Abstract: A circuit board and a camera module. A first board body of the circuit board can slide under the action of a drive force so as to drive a photosensitive chip to displace relative to a lens component to achieve optical anti-shake. An output pin of a second board body of the circuit board can be electrically connected to a motherboard of a mobile terminal, and the second board body is fixed on a base.

Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.

Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.

Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.

Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.

Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.

Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.

Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.

Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.

Abstract: Embodiments provide a camera module including a lens unit, a coupling unit coupled to the lens unit, a housing coupled to the coupling unit, the housing being configured to accommodate a printed circuit board therein and having a vent formed therein, and a membrane formed of an air-permeable material and configured to close the vent formed in the housing so as to prevent external foreign substances from entering the housing.

Abstract: The exemplary embodiment of the present disclosure relates to a camera module including a rear-opened front body, a rear body coupled to a rear side of the front body to form an inner space, a lens part coupled to the front body, an image sensor accommodated at the inner space to convert a light having passed the lens part to an electrical signal, a PCB (Printed Circuit Board) accommodated at the inner space and mounted with the image sensor, and a closed curve-shaped packing member interposed between the front body and the rear body, wherein the packing member includes a support part extensively formed from the packing member to an inner side, and the front body or the rear body includes a support part accommodation groove having a shape corresponding to that of the support part, whereby adhesionability during assembly of packing member can be maximized to thereby minimize an installation defect, a depressed or stamped phenomenon of a packing member that may occur during assembly process.

Abstract: An exemplary embodiment of the present invention includes a PCB (Printed Circuit Board) mounted with an image sensor, a plurality of coil units arranged at an upper surface of the PCB, a housing member arranged at the upper surface of the PCB and provided with a magnet at a position corresponding to that of the coil unit, and a ball guide unit arranged at a surface opposite to the PCB of the housing member.

Abstract: Embodiments provide a camera module including a lens unit, a coupling unit coupled to the lens unit, a housing coupled to the coupling unit, the housing being configured to accommodate a printed circuit board therein and having a vent formed therein, and a membrane formed of an air-permeable material and configured to close the vent formed in the housing so as to prevent external foreign substances from entering the housing.

Abstract: The exemplary embodiment of the present disclosure relates to a camera module including a rear-opened front body, a rear body coupled to a rear side of the front body to form an inner space, a lens part coupled to the front body, an image sensor accommodated at the inner space to convert a light having passed the lens part to an electrical signal, a PCB (Printed Circuit Board) accommodated at the inner space and mounted with the image sensor, and a closed curve-shaped packing member interposed between the front body and the rear body, wherein the packing member includes a support part extensively formed from the packing member to an inner side, and the front body or the rear body includes a support part accommodation groove having a shape corresponding to that of the support part, whereby adhesionability during assembly of packing member can be maximized to thereby minimize an installation defect, a depressed or stamped phenomenon of a packing member that may occur during assembly process.

Abstract: An exemplary embodiment of the present invention may include a first board mounted with an image sensor, a first holder coupled to an upper surface of the first board, a second holder arranged at an upper surface of the first holder and mounted at a periphery with a plurality of magnets, a first elastic member supporting the second holder, and a ball guide unit interposed between the first holder and the second holder.

Abstract: An exemplary embodiment of the present invention includes a PCB (Printed Circuit Board) mounted with an image sensor, a plurality of coil units arranged at an upper surface of the PCB, a housing member arranged at the upper surface of the PCB and provided with a magnet at a position corresponding to that of the coil unit, and a ball guide unit arranged at a surface opposite to the PCB of the housing member.

Abstract: An exemplary embodiment of the present invention may include a first board mounted with an image sensor, a first holder coupled to an upper surface of the first board, a second holder arranged at an upper surface of the first holder and mounted at a periphery with a plurality of magnets, a first elastic member supporting the second holder, and a ball guide unit interposed between the first holder and the second holder.

Abstract: The present invention discloses a media reject device of a media dispenser including a media reject box being positioned in a receiving space of a main body and having a reject hole for inserting defective media, a door unit for opening/closing the reject hole, and a locking unit for unlocking the door unit when the media reject box is inserted into the receiving space, and locking the door unit when the media reject box is separated from the main body. The media reject device of the media dispenser consults user's convenience and prevents the media from being stolen.

Abstract: The present invention discloses a media reject device of a media dispenser including a media reject box being positioned in a receiving space of a main body and having a reject hole for inserting defective media, a door unit for opening/closing the reject hole, and a locking unit for unlocking the door unit when the media reject box is inserted into the receiving space, and locking the door unit when the media reject box is separated from the main body. The media reject device of the media dispenser consults user's convenience and prevents the media from being stolen.