Patents by Inventor Jaewun LEE

Jaewun LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11949159
    Abstract: An electronic device with an antenna is provided. The electronic device includes: a wireless communication circuit disposed inside the electronic device, a support including a first support disposed on at least a portion of a side surface of the electronic device and a second support forming a space for mounting electronic parts of the electronic device, a metal flange located on a protrusion of the first support and electrically connected to the wireless communication circuit, a slit formed between a portion of the first support and a portion of the second support, and a metal plate connected to the second support to form a cavity around the metal flange.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: April 2, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jaewoong Jeon, Yonghyun Yoon, Jaewun Lee
  • Patent number: 11594806
    Abstract: Provided is an electronic device including an antenna module. The electronic device may include: a housing constituting an external appearance of the electronic device, a support member including a first bridge, a printed circuit board coupled to one surface of the support member, a first antenna constituting a first part of the housing and connected to the support member through the first bridge, a second antenna constituting a second part of the housing, a cut-off portion separating the first antenna and the second antenna, and a first connection member and a second connection member coupled to the first bridge. The first connection member may be connected to a ground of the printed circuit board through a first capacitor and may be disposed closer to the cut-off portion than the second connection member connected to the ground of the printed circuit board through a second capacitor. Other embodiments are also possible.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: February 28, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jaewoong Jeon, Jaewun Lee, Jaeyoung Huh, Chanyoul Park, Hojong Kim
  • Publication number: 20220294118
    Abstract: An electronic device with an antenna is provided. The electronic device includes: a wireless communication circuit disposed inside the electronic device, a support including a first support disposed on at least a portion of a side surface of the electronic device and a second support forming a space for mounting electronic parts of the electronic device, a metal flange located on a protrusion of the first support and electrically connected to the wireless communication circuit, a slit formed between a portion of the first support and a portion of the second support, and a metal plate connected to the second support to form a cavity around the metal flange.
    Type: Application
    Filed: May 31, 2022
    Publication date: September 15, 2022
    Inventors: Jaewoong JEON, Yonghyun YOON, Jaewun LEE
  • Publication number: 20210249759
    Abstract: Provided is an electronic device including an antenna module. The electronic device may include: a housing constituting an external appearance of the electronic device, a support member including a first bridge, a printed circuit board coupled to one surface of the support member, a first antenna constituting a first part of the housing and connected to the support member through the first bridge, a second antenna constituting a second part of the housing, a cut-off portion separating the first antenna and the second antenna, and a first connection member and a second connection member coupled to the first bridge. The first connection member may be connected to a ground of the printed circuit board through a first capacitor and may be disposed closer to the cut-off portion than the second connection member connected to the ground of the printed circuit board through a second capacitor. Other embodiments are also possible.
    Type: Application
    Filed: January 21, 2021
    Publication date: August 12, 2021
    Inventors: Jaewoong JEON, Jaewun LEE, Jaeyoung HUH, Chanyoul PARK, Hojong KIM