Patents by Inventor Jae-young Jo

Jae-young Jo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080266269
    Abstract: Disclosed herein is a portable touch-type keyboard in which touch type electrodes are included in a printed circuit board (PCB) and keys each having a pad shape are formed on a flat plate in correspondence with the touch type electrodes so as to transmit/receive a signal to/from an external device via wired/wireless communication such that key data indicating a character or a function can be input. The portable keyboard includes a pad key touch panel including a plurality of pad type touch electrodes contained in predetermined containing spaces of a printed circuit board (PCB) and pad keys formed on an upper plane in correspondence with the touch electrodes, and a signal operation module which processes signals received from the plurality of pad keys, generates a key signal, and transmits the key input signal to an external device via wired/wireless communication.
    Type: Application
    Filed: September 21, 2007
    Publication date: October 30, 2008
    Applicant: MELFAS INC.
    Inventors: Bong Woo Lee, Dong Jin Min, Jae Young Jo
  • Publication number: 20070093592
    Abstract: The present invention relates to a polypropylene nanocomposite comprising (a) about 1 wt % to about 40 wt % of an acid- or acid anhydride-modified polypropylene; (b) about 0.1 wt % to about 50 wt % of an organically modified layered silicate; and (c) about 30 wt % to about 90 wt % of a nonpolar polypropylene, wherein the acid- or anhydride-modified polypropylene has a molecular weight that is lower than that of the nonpolar polypropylene, and wherein the polypropylene nanocomposite has a linear thermal expansion coefficient ranging from about 4×10?5/° C. to about 9×10?5/° C. The density and linear thermal expansion coefficient of these nanocomposites are, respectively, 10% to 20% and 20% to 40% less than conventional polypropylene composites and can be used to form durable molded products with superior dimensional stability, good tensile strength, good moldability, and high thermal resistance.
    Type: Application
    Filed: December 15, 2005
    Publication date: April 26, 2007
    Inventors: Tae Won Hwang, Soon Joon Jung, Chi Hoon Choi, Jae Young Jo, Byeong Uk Nam
  • Patent number: 7023694
    Abstract: A computer having a main casing to accommodate a plurality of hardware components such as a CPU, comprises a heat dissipating assembly which is disposed on the CPU, and includes a heat transmitter formed with a through hole, and a plurality of heat dissipating fins standing on the heat transmitter so as to dissipate heat generated by the CPU; a supporter installed in the heat dissipating fins, being disposed perpendicularly to the heat dissipating fins; a push member including a lever pivoted on the supporter, a push rod connected to the lever and passing through the through hole, the push rod moving to pass through the through hole in a direction that the heat transmitter separates from the CPU when the lever is pushed up pivoting on the supporter.
    Type: Grant
    Filed: April 13, 2004
    Date of Patent: April 4, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jae-young Jo
  • Publication number: 20050024823
    Abstract: A computer having a main casing to accommodate a plurality of hardware components such as a CPU, comprises a heat dissipating assembly which is disposed on the CPU, and includes a heat transmitter formed with a through hole, and a plurality of heat dissipating fins standing on the heat transmitter so as to dissipate heat generated by the CPU; a supporter installed in the heat dissipating fins, being disposed perpendicularly to the heat dissipating fins; a push member including a lever pivoted on the supporter, a push rod connected to the lever and passing through the through hole, the push rod moving to pass through the through hole in a direction that the heat transmitter separates from the CPU when the lever is pushed up pivoting on the supporter.
    Type: Application
    Filed: April 13, 2004
    Publication date: February 3, 2005
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Jae-young Jo