Patents by Inventor Jaf Chen

Jaf Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6893331
    Abstract: A gimbal assembly that can be used in conjunction with semiconductor fabrication tools, such as chemical-mechanical polishing (CMP) tools, as well as other types of tools, is disclosed. A gimbal assembly may include a gimbal hub, a pivot head plate, a gimbal sleeve, and a gimbal post. The gimbal hub has an interior cavity. The pivot head plate has a ball head, a base, and an outer edge, where the base is situated in the bottom of the interior cavity. The gimbal sleeve is situated in the bottom of the interior cavity over the outer edge of the pivot head plate, securing the pivot head plate in place within the interior cavity. The gimbal post is situated over the ball head of the pivot head plate. The ball head of the pivot head plate preferably has dual diameters.
    Type: Grant
    Filed: May 9, 2002
    Date of Patent: May 17, 2005
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Wen-Jung Huang, Chin Hao Chang, Jaf Chen
  • Publication number: 20050069399
    Abstract: A novel apparatus and method for transporting semiconductor wafer substrates typically from a CMP apparatus to a scrubber cleaner in a dry state. The method includes providing a SMIF arm at the input port of the scrubber cleaner. After they are subjected to the CMP operation, the substrates are loaded into an enclosed substrate carrier such as a cassette or pod and transported to the SMIF arm of the scrubber cleaner at the input port, where the substrates are internalized and subjected to rinsing, scrubbing and drying steps in the cleaner. Automated transport of the dry substrates from the CMP apparatus to the scrubber cleaner in an enclosed substrate carrier prevents atmospheric particles from contaminating the substrates, prevents unnecessary use of manpower, and reduces or eliminates the possibility of breakage or damage to the substrates.
    Type: Application
    Filed: August 12, 2003
    Publication date: March 31, 2005
    Inventors: Chih-Ming Hsieh, Tien-Chen Hu, Jaf Chen
  • Publication number: 20030211817
    Abstract: A gimbal assembly that can be used in conjunction with semiconductor fabrication tools, such as chemical-mechanical polishing (CMP) tools, as well as other types of tools, is disclosed. A gimbal assembly may include a gimbal hub, a pivot head plate, a gimbal sleeve, and a gimbal post. The gimbal hub has an interior cavity. The pivot head plate has a ball head, a base, and an outer edge, where the based is situated in the bottom of the interior cavity. The gimbal sleeve is situated in the bottom of the interior cavity over the outer edge of the pivot head plate, securing the pivot head plate in place within the interior cavity. The gimbal post is situated over the ball head of the pivot head plate. The ball head of the pivot head plate preferably has dual diameters.
    Type: Application
    Filed: May 9, 2002
    Publication date: November 13, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Jung Huang, Chin Hao Chang, Jaf Chen