Abstract: The present disclosure provides a semiconductor device manufacturing method that includes forming a lower chip and an upper chip, and bonding the lower chip and the upper chip to each other. The forming of the lower chip includes providing a lower substrate, sequentially forming a lower interlayer insulating film and a pre-lower adhesive film, etching portions of the pre-lower adhesive film and the lower interlayer insulating film to form a lower trench, forming, using a sputtering process, a first lower seed film and a second lower seed film. The forming of the upper chip includes providing an upper substrate, sequentially forming an upper interlayer insulating film and a pre-upper adhesive film, etching portions of the pre-upper adhesive film and the upper interlayer insulating film to form an upper trench, forming, using the sputtering process, a first upper seed film and a second upper seed film.

Abstract: A semiconductor device comprises a substrate including a first surface and a second surface opposite to each other in a first direction, an active pattern on the first surface of the substrate and extending in a second direction, a field insulating film on the first surface of the substrate and covering sidewalls of the active pattern, a power rail on the second surface of the substrate and extending in the second direction, a via trench on one side of the active pattern and penetrating through the field insulating film, and a power rail via filling the via trench and connected to the power rail, in which the power rail via includes a first sub-film formed as a single film, and a second sub-film on the first sub-film and including barrier films extending along inner sidewalls of the via trench and a filling film between the barrier films.

Abstract: An organic light emitting diode display device includes a substrate having a plurality of subpixels. The device includes an overcoat layer on the substrate. The device includes a light emitting diode in each of the plurality of on the overcoat layer. In some embodiments, a top surface of the overcoat layer in adjacent two of the plurality of subpixels includes a plurality of microlenses having different rotation angles. The top surface of the overcoat layer between the adjacent two of the plurality of subpixels includes a slit pattern corresponding to the rotation angles of the plurality of microlenses.

Abstract: The technology provides for a wearable device including a body and an accessory adapted to be attached to the body. The body includes a first coil configured to inductively transmit power. The body may further include first power management circuitry configured to control the first coil to transmit power according to a wireless charging standard, and to modulate the power transmitted through the first coil to transmit data according to a wireless communication standard. The accessory may include a second coil configured to inductively receive power. The accessory may further include second power management circuitry configured to control the second coil to receive the power transmitted through the first coil according to the wireless charging standard, and to control the second coil to receive the data transmitted through the first coil according to the wireless communication standard.

Abstract: The technology provides for a wearable device including a body and an accessory adapted to be attached to the body. The body includes a first coil configured to inductively transmit power. The body may further include first power management circuitry configured to control the first coil to transmit power according to a wireless charging standard, and to modulate the power transmitted through the first coil to transmit data according to a wireless communication standard. The accessory may include a second coil configured to inductively receive power. The accessory may further include second power management circuitry configured to control the second coil to receive the power transmitted through the first coil according to the wireless charging standard, and to control the second coil to receive the data transmitted through the first coil according to the wireless communication standard.

Abstract: The technology provides for a wearable device including a body and an accessory adapted to be attached to the body. The body includes a first coil configured to inductively transmit power. The body may further include first power management circuitry configured to control the first coil to transmit power according to a wireless charging standard, and to modulate the power transmitted through the first coil to transmit data according to a wireless communication standard. The accessory may include a second coil configured to inductively receive power. The accessory may further include second power management circuitry configured to control the second coil to receive the power transmitted through the first coil according to the wireless charging standard, and to control the second coil to receive the data transmitted through the first coil according to the wireless communication standard.

Abstract: Methods, systems, and techniques for safely controlling wireless charging in the presence of a foreign object are presented. A method includes determining a power difference between a power transmitted by a wireless charger and a power received by an electronic device, determining a level of misalignment of the electronic device with respect to the wireless charger; estimating an amount of power difference due to the level of misalignment of the electronic device with respect to the wireless charger, adjusting a power difference threshold for the wireless charger based on the estimated amount of power difference, and controlling operation of the wireless charger based on the power difference and the adjusted power difference threshold.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer-storage media, for improving wireless charging. In some implementations, an electronic device determines a power demand of the electronic device. The electronic device includes a wireless power receiver including a wireless power receiving coil configured to receive power through inductive coupling with a wireless charge. The electronic device determines an operating voltage or operating frequency for the wireless charger based on the power demand of the electronic device. The electronic device sends, to the wireless charger, data indicating the operating voltage or operating frequency for the wireless charger.

Abstract: The technology provides for a wearable device including a body and an accessory adapted to be attached to the body. The body includes a first coil configured to inductively transmit power. The body may further include first power management circuitry configured to control the first coil to transmit power according to a wireless charging standard, and to modulate the power transmitted through the first coil to transmit data according to a wireless communication standard. The accessory may include a second coil configured to inductively receive power. The accessory may further include second power management circuitry configured to control the second coil to receive the power transmitted through the first coil according to the wireless charging standard, and to control the second coil to receive the data transmitted through the first coil according to the wireless communication standard.

