Patents by Inventor Jai Chun Lee

Jai Chun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sputtering method using sputtering device
    Patent number: 9982337
    Abstract: The present invention relates to a sputtering method using a sputtering device, wherein entire scan region is defined from one side to the other side of a sputtering target, and the sputtering target is scanned with a magnet moving back and forth along the entire scan region multiple times. The entire scan region of a sputtering target is divided by N parts to be uniformly eroded, such that a magnet moves back and forth along some part of the divided entire scan region. A sputtering method using a sputtering device can therefore extend an alternating cycle of a sputtering target, by virtue of improving utilization efficiency of the sputtering target through uniform erosion of the sputtering target, and can also reduce manufacturing cost.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: May 29, 2018
    Assignee: Hydis Technologies Co., Ltd.
    Inventor: Jai Chun Lee
  • Sputtering Method Using Sputtering Device
    Publication number: 20160053367
    Abstract: The present invention relates to a sputtering method using a sputtering device, wherein entire scan region is defined from one side to the other side of a sputtering target, and the sputtering target is scanned with a magnet moving back and forth along the entire scan region multiple times. The entire scan region of a sputtering target is divided by N parts to be uniformly eroded, such that a magnet moves back and forth along some part of the divided entire scan region. A sputtering method using a sputtering device can therefore extend an alternating cycle of a sputtering target, by virtue of improving utilization efficiency of the sputtering target through uniform erosion of the sputtering target, and can also reduce manufacturing cost.
    Type: Application
    Filed: November 4, 2015
    Publication date: February 25, 2016
    Inventor: Jai Chun Lee
  • Sputtering method using sputtering device
    Patent number: 9206503
    Abstract: The present invention relates to a sputtering method using a sputtering device, wherein entire scan region is defined from one side to the other side of a sputtering target, and the sputtering target is scanned with a magnet moving back and forth along the entire scan region multiple times. The entire scan region of a sputtering target is divided by N parts to be uniformly eroded, such that a magnet moves back and forth along some part of the divided entire scan region. A sputtering method using a sputtering device can therefore extend an alternating cycle of a sputtering target, by virtue of improving utilization efficiency of the sputtering target through uniform erosion of the sputtering target, and can also reduce manufacturing cost.
    Type: Grant
    Filed: October 25, 2012
    Date of Patent: December 8, 2015
    Assignee: Hydis Technologies Co., Ltd.
    Inventor: Jai Chun Lee