Abstract: An apparatus for the fast and efficient transfer of integrated circuits between three locations: an input location, a test site location, and an output location. The apparatus includes a front and a rear work press assembly for transferring integrated circuits between the locations and for applying pressure during testing. The work press assemblies is constructed of a variable length shaft coupled to an arm extension which is coupled to a work press. The work press assemblies can each move between three horizontal positions, a first horizontal position associated with the input location, a second horizontal position associated with the test site location, and a third horizontal position associated with the output location. The work press assemblies move independently of one another.