Patents by Inventor Jagdish Prasad

Jagdish Prasad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11972673
    Abstract: A system (102) for assisting a patient to raise an alarm is disclosed. The system (102) may include a sensor (106) configured to be positioned at a head region of the patient and to detect movement of head of the patient. The system (102) may further include a patient assisting device (104) coupled to the sensor (106). The patient assisting device (104) may be configured to receive, from the sensor (106), a signal corresponding to the movement of the head of the patient, determine a state of alarm value from the signal, and generate an alarm based on the state of alarm value.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: April 30, 2024
    Assignee: L&T TECHNOLOGY SERVICES LIMITED
    Inventors: Jagdish Prasad Sahu, Keyur Bhalodiya, Ashish Kumar, Rishabh Ranjan
  • Publication number: 20230111719
    Abstract: A system (102) for assisting a patient to raise an alarm is disclosed. The system (102) may include a sensor (106) configured to be positioned at a head region of the patient and to detect movement of head of the patient. The system (102) may further include a patient assisting device (104) coupled to the sensor (106). The patient assisting device (104) may be configured to receive, from the sensor (106), a signal corresponding to the movement of the head of the patient, determine a state of alarm value from the signal, and generate an alarm based on the state of alarm value.
    Type: Application
    Filed: June 24, 2022
    Publication date: April 13, 2023
    Inventors: JAGDISH PRASAD SAHU, KEYUR BHALODIYA, ASHISH KUMAR, RISHABH RANJAN
  • Publication number: 20230031893
    Abstract: Disclosed herein is a system and method for controlling oxygen supply equipments. The system is equipped with pressure sensors coupled to the oxygen supply equipments. Depending on the oxygen supply selected by a user for the patient, the pressure sensor monitors the current pressure of the preset oxygen supply during an inhalation phase corresponding to the patient. If the current pressure is less than a minima value or if a pressure drop rate is higher than or equal to a threshold rate or both, the system generates an alarm notifying the user to check the preset oxygen supply and in the meanwhile switches the preset oxygen supply from one oxygen supply equipment to another oxygen supply equipment or vice-versa.
    Type: Application
    Filed: March 15, 2022
    Publication date: February 2, 2023
    Inventors: Jagdish Prasad Sahu, Ravi Kumar, Samyuktha Bangalore Srinivas, Balakrishnarao Manali Srinivas, Ashish Kumar, Rishabh Ranjan, Keyur Bhalodiya
  • Publication number: 20220250500
    Abstract: An electric vehicle (EV) charging method which considers the EVs heterogeneity, taking into account the absence of any information about future arrivals and departures, and of the amount of time any charging will take. The method further considers both switch on and off possibilities and not an arbitrarily small minimum charging power. In order to achieve all these objectives, the invention defines novel metrics and uses them to construct a dedicated optimization problem. As the charging power is discontinuous, the minimum charging power not being arbitrarily small, the optimization problem is mixed integer by nature. Further, because the mixed-integer optimization is difficult to perform in real-time, the invention proposes a heuristic for reducing the number of integer variables, thus reducing the complexity of the problem.
    Type: Application
    Filed: June 13, 2019
    Publication date: August 11, 2022
    Inventors: Jagdish Prasad Achara, Cong Wang, Mario Paolone, Roman Rudnik, Jean-Yves Le Boudec, Lorenzo Enrique Reyes Chamorro
  • Patent number: 10907491
    Abstract: A sealing system for a rotary machine is provided. The sealing system includes a pair of circumferentially-adjacent rotary components and an axial seal. Each of the rotary components includes a platform including a first side channel and an opposite second side channel, a shank extending radially inwardly from the platform, and a dovetail region extending radially inwardly from the shank. The axial seal is sized and shaped to be received in the first side channel of a first of the rotary components and the second side channel of a second of the rotary components, such that the axial seal sealingly interfaces with the first and second channels.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: February 2, 2021
    Assignee: General Electric Company
    Inventors: Jagdish Prasad Tyagi, Sendilkumaran Soundiramourty, Amit Grover, Sunil Rajagopal, Rajesh Mavuri, Andrew Paul Giametta
  • Patent number: 10641174
    Abstract: A gas turbine casing with an internal heat exchange system. The gas turbine extends between an inlet section and an exhaust section and defines a downstream direction from the inlet section to the exhaust section. The casing includes a forward end, an aft end downstream of the forward end, a first exterior surface facing radially outward, a second exterior surface facing radially inward, and an internal body at least partially defined between the first exterior surface and the second exterior surface. The heat exchange system includes an inlet and an outlet formed in an exterior surface of the casing proximate the aft end, a supply bore extending upstream from the inlet through the interior body of the casing, and a return bore extending downstream to the outlet through the interior body of the casing.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: May 5, 2020
    Assignee: General Electric Company
    Inventors: Debabrata Mukhopadhyay, Sanjeev Kumar Jain, Sendilkumaran Soundiramourty, Rajesh Mavuri, Jagdish Prasad Tyagi
  • Publication number: 20190162073
    Abstract: A sealing system for a rotary machine is provided. The sealing system includes a pair of circumferentially-adjacent rotary components and an axial seal. Each of the rotary components includes a platform including a first side channel and an opposite second side channel, a shank extending radially inwardly from the platform, and a dovetail region extending radially inwardly from the shank. The axial seal is sized and shaped to be received in the first side channel of a first of the rotary components and the second side channel of a second of the rotary components, such that the axial seal sealingly interfaces with the first and second channels.
