Patents by Inventor Jae-young Hong
Jae-young Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230176133Abstract: The present disclosure relates to an all-solid-state battery analysis system capable of reliably obtaining an electrochemical signal according to the degree of charge of an electrode, and an all-solid-state battery analysis method using the same. The system may include a body member, of cylindrical shape, having a first cavity extending therethrough in a vertical direction and a second cavity extending therethrough in a horizontal direction and communicating with the first cavity. The system may include a first conductive member including a first base having a plate shape and a first protrusion protruding from the first base having a shape corresponding to a shape of the first cavity; and a second conductive member including a second base having a plate shape and a second protrusion protruding from the second base and having a shape corresponding to the shape of the first cavity.Type: ApplicationFiled: November 13, 2022Publication date: June 8, 2023Applicants: Hyundai Motor Company, Kia Corporation, Institute for Research & Industry Cooperation Pusan National UniversityInventors: Ju Yeong Seong, Im Sul Seo, Jeong Hyun Seo, Je Sik Park, Sung Woo Noh, Sang Heon Lee, Chung Bum Lim, Hye Won Kim, Jae Young Hong, So Young Joo, Yu Jeong Min, Ji Ung Jeong, Heon Cheol Shin
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Patent number: 10638614Abstract: A semiconductor package module is provided. The semiconductor package module may prevent dropout of a large-scale device from a module substrate by improving bonding strength between the module substrate and a part, and perform assembling parts on a top surface and a bottom surface of the module substrate, simultaneously. The semiconductor package module includes: a module substrate; at least one first electric/electronic device mounted on the module substrate by using surface mount technology (SMT); a plurality of passive devices mounted on the module substrate; and at least one second electric/electronic device mounted on the module substrate by using SMT and a resin film adhesive, the at least one second electric/electronic device having a size or a weight greater than a size or a weight of the at least one first electric/electronic device.Type: GrantFiled: August 26, 2018Date of Patent: April 28, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyuk-jin Lee, Kyu-deuk Kim, Jae-young Hong
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Patent number: 10610373Abstract: Disclosed is a spinal complex cage, which includes a cage which is made of a polymeric material, and metal covers which are formed on upper and lower portions of the cage, respectively, in which couplers formed on the metal covers are coupled to coupling grooves formed in the cage, such that the metal covers are detachably coupled to the upper and lower portions of the cage. Accordingly, because the cage and the metal cover are detachably coupled to each other, the manufacturing method is simple, and the metal cover is easily coupled to or separated from the cage, such that the spinal complex cage may be variously and quickly applied even during the surgery in accordance with shapes or intervals between the vertebral bodies, and as a result, a spinal fusion rate is excellent, and the accurate and precise surgical operation is enabled.Type: GrantFiled: September 22, 2017Date of Patent: April 7, 2020Assignee: MEDYSSEY CO., LTD.Inventors: Jong-Wuk Jang, Ho-Jung Kim, Kwun-Mook Lim, Hyun-Woo Jung, Jung-Hee Lee, In-Soo Oh, Jae-Young Hong, Jae-Ho Yang, Anthony Hunkyun Sin
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Publication number: 20190246505Abstract: A semiconductor package module is provided. The semiconductor package module may prevent dropout of a large-scale device from a module substrate by improving bonding strength between the module substrate and a part, and perform assembling parts on a top surface and a bottom surface of the module substrate, simultaneously. The semiconductor package module includes: a module substrate; at least one first electric/electronic device mounted on the module substrate by using surface mount technology (SMT); a plurality of passive devices mounted on the module substrate; and at least one second electric/electronic device mounted on the module substrate by using SMT and a resin film adhesive, the at least one second electric/electronic device having a size or a weight greater than a size or a weight of the at least one first electric/electronic device.Type: ApplicationFiled: August 26, 2018Publication date: August 8, 2019Inventors: Hyuk-jin LEE, Kyu-deuk KIM, Jae-young HONG
