Abstract: A method is provided for programming a memory cell connected to a selected word line in a memory device. The method includes performing one programming pass of a multi-pass programming operation for the memory cell, wherein a first set of program pulses is applied to the selected word line during the one programming pass, determining a number of the program pulses applied to the selected word line during the one programming pass, determining a difference between the determined number of program pulses applied to the selected word line during the one programming pass and a predetermined number of program pulses, adjusting a parameter of a second set of program pulses for the another programming pass based on the determined difference, and performing the another programming pass for the set of memory cells, wherein the second set of program pulses is applied to the selected word line during the another programming pass.

Abstract: For a non-volatile memory device having a NAND type of architecture, techniques are presented for determining NAND strings that are slow to program, including comparing the amount of current drawn by different sets of memory cells during different write operations. These techniques are particularly applicable to memory devices have a 3D structure, such as of BiCS type, where the slow programming can arise from defects of the spacing between the memory holes, in which the NAND strings are formed, and the local interconnects, such as for connecting common source lines and which run in a vertical direction between groups of NAND strings. The slow to program NAND strings can be recorded and this information can be used when writing data to the NAND strings. Several methods of writing data along a word line that includes such slow to program cells are described.

Abstract: A number of techniques for determining defects in non-volatile memory arrays are presented, which are particularly applicable to 3D NAND memory, such as that of the BiCS type. Word line to word shorts within a memory block are determined by application of an AC stress mode, followed by a defect detection operation. An inter-block stress and detection operation can be used determine word line to word line leaks between different blocks. Select gate leak line leakage, both the word lines and other select lines, is consider, as are shorts from word lines and select lines to local source lines. In addition to word line and select line defects, techniques for determining shorts between bit lines and low voltage circuitry, as in the sense amplifiers, are presented.

Abstract: A stress mode for use in testing non-volatile memory arrays for a number of types of defects is described. More specifically, a multi-word line select option for a given block can be used for a group of selected word lines to be set to the a programming or other high voltage, while the unselected word lines of the block are set to a pass voltage to minimize electric field differences in order to avoid disturb. For example, a group of selected word lines could number 4, 8 or 16. The multi-word line option can be applied to one block per plane, so that if there are two memory planes, for example, two such blocks can be selected simultaneously for the multi-word line option for those blocks.

Abstract: Techniques are provided for erasing a memory device. In one aspect, different zones of a block can be separately erased and subject to a verify test. Erase parameters can be optimized for each zone, so that endurance is improved. If one zone is found to be too slow to erase, it can be marked as being bad while other zones remain available for use. In another aspect, the zone-based erase occurs after a block based erased when a criterion is met, such as the block-based erase being too slow or failing to complete within an allowable number of program loops. The zone-based erase can occur after the block-based erase in the same erase operation, or in a subsequent, new erase operation.

Abstract: Techniques are provided for operating a memory device which detect word line short circuits, such as short circuits between adjacent word lines. In an example implementation, during a programming operation, the number of program loops used to complete programming or reach another programming milestone for WLn are counted. If the number of program loops exceeds a loop count limit, the memory cells of WLn+1 are evaluated to determine whether a short circuit is present. The evaluation involves a read operation which counts erased state memory cells in the upper tail of the Vth distribution of WLn+1. If the count exceeds a bit count limit, it is concluded that a short circuit exits between WLn and WLn+1, and a corrective action is taken. The loop count limit is adjusted lower as the number of program-erase cycles increases.

Abstract: Techniques are presented for the determination defects in non-volatile arrays, particularly those having a 3D or BiCS type of arrangement where NAND strings run in a vertical direction relative to the substrate. In such an arrangement, the NAND strings are formed along memory holes and connected to global bit lines, and are separated into blocks or sub-blocks by vertical local interconnects, such as for source lines, and connected to a corresponding global line. To determine defective blocks, a reference current is determined based on the amount of current drawn by the local interconnects when a high voltage is applied and all of the blocks are de-selected. The amount of leakage current is determined when a selected block is biased to ground and the high voltage is applied to the interconnects. By comparing the reference current to the leakage current, a determination can be made on whether the selected block has defects related to the local interconnect structure.

Abstract: A method is provided for programming a memory cell connected to a selected word line in a memory device. The method includes performing one programming pass of a multi-pass programming operation for the memory cell, wherein a first set of program pulses is applied to the selected word line during the one programming pass, determining a number of the program pulses applied to the selected word line during the one programming pass, determining a difference between the determined number of program pulses applied to the selected word line during the one programming pass and a predetermined number of program pulses, adjusting a parameter of a second set of program pulses for the another programming pass based on the determined difference, and performing the another programming pass for the set of memory cells, wherein the second set of program pulses is applied to the selected word line during the another programming pass.

Abstract: Techniques are presented for using erase stress and variations in the loop count (number of cycles) for various fail modes in non-volatile memories, including erase disturb and shallow erase. For detection of shallow erase, cells are programmed and then erased, where the variation (delta) in the number of erase loop counts can be used to determine defective blocks. To determine blocks prone to erase disturb, an erase stress is applied to unselected blocks, after which they are programmed: after then erasing one block, the next block can then be read to determine whether it has suffered erase disturb.