    Type: Application
    Filed: June 1, 2018
    Publication date: May 30, 2019
    Inventors: Jagdish Prasad Tyagi, Sendilkumaran Soundiramourty, Amit Grover, Sunil Rajagopal, Rajesh Mavuri, Andrew Paul Giametta
  • Patent number: 10060833
    Abstract: A shape memory effect measuring apparatus is provided that is useful for tensile stress, strain and recovery stress measurement. The apparatus includes a load cell, a linear variable displacement transducer, a temperature sensor, a rigid platform, a computer-based data recorder and a processing system a load frame, grips to hold sample, and a liquid bath. The liquid bath is mounted on the rigid stand platform to hold the liquid bath. A uniform temperature of liquid is attained by controlled heating and stirring arrangement. The computer-based processing system may be used to monitor and control the desired temperature of the sample. A change in length of a specimen and stress generated during expansion thereof may be recorded, from which strain and stress may be calculated using the apparatus.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: August 28, 2018
    Assignee: Council of Scientific & Industrial Research
    Inventors: Syed Azhar Rasheed Hashmi, Hari Narayan Bhargaw, Ajay Naik, Jagdish Prasad Pandey, Mulayam Singh Yadav, Navin Chand
  • Publication number: 20180202360
    Abstract: A gas turbine casing with an internal heat exchange system. The gas turbine extends between an inlet section and an exhaust section and defines a downstream direction from the inlet section to the exhaust section. The casing includes a forward end, an aft end downstream of the forward end, a first exterior surface facing radially outward, a second exterior surface facing radially inward, and an internal body at least partially defined between the first exterior surface and the second exterior surface. The heat exchange system includes an inlet and an outlet formed in an exterior surface of the casing proximate the aft end, a supply bore extending upstream from the inlet through the interior body of the casing, and a return bore extending downstream to the outlet through the interior body of the casing.
    Type: Application
    Filed: January 18, 2017
    Publication date: July 19, 2018
    Inventors: Debabrata Mukhopadhyay, Sanjeev Kumar Jain, Sendilkumaran Soundiramourty, Rajesh Mavuri, Jagdish Prasad Tyagi
  • Patent number: 9664118
    Abstract: A system for controlling compressor forward leakage to the compressor flow path in a gas turbine is provided. The system includes a first compressor rotor wheel coupled to an upstream face of a compressor spacer wheel. A second compressor rotor wheel is coupled to a downstream face of the compressor spacer wheel. The compressor spacer wheel includes at least one intake recess defined in the downstream face, at least one discharge recess defined in the upstream face, and at least one axial passage coupling the at least one intake recess in fluid communication with the at least one discharge recess.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: May 30, 2017
    Assignee: General Electric Company
    Inventors: Jagdish Prasad Tyagi, Srinivasarao Pakkala
  • Publication number: 20160349036
    Abstract: A shape memory effect measuring apparatus useful for tensile stress, strain and recovery stress measurement comprising a load cell, LVDT (Linear variable displacement transducer), temperature sensor, rigid platform, a PC based data recorder and processing system developed for load cell, temperature sensor, load frame, grips to hold sample and a liquid bath. The instrument has the provision of sample testing in the controlled uniform temperature and defined liquid environment. The liquid bath is mounted on the rigid stand platform to hold the liquid bath. Sample and holding grips are submerged in the liquid. A uniform temperature of liquid is attained by controlled heating and stirring arrangement. A PC based controller is used to monitor and control the desired temperature of the sample. The holding device is used to fasten a specimen by the suitable grips.
    Type: Application
    Filed: May 17, 2016
    Publication date: December 1, 2016
    Inventors: Syed Azhar Rasheed Hashmi, Hari Narayan Bhargaw, Ajay Naik, Jagdish Prasad Pandey, Mulayam Singh Yadav, Navin Chand
  • Publication number: 20150114000
    Abstract: A system for controlling compressor forward leakage to the compressor flow path in a gas turbine is provided. The system includes a first compressor rotor wheel coupled to an upstream face of a compressor spacer wheel. A second compressor rotor wheel is coupled to a downstream face of the compressor spacer wheel. The compressor spacer wheel includes at least one intake recess defined in the downstream face, at least one discharge recess defined in the upstream face, and at least one axial passage coupling the at least one intake recess in fluid communication with the at least one discharge recess.
