kim, Wonkyu Kwak, Ji-eun Lee, Yohan Kim, Dong-seop Park, Kwangsik Lee, Jaesun Lee, Sungho Cho
  • Publication number: 20240128172
    Abstract: A semiconductor package includes a package substrate including a ball pad with first and second pads, a wiring line extending between the first and second pads, and a solder mask layer including a first opening exposing a portion of the first pad and a second opening exposing a portion of the second pad, and a semiconductor chip on an upper surface of the package substrate, and a connection bump on a lower surface of the ball pad and connected to the first and second pads. The connection bump covers a lower surface and a first side surface of the first pad exposed through the first opening, a lower surface and side surfaces of a region of the solder mask layer covering the wiring line, and a lower surface and a first side surface of the second pad exposed through the second opening.
    Type: Application
    Filed: August 18, 2023
    Publication date: April 18, 2024
    Inventors: Inwon O, Jaesun Kim, Yunseok Choi
  • Patent number: 11962169
    Abstract: An electronic device includes a power transmitter; a first communication interface configured to support an Ultra-Wideband (UWB) communication scheme; a second communication interface configured to support a Bluetooth communication scheme; and a processor configured to: control the first communication interface to transmit a first signal and receive a second signal corresponding to the first signal via the first communication interface, identify, based on a difference between a transmission time of the first signal and a reception time of the second signal, first location information of a first external device, control the power transmitter to transmit a first driving power having a first magnitude, based on a first distance between the first external device and the electronic device being within a first range, the first distance being identified based on the first location information, establish a Bluetooth communication connection with the first external device, based on receiving, via the second communicat
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chongmin Lee, Sungku Yeo, Kangho Byun, Jaesun Shin, Jeongman Lee, Hyoseok Han
  • Publication number: 20240099095
    Abstract: A display device including a base layer, a circuit layer, a light emitting device layer, an organic layer, and a touch sensing unit. The base layer includes a display area and a non-display area. A plurality of insulation patterns overlaps the non-display area. The organic layer is disposed on the light emitting device and overlaps the plurality of insulation patterns and the organic light emitting diode. At least a portion of the plurality of touch signal lines overlaps the plurality of insulation patterns.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 21, 2024
    Inventors: Se-ho KIM, Wonkyu Kwak, Ji-eun Lee, Yohan Kim, Dong-Seop Park, Kwangsik Lee, Jaesun Lee, Sungho Cho
  • Publication number: 20240096777
    Abstract: A semiconductor package includes a redistribution structure in which redistribution layers and insulating layers are alternately stacked. A semiconductor chip is electrically connected to the redistribution layers, and bumps are electrically connected to the redistribution layers and arranged on one surface of the redistribution structure. The redistribution layers include pads arranged to face the bumps, and each of the pads includes a first pad portion offset from a center of each of the pads in a first direction, a second pad portion offset from the center of each of the pads in a second direction, and a connection portion connecting the first and second pad portions. The connection portion includes a protruding portion that defines a first recessed region recessed adjacent to the first pad portion and a second recessed region recessed adjacent to the second pad portion.
    Type: Application
    Filed: May 25, 2023
    Publication date: March 21, 2024
    Inventors: Jaesun KIM, Sanghyun LEE, Yeonho JANG, Yunseok CHOI
  • Publication number: 20240071845
    Abstract: A semiconductor package includes: a redistribution layer including a plurality of conductive lines; a plurality of conductive vias each connected to at least one of the plurality of conductive lines; and a plurality of lower pads each connected to one of the plurality of conductive vias; a semiconductor chip on the redistribution layer; and a plurality of external connection terminals attached to the plurality of lower pads; and a plurality of electrical paths, wherein each of the plurality of electrical paths includes at least one of the plurality of conductive lines and at least one of the plurality of conductive vias. The plurality of electrical paths is configured for testing the plurality of conductive lines and the plurality of conductive vias and is connected to at least four of the external connection test terminals.
    Type: Application
    Filed: June 13, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jaesun KIM, Yunseok CHOI, Youngbae KIM
  • Patent number: 11908464
    Abstract: An electronic device and a method for controlling same are provided. The present electronic device comprises: a communication unit; and a processor configured to receive multiple audio signals via the communication unit, the multiple audio signals being acquired by multiple external electronic devices which have microphones, respectively, and which are positioned at different places, via microphones thereof, the processor being configured to determine at least one audio signal including a user voice uttered by a user among the multiple audio signals and to perform voice recognition regarding an audio signal acquired from the determined audio signals on the basis of the intensity of the determined audio signals.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: February 20, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jaesun Shin, Joonrae Cho, Jeongman Lee
  • Publication number: 20240022120
    Abstract: A method of providing a wireless charging guide and/or an electronic device for performing the same are provided. The electronic device includes a display and at least one processor configured to determine whether the electronic device is in a charging area of a wireless charger, based on a determination that the electronic device is in the charging area, identify at least one external electronic device that is currently connected to the electronic device and/or has a record of being previously connected to the electronic device, acquire battery charge state information of the identified at least one external electronic device, and control the display to output a charging guide interface for the identified at least one external electronic device, based on a charge available state of the wireless charger and the acquired battery charge state information.