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Publication number: 20180092754Abstract: Disclosed is a spinal complex cage, which includes a cage which is made of a polymeric material, and metal covers which are formed on upper and lower portions of the cage, respectively, in which couplers formed on the metal covers are coupled to coupling grooves formed in the cage, such that the metal covers are detachably coupled to the upper and lower portions of the cage. Accordingly, because the cage and the metal cover are detachably coupled to each other, the manufacturing method is simple, and the metal cover is easily coupled to or separated from the cage, such that the spinal complex cage may be variously and quickly applied even during the surgery in accordance with shapes or intervals between the vertebral bodies, and as a result, a spinal fusion rate is excellent, and the accurate and precise surgical operation is enabled.Type: ApplicationFiled: September 22, 2017Publication date: April 5, 2018Applicant: MEDYSSEY CO., LTD.Inventors: Jong-Wuk JANG, Ho-Jung KIM, Kwun-Mook LIM, Hyun-Woo JUNG, Jung-Hee LEE, In-Soo OH, Jae-Young HONG, Jae-Ho YANG, ANTHONY HUNKYUN SIN
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Publication number: 20080191364Abstract: The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.Type: ApplicationFiled: April 14, 2008Publication date: August 14, 2008Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Min-Ill KIM, Dong-Kuk KIM, Chang-Cheol MOON, Tae-Hoe HWANG, Jae-Young HONG
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Patent number: 7396763Abstract: A semiconductor package and a method of manufacturing the same: The package includes a substrate, an external connection terminal portion on at least one edge thereof; a semiconductor chip bonded to the substrate, the semiconductor chip including a plurality of bonding pads; and a flexible film, which electrically connects the semiconductor chip to the external connection terminal portion.Type: GrantFiled: March 15, 2006Date of Patent: July 8, 2008Assignee: Samsung Electronics Co., Ltd.Inventor: Jae-young Hong
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Patent number: 7374966Abstract: The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.Type: GrantFiled: September 25, 2006Date of Patent: May 20, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Min-Ill Kim, Dong-Kuk Kim, Chang-Cheol Lee, Tae-Hoe Hwang, Jae-Young Hong
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Publication number: 20070018295Abstract: The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.Type: ApplicationFiled: September 25, 2006Publication date: January 25, 2007Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Min-Ill KIM, Dong-Kuk KIM, Chang-Cheol LEE, Tae-Hoe HWANG, Jae-Young HONG
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Patent number: 7135353Abstract: The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.Type: GrantFiled: August 10, 2004Date of Patent: November 14, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Min-Ill Kim, Dong-Kuk Kim, Chang-Cheol Lee, Tae-Hoe Hwang, Jae-Young Hong
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Patent number: 7042104Abstract: A semiconductor package and a method of manufacturing the same: The package includes a substrate, an external connection terminal portion on at least one edge thereof; a semiconductor chip bonded to the substrate, the semiconductor chip including a plurality of bonding pads; and a flexible film, which electrically connects the semiconductor chip to the external connection terminal portion.Type: GrantFiled: July 20, 2004Date of Patent: May 9, 2006Assignee: Samsung Electronics Co., Ltd.Inventor: Jae-young Hong
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Publication number: 20050054140Abstract: The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.Type: ApplicationFiled: August 10, 2004Publication date: March 10, 2005Applicant: Samsung Electronics Co., Ltd.Inventors: Min-Ill Kim, Dong-Kuk Kim, Chang-Cheol Lee, Tae-Hoe Hwang, Jae-Young Hong
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Publication number: 20050035467Abstract: A semiconductor package and a method of manufacturing the same: The package includes a substrate, an external connection terminal portion on at least one edge thereof; a semiconductor chip bonded to the substrate, the semiconductor chip including a plurality of bonding pads; and a flexible film, which electrically connects the semiconductor chip to the external connection terminal portion.Type: ApplicationFiled: July 20, 2004Publication date: February 17, 2005Inventor: Jae-young Hong