Patents by Inventor Jagadeesh Radhakrishnan

Jagadeesh Radhakrishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8189343
    Abstract: Embodiments are generally direct to a method and apparatus to provide power to a backplane. In one embodiment, a method is implemented in a backplane to receive power through an upper zone of the backplane. The power is provided by a rear transition power entry module (RT-PEM) operatively coupled to an interface in the upper zone. The power provided by the RT-PEM is routed to interfaces in a lower zone of the backplane. Each lower zone interface distributes at least a portion of the power to a component operatively coupled to the backplane.
    Type: Grant
    Filed: December 28, 2004
    Date of Patent: May 29, 2012
    Assignee: Intel Corporation
    Inventors: Wen Wei, Ron W. Smith, Jagadeesh Radhakrishnan
  • Publication number: 20060256522
    Abstract: Method and apparatus for providing a chassis having an extendible fan tray with a extending from the fan tray to the chassis to maintain air flow while the fan tray is extended from the chassis. Fan modules in the fan tray can be replaced while maintaining air flow.
    Type: Application
    Filed: May 10, 2005
    Publication date: November 16, 2006
    Inventors: Wen Wei, Ron Smith, Jagadeesh Radhakrishnan
  • Publication number: 20060203446
    Abstract: A fan may include a fan housing and an integrated electrical connector extending from the fan housing for engaging a mating connector. The fan may also include one or more retractable handles extending from the fan housing on a side opposite the integrated electrical connector. The fan may further include one or more guides on the housing for engaging a fan tray and guiding the fan when the fan is inserted and removed. Of course, many alternatives, variations, and modification are possible without departing from this embodiment.
    Type: Application
    Filed: March 8, 2005
    Publication date: September 14, 2006
    Inventors: Jagadeesh Radhakrishnan, Wen Wei
  • Publication number: 20060139904
    Abstract: Embodiments are generally direct to a method and apparatus to provide power to a backplane. In one embodiment, a method is implemented in a backplane to receive power through an upper zone of the backplane. The power is provided by a rear transition power entry module (RT-PEM) operatively coupled to an interface in the upper zone. The power provided by the RT-PEM is routed to interfaces in a lower zone of the backplane. Each lower zone interface distributes at least a portion of the power to a component operatively coupled to the backplane.
    Type: Application
    Filed: December 28, 2004
    Publication date: June 29, 2006
    Inventors: Wen Wei, Ron Smith, Jagadeesh Radhakrishnan