Patents by Inventor Jagruti B. Patel

Jagruti B. Patel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low application temperature hot melt adhesive
    Patent number: 8877305
    Abstract: High temperature performance hot melt adhesives are formulated for application at low temperature, i.e., below 300° F. Hot melt adhesive formed with metallocene polymer together with a maleated polyethylene wax show an excellent balance of high and low temperature performance and are particularly useful as packaging case and carton adhesive.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: November 4, 2014
    Assignee: Henkel US IP LLC
    Inventors: Jagruti B. Patel, Andrea Keys Eodice, Yew Guan Low
  • Low Application Temperature Hot Melt Adhesive
    Publication number: 20120128833
    Abstract: High temperature performance hot melt adhesives are formulated for application at low temperatures below, i.e., below 300° F. Hot melt adhesives containing low levels of metallocene polymer together with a maleated polyethylene wax show an excellent balance of high and low temperature performance and are particularly useful as packaging case and carton adhesives.
    Type: Application
    Filed: January 30, 2012
    Publication date: May 24, 2012
    Inventors: Jagruti B. Patel, Andrea Keys Eodice, Yew Guan Low
  • Hot melt adhesive
    Patent number: 7148284
    Abstract: Hot melt adhesives that contain an N-alpha olefin wax have substantially improved open times.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: December 12, 2006
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Brian D. Morrison, Jagruti B. Patel, Justin A. Mehaffy
  • Hot melt adhesive composition
    Publication number: 20040167258
    Abstract: A low application temperature comprising an ethylene n-butyl acrylate copolymer that can be applied at temperatures down to about 80° C. or less and is useful in case and carton sealing application.
    Type: Application
    Filed: February 25, 2004
    Publication date: August 26, 2004
    Inventors: Cecile Drogou, Gwenaelle Allandrieu, Justin A. Mehaffy, Jagruti B. Patel
  • Hot melt adhesive and use thereof
    Publication number: 20040045666
    Abstract: A hot melt adhesive comprising ethylene copolymers, a tackifier and wax is useful in bonding substrates made of polymer laminated paperboard. The adhesive is particularly useful in packaging applications.
    Type: Application
    Filed: September 6, 2002
    Publication date: March 11, 2004
    Inventors: Lie-Zhong Gong, James W. Nowicki, Renu Lamba, Jagruti B. Patel