Patents by Inventor Jai Pil Jung

Jai Pil Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead free solder containing Sn, Ag and Bi
    Patent number: 7670548
    Abstract: A lead free solder is provided. The lead free solder includes about 1.5 wt % to about 2.5 wt % silver (Ag), about 3 wt % to about 6 wt % bismuth (Bi), about 0.005 wt % to about 0.1 wt % of a deoxidizing agent, and a balance of tin (Sn). The lead free solder has improved wettability, a lowered melting point, little or substantially no formation of oxidation layer in a solder bath, suppressed brittleness, improved thermal shock resistance and drop resistance.
    Type: Grant
    Filed: January 25, 2008
    Date of Patent: March 2, 2010
    Assignee: MK Electron Co., Ltd.
    Inventors: Young Woo Lee, Kyung In Kang, Byung Wook Jeong, Jai Pil Jung, Ki Ju Lee, Hee Yul Lee