    Type: Application
    Filed: July 21, 2023
    Publication date: January 18, 2024
    Inventors: Seokyoung KANG, Kawon CHEON, Jaesun SHIN, Jongwoo JUNG
  • Publication number: 20230363847
    Abstract: A controller adapter system for a robotic surgical instrument controller assembly can include an instrument controller having a housing and one or more controller actuators. The housing can be configured to receive a drape opening structure on the housing. The system can include an inner drape adapter configured to mount to the instrument controller and extend distally from the instrument controller. The inner drape adapter can include one or more adapter actuators configured to receive actuation from the one or more controller actuators at a proximal side thereof, and to transmit the actuation to a distal side thereof. The system can include an outer drape adapter configured to axially retain the inner drape adapter to the instrument controller. The outer drape adapter can be configured to sandwich the drape opening structure to the housing of the instrument controller.
    Type: Application
    Filed: May 17, 2023
    Publication date: November 16, 2023
    Applicant: EndoQuest Robotics, Inc.
    Inventors: Jaesun Lee, Jeihan Lee, Dongsuk Shin
  • Patent number: 11817387
    Abstract: A semiconductor device includes a cell semiconductor pattern disposed on a semiconductor substrate. A semiconductor dummy pattern is disposed on the semiconductor substrate. The semiconductor dummy pattern is co-planar with the cell semiconductor pattern. A first circuit is disposed between the semiconductor substrate and the cell semiconductor pattern. A first interconnection structure is disposed between the semiconductor substrate and the cell semiconductor pattern. A first dummy structure is disposed between the semiconductor substrate and the cell semiconductor pattern. Part of the first dummy structure is co-planar with part of the first interconnection structure. A second dummy structure not overlapping the cell semiconductor pattern is disposed on the semiconductor substrate. Part of the second dummy structure is co-planar with part of the first interconnection structure.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: November 14, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jang-Gn Yun, Jaesun Yun, Joon-Sung Lim
  • Publication number: 20230327711
    Abstract: An electronic device may include: a resonance circuit including a battery, a coil, and a capacitor, and configured to receive power wirelessly; a rectifying circuit including multiple transistors, and configured to rectify alternating current power provided from the resonance circuit into direct current power; and a control circuit, wherein the control circuit is configured to: identify a difference between the phase of voltage and the phase of current of the alternating current power provided from the resonance circuit during wireless reception of power from an external electronic device; and perform impedance matching by controlling the bias voltage of at least one of the multiple transistors on the basis that the difference between the phase of voltage and the phase of current satisfies a designated condition.
    Type: Application
    Filed: June 14, 2023
    Publication date: October 12, 2023
    Inventors: Chongmin LEE, Sungku YEO, Kangho BYUN, Jaesun SHIN, Jeongman LEE, Hyoseok HAN
  • Patent number: 11782947
    Abstract: A method and apparatus that recommends a feature from a data set. The method includes performing a first conversion on the data set including one target variable and a plurality of feature variables by converting a missing value for each of the feature variables into a preset constant, executing a first algorithm to determine a level of redundancy of the plurality of feature variables, using the data set converted by the first conversion and producing first recommendation information that includes a predetermined number of feature variables selected based on a result of the executing the first algorithm.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: October 10, 2023
    Assignee: SAMSUNG SDS CO., LTD.
    Inventors: Jaesun Shin, Ki Hyo Moon
  • Publication number: 20230285098
    Abstract: A patient console for a robotic surgical system can include a base, a vertical lift attached to a top of the base and configured to provide up and down motion in a vertical axis, a yaw rotation device attached to the top of the vertical lift and configured to provide a yaw rotation about the vertical axis, a pitch rotation device attached to the top of the yaw rotation device and configured to provide a pitch rotation about a pitch axis orthogonal to the vertical axis, a translation device attached to the top of the pitch rotation device and configured to provide sliding translation along a translation axis, and a roll rotation device attached to the translation device to roll relative to the translation device about a roll axis to provide a roll to an instrument controller assembly. An angle of the translation axis and the roll axis relative to horizontal can be a function of the pitch rotation provided by the pitch rotation device.
    Type: Application
    Filed: March 15, 2023
    Publication date: September 14, 2023
    Applicant: EndoQuest Robotics, Inc.
