Patents by Inventor Jafry Bin Abdul Wahid

Jafry Bin Abdul Wahid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070017650
    Abstract: An apparatus is provided that forms a solder layer on a die pad of a leadframe. Initially, a drop of the solder is deposited on the die pad, and the drop is formed into a layer by the lower surface of a tool which is moved towards the drop. The tool includes a wall which encircles the surface and is resiliently maintained in a position in which the wall encircles and projects downwardly from the surface. Thus, the lower edge of the wall contacts the die pad before the surface forms the solder drop into the layer, and encircles it, thus preventing solder from splashing out.
    Type: Application
    Filed: July 14, 2006
    Publication date: January 25, 2007
    Inventor: Jafry Bin Abdul Wahid