    Type: Application
    Filed: October 24, 2013
    Publication date: April 30, 2015
    Applicant: General Electric Company
    Inventors: Jagdish Prasad Tyagi, Srinivasarao Pakkala
  • Patent number: 8536685
    Abstract: In one embodiment, a semiconductor device is formed to include a plurality of conductor layers that interconnect electrical signals between semiconductor elements of the semiconductor device. A metal shield layer is formed overlying a portion of the plurality of conductor layers. A signal re-distribution layer is formed overlying the metal shield layer.
    Type: Grant
    Filed: January 24, 2012
    Date of Patent: September 17, 2013
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Hormazdyar M. Dalal, Jagdish Prasad
  • Publication number: 20120119340
    Abstract: In one embodiment, a semiconductor device is formed to include a plurality of conductor layers that interconnect electrical signals between semiconductor elements of the semiconductor device. A metal shield layer is formed overlying a portion of the plurality of conductor layers. A signal re-distribution layer is formed overlying the metal shield layer.
    Type: Application
    Filed: January 24, 2012
    Publication date: May 17, 2012
    Inventors: Hormazdyar M. Dalal, Jagdish Prasad
  • Patent number: 8129266
    Abstract: In one embodiment, a semiconductor device is formed to include a plurality of conductor layers that interconnect electrical signals between semiconductor elements of the semiconductor device. A metal shield layer is formed overlying a portion of the plurality of conductor layers. A signal re-distribution layer is formed overlying the metal shield layer.
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: March 6, 2012
    Assignee: Semiconductor Componenets Industries, LLC
    Inventors: Hormazdyar M. Dalal, Jagdish Prasad
  • Patent number: 7947592
    Abstract: The present invention relates to a high power IC (Integrated Circuit) semiconductor device and process for making same. More particularly, the invention encompasses a high conductivity or low resistance metal stack to reduce the device R-on which is stable at high temperatures while in contact with a thick aluminum wire-bond that is required for high current carrying capability and is mechanically stable against vibration during use, and process thereof. The invention further discloses a thick metal interconnect with metal pad caps at selective sites, and process for making the same.
    Type: Grant
    Filed: January 31, 2008
    Date of Patent: May 24, 2011
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Hormazdyar Minocher Dalal, Jagdish Prasad, Hocine Bouzid Ziad
  • Patent number: 7800239
    Abstract: The present invention relates to a high power IC (Integrated Circuit) semiconductor device and process for making same. More particularly, the invention encompasses a high conductivity or low resistance metal stack to reduce the device R-on which is stable at high temperatures while in contact with a thick aluminum wire-bond that is required for high current carrying capability and is mechanically stable against vibration during use, and process thereof. The invention further discloses a thick metal interconnect with metal pad caps at selective sites, and process for making the same.
    Type: Grant
    Filed: January 31, 2008
    Date of Patent: September 21, 2010
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Hormazdyar Minocher Dalal, Jagdish Prasad, Hocine Bouzid Ziad
  • Publication number: 20100006989
    Abstract: In one embodiment, a semiconductor device is formed to include a plurality of conductor layers that interconnect electrical signals between semiconductor elements of the semiconductor device. A metal shield layer is formed overlying a portion of the plurality of conductor layers. A signal re-distribution layer is formed overlying the metal shield layer.
    Type: Application
    Filed: July 9, 2008
    Publication date: January 14, 2010
    Inventors: Hormazdyar M. Dalal, Jagdish Prasad
  • Publication number: 20090152100
    Abstract: The present invention relates to a high power IC (Integrated Circuit) semiconductor device and process for making same. More particularly, the invention encompasses a high conductivity or low resistance metal stack to reduce the device R-on which is stable at high temperatures while in contact with a thick aluminum wire-bond that is required for high current carrying capability and is mechanically stable against vibration during use, and process thereof. The invention further discloses a thick metal interconnect with metal pad caps at selective sites, and process for making the same.
    Type: Application
    Filed: January 31, 2008
    Publication date: June 18, 2009
    Applicant: AMI Semiconductor, Inc.
    Inventors: Hormazdyar Minocher Dalal, Jagdish Prasad, Hocine Bouzid Ziad
  • Publication number: 20090152725
    Abstract: The present invention relates to a high power IC (Integrated Circuit) semiconductor device and process for making same. More particularly, the invention encompasses a high conductivity or low resistance metal stack to reduce the device R-on which is stable at high temperatures while in contact with a thick aluminum wire-bond that is required for high current carrying capability and is mechanically stable against vibration during use, and process thereof. The invention further discloses a thick metal interconnect with metal pad caps at selective sites, and process for making the same.
    Type: Application
    Filed: January 31, 2008
    Publication date: June 18, 2009
    Applicant: AMI Semiconductor, Inc.
    Inventors: Hormazdyar Minocher Dalal, Jagdish Prasad, Hocine Bouzid Ziad