    Inventors: Jeihan Lee, Jaesun Lee, Jiwon Choi, Dongsuk Shin
  • Patent number: 11746411
    Abstract: The present invention relates to a method for forming a thin film, and more particularly, to a method for forming a thin film comprising steps of: i) adsorbing a growth inhibitor for forming a thin film on a surface of a substrate, the growth inhibitor for forming a thin film being represented by Chemical Formula 1 below; and ii) adsorbing a Ti-based thin film precursor on a surface of a substrate on which the growth inhibitor is adsorbed. AnBmXo??[Chemical Formula 1] wherein A is carbon or silicon, B is hydrogen or a C1-C3 alkyl, X is a halogen, n is an integer of 1 to 15, o is an integer of 1 or more, and m is 0 to 2n+1. According to the present invention, it is possible to suppress side reactions to appropriately lower a thin film growth rate and remove process byproducts in the thin film, thereby preventing corrosion or deterioration and greatly improving step coverage and thickness uniformity of a thin film, even when the thin film is formed on a substrate having a complex structure.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: September 5, 2023
    Inventors: Changbong Yeon, Jaesun Jung, Hyeran Byun, Taeho Song, Sojung Kim, Seokjong Lee
  • Publication number: 20230215805
    Abstract: A semiconductor device includes a stacked structure disposed on a substrate. The stacked structure includes a plurality of insulation layers and a plurality of electrode layers alternately stacked in a third direction intersecting with first and second directions. A plurality of channel structures extends through the stacked structure in the third direction. A first wiring group includes a plurality of first horizontal wirings disposed on the stacked structure that are arranged in the first direction and extends in the second direction. A second wiring group includes a plurality of second horizontal wirings disposed on the stacked structure that are arranged in the first direction and extends in the second direction. Each of the plurality of first and second horizontal wirings are connected to corresponding one of the plurality of channel structures. A first line identifier is disposed between the first wiring group and the second wiring group.
    Type: Application
    Filed: February 27, 2023
    Publication date: July 6, 2023
    Inventors: Yewon SHIN, Jaesun YUN, Seungjun LEE, Jongmin LEE
  • Patent number: 11672253
    Abstract: A manufacturing method of an antibacterial surface treated copper material includes: etching a metal base material including copper; primary heat-treating the metal base material; coating the metal base material with a composition for a coating; and secondary heat-treating the metal base material. The composition for the coating includes an acryl resin at 40 wt % to 50 wt % and CuO at 1 wt % to 5 wt % for an entire weight of the composition for the coating.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: June 13, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Chang Yeol Yoo, Jaesun Lim
  • Publication number: 20230170290
    Abstract: Disclosed is a semiconductor package comprising a redistribution substrate and a semiconductor chip on the redistribution substrate. The redistribution substrate includes a plurality of first conductive patterns including a pair of first signal patterns that are adjacent to each other, and a plurality of second conductive patterns on surfaces of the first conductive patterns and coupled to the first conductive patterns. The second conductive patterns include a ground pattern insulated from the pair of first signal patterns. The ground pattern has an opening that penetrates the ground pattern. When viewed in plan, the pair of first signal patterns overlap the opening.
    Type: Application
    Filed: August 12, 2022
    Publication date: June 1, 2023
    Inventors: YUN-HEE LEE, JAESUN KIM, SEOKBEOM YONG, WONJAE LEE
  • Patent number: 11657783
    Abstract: A display device including a housing; a display unit accommodated in the housing; and a control unit configured to cause the display unit to operate in a speaker mode to play a song while the display unit is fully inserted in the housing, receive an image display command, according to the image display command, withdraw the display unit and display a first content corresponding to the image display command in a first region of the display unit, and display a second content of an audio controller for controlling the speaker mode in a second region of the display unit.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: May 23, 2023
    Assignee: LG ELECTRONICS INC.
    Inventor: Jaesun Yun
  • Publication number: 20230155416
    Abstract: The disclosure provides a variable wireless power transmitter including a plurality of resonators and a method of controlling the variable wireless power transmitter.
    Type: Application
    Filed: November 15, 2022
    Publication date: May 18, 2023
    Inventors: Jaehyun PARK, Beomwoo GU, Jaeseok PARK, Kangho BYUN, Jaesun SHIN, Sungku YEO, Youngho RYU
  • Patent number: 11644175
    Abstract: A lamp for a vehicle includes a light source unit for generating light, a shield unit for selectively transmitting at least some of the light generated from the light source unit, and a lens unit for focusing the light that transmits trough the shield unit on a road surface. A main transmission light among the light that is transmitted through the shield unit forms a plurality of road surface patterns, and an auxiliary transmission light among the light that is transmitted through the shield unit is irradiated to one or more selected road surface pattern among the plurality of road surface patterns to increase brightness of the selected road surface pattern.
    Type: Grant
    Filed: October 11, 2021
    Date of Patent: May 9, 2023
    Assignee: SL Corporation
    Inventors: Sungmin Woo, Changkyung Yun, Jaesun Lee, Gyosung Lim