Abstract: A printed circuit assembly includes a fine pitch flexible printed circuit overlay bonded to a normal pitch printed circuit board. The fine pitch flexible printed circuit overlay may provide increased packaging density, direct chip attachment and/or complex routing with a minimal cost impact on the overall printed circuit assembly.

Abstract: A multilayer rigid-flex circuit board having two or more conductive layers, with at least one rigid circuit board electrically connected to at least one flexible jumper connector or intercircuit connector circuit board, is disclosed. A conductive layer of each of the rigid circuit boards is connected electrically and mechanically to a conductive layer of the flexible jumper connector by an interconnecting adhesive layer. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, electrically conductive particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding the mechanical strain of the interconnection and the thermal cycling and typical circuit board fabrication, finishing and assembly processes. Such a rigid-flex circuit is typically used in an environment where space is limited.