Patents by Inventor Jaimal Mallory Wiliamson

Jaimal Mallory Wiliamson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EMBEDDED LID FOR LOW COST AND IMPROVED THERMAL PERFORMANCE
    Publication number: 20220319950
    Abstract: An electronic device includes a multilevel package substrate, a die, a lid, and a package structure that encloses the die, a portion of the lid, and a portion of the multilevel package substrate, where the package structure fills a gap between a side of another portion of the lid and a side of the die. A method includes attaching a die to a multilevel package substrate with a first side of the die facing the multilevel package substrate and a second side facing away from the multilevel package substrate; positioning a lid on the multilevel package substrate with a first portion of the lid spaced apart from the second side of the die; and forming a package structure that encloses the die and a portion of the multilevel package substrate and fills a gap between the first portion of the lid and the second side of the die.
    Type: Application
    Filed: October 26, 2021
    Publication date: October 6, 2022
    Applicant: Texas Instruments Incorporated
    Inventors: Hiep Xuan Nguyen, Jaimal Mallory Wiliamson, Arvin Nono Verdeflor, Snehamay Sinha