Abstract: An apparatus is provided that forms a solder layer on a die pad of a leadframe. Initially, a drop of the solder is deposited on the die pad, and the drop is formed into a layer by the lower surface of a tool which is moved towards the drop. The tool includes a wall which encircles the surface and is resiliently maintained in a position in which the wall encircles and projects downwardly from the surface. Thus, the lower edge of the wall contacts the die pad before the surface forms the solder drop into the layer, and encircles it, thus preventing solder from splashing out.