Abstract: A non-volatile flash memory has bit lines spanning multiple blocks grouped into columns, where each block is connected along multiple regular columns and one or more redundancy columns. When there is a local column defect, so that the defect is not at the level of the whole block or global column, the portions of a column at an individual block can be remapped to a portion of the same block along a redundant column. Sections of multiple columns from different blocks can be remapped to the same redundancy column.

Abstract: A stress mode for use in testing non-volatile memory arrays for a number of types of defects is described. More specifically, a multi-word line select option for a given block can be used for a group of selected word lines to be set to the a programming or other high voltage, while the unselected word lines of the block are set to a pass voltage to minimize electric field differences in order to avoid disturb. For example, a group of selected word lines could number 4, 8 or 16. The multi-word line option can be applied to one block per plane, so that if there are two memory planes, for example, two such blocks can be selected simultaneously for the multi-word line option for those blocks.

Abstract: For a non-volatile memory device having a NAND type of architecture, techniques are presented for determining NAND strings that are slow to program. These techniques are particularly applicable to memory devices have a 3D structure, such as of BiCS type, where the slow programming can arise from defects of the spacing between the memory holes, in which the NAND strings are formed, and the local interconnects, such as for connecting common source lines and which run in a vertical direction between groups of NAND strings. The slow to program NAND strings can be recorded and this information can be used when writing data to the NAND strings. Several methods of writing data along a word line that includes such slow to program cells are described.

Abstract: A number of techniques for determining bit line related defects in non-volatile memory arrays are presented, which are particularly applicable to 3D NAND memory, such as that of the BiCS type. Defects related to bit line to NAND string contacts are determined by application of an AC stress mode along bit lines, followed by a defect detection operation. If the AC stress is applied to be out of phase on adjacent bit lines, this can also be used to accelerate bit line to bit line defects. The subsequent defect determination phase can include an erase operation followed a read to determine whether the NAND strings of the erased block read as erased, a process that can also be followed by a program and subsequent read to further check for defects.

Abstract: A number of techniques for determining defects in non-volatile memory arrays are presented, which are particularly applicable to 3D NAND memory, such as that of the BiCS type. Word line to word shorts within a memory block are determined by application of an AC stress mode, followed by a defect detection operation. An inter-block stress and detection operation can be used determine word line to word line leaks between different blocks. Select gate leak line leakage, both the word lines and other select lines, is consider, as are shorts from word lines and select lines to local source lines. In addition to word line and select line defects, techniques for determining shorts between bit lines and low voltage circuitry, as in the sense amplifiers, are presented.

Abstract: A number of techniques for determining defects in non-volatile memory arrays are presented, which are particularly applicable to 3D NAND memory, such as that of the BiCS type. Word line to word shorts within a memory block are determined by application of an AC stress mode, followed by a defect detection operation. An inter-block stress and detection operation can be used determine word line to word line leaks between different blocks. Select gate leak line leakage, both the word lines and other select lines, is consider, as are shorts from word lines and select lines to local source lines. In addition to word line and select line defects, techniques for determining shorts between bit lines and low voltage circuitry, as in the sense amplifiers, are presented.

Abstract: A number of techniques for determining defects in non-volatile memory arrays are presented, which are particularly applicable to 3D NAND memory, such as that of the BiCS type. Word line to word shorts within a memory block are determined by application of an AC stress mode, followed by a defect detection operation. An inter-block stress and detection operation can be used determine word line to word line leaks between different blocks. Select gate leak line leakage, both the word lines and other select lines, is consider, as are shorts from word lines and select lines to local source lines. In addition to word line and select line defects, techniques for determining shorts between bit lines and low voltage circuitry, as in the sense amplifiers, are presented.

Abstract: Techniques are presented for the determination and handling of defects in non-volatile arrays, particularly those having a 3D or BiCS type of arrangement where NAND strings run in a vertical direction relative to the substrate. In such an arrangement, the NAND strings are formed along memory holes and connected to global bit lines, and are separated into blocks or sub-blocks by vertical local interconnects, such as for source lines, and connected to a corresponding global line. To determine defects, an AC stress can be applied between the interconnects and the bit lines/NAND strings, after which a defect determination operation can be performed. This technique can also be implemented at the system level by having the controller instruct the memory to perform it as part of an adaptive defect determination operation.

Abstract: Techniques for determining broken word lines in non-volatile memory arrays are presented, which are particularly applicable to 3D NAND memory, such as that of the BiCS type. One set of techniques uses test program operation that alternates a standard staircase waveform with an elongated verify operation. This allows for a more accurate verify of under-programmed broken word lines relative to the standard verify operation. Another set of techniques looks at the ramp rate along the interconnect between the word line decoding circuitry and the main part of the word line. These techniques can also be used for determining defective select gate lines of an array with a NAND type structure.