Abstract: In some implementations, a headphone device includes an earpiece housing, a speaker in the earpiece housing configured to produce audio, and a wireless charging coil having a first portion that extends outside the earpiece housing and a second portion that extends within the earpiece housing. A battery charging circuit is coupled to the wireless charging coil, and the battery charging circuit is configured to charge a battery of the headphone device based on electrical current induced in the wireless charging coil.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer-storage media, for improving wireless charging. In some implementations, an electronic device determines a power demand of the electronic device. The electronic device includes a wireless power receiver including a wireless power receiving coil configured to receive power through inductive coupling with a wireless charge. The electronic device determines an operating voltage or operating frequency for the wireless charger based on the power demand of the electronic device. The electronic device sends, to the wireless charger, data indicating the operating voltage or operating frequency for the wireless charger.

Abstract: In some implementations, a headphone device includes an earpiece housing, a speaker in the earpiece housing configured to produce audio, and a wireless charging coil having a first portion that extends outside the earpiece housing and a second portion that extends within the earpiece housing. A battery charging circuit is coupled to the wireless charging coil, and the battery charging circuit is configured to charge a battery of the headphone device based on electrical current induced in the wireless charging coil.

Abstract: Methods, systems, and techniques for safely controlling wireless charging in the presence of a foreign object are presented. A method includes determining a power difference between a power transmitted by a wireless charger and a power received by an electronic device, determining a level of misalignment of the electronic device with respect to the wireless charger; estimating an amount of power difference due to the level of misalignment of the electronic device with respect to the wireless charger, adjusting a power difference threshold for the wireless charger based on the estimated amount of power difference, and controlling operation of the wireless charger based on the power difference and the adjusted power difference threshold.

Abstract: Methods, systems, and devices for enhanced digital headsets are disclosed. An enhanced USB-C headset includes a USB-C connector, a cable extending from the USB-C connector, an inline control box coupled to the USB-C connector through the cable, and a first earphone and a second earphone. The cable includes conductors for transmitting DC bus power, power return, and differential digital signals and extends at least one foot in length. The control box includes a single circuit board, with circuitry for managing digital communications, converting audio data, and providing output signals to drive analog speaker elements of the earphones.

Abstract: Methods, systems, and devices for enhanced digital headsets are disclosed. An enhanced USB-C headset includes a USB-C connector, a cable extending from the USB-C connector, an inline control box coupled to the USB-C connector through the cable, and a first earphone and a second earphone. The cable includes conductors for transmitting DC bus power, power return, and differential digital signals and extends at least one foot in length. The control box includes a single circuit board, with circuitry for managing digital communications, converting audio data, and providing output signals to drive analog speaker elements of the earphones.

Abstract: A semiconductor device includes an insulating interlayer disposed on a substrate, a first protection pattern, a first barrier pattern, a first adhesion pattern, and a first conductive pattern. The insulating interlayer includes a via hole and a first trench. The via hole extends through a lower portion of the insulating interlayer. The first trench is connected to the via hole and extends through an upper portion of the insulating interlayer. The first protection pattern covers a lower surface and sidewalls of the via hole and a portion of a lower surface and a lower sidewall of the first trench, and includes a conductive material. The first barrier pattern covers the protection pattern and an upper sidewall of the first trench. The first adhesion pattern covers the first barrier pattern. The first conductive pattern is disposed on the first adhesion pattern, and fills the via hale and the first trench.

Abstract: A semiconductor device includes an insulating interlayer disposed on a substrate, a first protection pattern, a first barrier pattern, a first adhesion pattern, and a first conductive pattern. The insulating interlayer includes a via hole and a first trench, The via hole extends through a lower portion of the insulating interlayer. The first trench is connected to the via hole and extends through an upper portion of the insulating interlayer, The first protection pattern covers a lower surface and sidewalls of the via hole and a portion of a lower surface and a lower sidewall of the first trench, and includes a conductive material. The first barrier pattern covers the protection pattern and an upper sidewall of the first trench. The first adhesion pattern covers the first barrier pattern. The first conductive pattern is disposed on the first adhesion pattern, and fills the via hale and the first trench.

Abstract: In a method of forming a wiring structure, a lower structure is formed on a substrate. An insulating interlayer is formed on the lower structure. The insulating interlayer is partially removed to form at least one via hole and a dummy via hole. An upper portion of the insulating interlayer is partially removed to form a trench connecting the via hole and the dummy via hole. A first metal layer filling the via hole and the dummy via hole is formed. A second metal layer filling the trench is formed on the first metal layer.

Abstract: In a method of forming a wiring structure, a lower structure is formed on a substrate. An insulating interlayer is formed on the lower structure. The insulating interlayer is partially removed to form at least one via hole and a dummy via hole. An upper portion of the insulating interlayer is partially removed to form a trench connecting the via hole and the dummy via hole. A first metal layer filling the via hole and the dummy via hole is formed. A second metal layer filling the trench is formed on the first metal layer.

Abstract: The present invention relates to a carbon nanomaterial, a carbon nanomaterial-polymer composite material and a carbon fiber-carbon nanomaterial-polymer composite material including the carbon nanomaterial, and methods of preparing the same, and more particularly, to a carbon nanomaterial functionalized by a functional molecule including both an aromatic hydrocarbon ring and a polar group through mechanical milling, a carbon nanomaterial-polymer composite material and a carbon fiber-carbon nanomaterial-polymer composite material including the carbon nanomaterial, and methods of preparing the same.