Patents by Inventor Jaime Grunlan

Jaime Grunlan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160107192
    Abstract: A layer-by-layer deposition process for a thin film having a polyelectrolyte and a complementary species includes calibrating a buffered polyelectrolyte solution and a buffered rinse solution, depositing a polyelectrolyte layer on a substrate, and depositing a complementary species layer on the polyelectrolyte layer. Depositing a polyelectrolyte layer includes applying the buffered polyelectrolyte solution to the substrate and applying the buffered rinse solution to the substrate after the buffered polyelectrolyte solution has been applied. Depositing a complementary species layer includes applying a complementary species mixture to the substrate and applying a complementary species rinse solution to the substrate after the complementary species mixture has been applied.
    Type: Application
    Filed: October 20, 2015
    Publication date: April 21, 2016
    Applicant: Texas A&M University System
    Inventors: Jaime Grunlan, Tyler Guin
  • Publication number: 20060283005
    Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.
    Type: Application
    Filed: August 25, 2006
    Publication date: December 21, 2006
    Inventors: James Coleman, Scott Ferguson, Jaime Grunlan, Ian Forster, Andrew Holman, Peikang Liu
  • Publication number: 20060076422
    Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.
    Type: Application
    Filed: December 5, 2005
    Publication date: April 13, 2006
    Inventors: James Coleman, Scott Ferguson, Jaime Grunlan, Ian Forster, Andrew Holman, Peikang Liu
  • Publication number: 20050152955
    Abstract: A electrostatically self-assembled coating having a biologically active agent incorporated therein is provided. More particularly, a wound dressing having an antimicrobial coating within the dressing construction wherein an antimicrobial agent is released from the dressing over a period of time is produced using a layer-by-layer deposition process.
    Type: Application
    Filed: December 16, 2004
    Publication date: July 14, 2005
    Inventors: Jay Akhave, Jan Carr, Jaime Grunlan, Albert Lin
  • Patent number: 6764885
    Abstract: A method for making a transistor device includes embossing to separate parts of a layer of electrically-conducting material, thereby separating a source and a drain. The gap between the source and the drain is filled with a semiconductor material, and the source and drain are operatively coupled to a gate to make a transistor. The electrically-conducting material and the semiconductor material may be deposited using printing processes, and the various steps in the method of making the device may be performed in one or more row-to-row operations.
    Type: Grant
    Filed: October 17, 2002
    Date of Patent: July 20, 2004
    Assignee: Avery Dennison Corporation
    Inventors: Zhisong Huang, Jaime Grunlan, Pi Chang
  • Publication number: 20040075155
    Abstract: A method for making a transistor device includes embossing to separate parts of a layer of electrically-conducting material, thereby separating a source and a drain. The gap between the source and the drain is filled with a semiconductor material, and the source and drain are operatively coupled to a gate to make a transistor. The electrically-conducting material and the semiconductor material may be deposited using printing processes, and the various steps in the method of making the device may be performed in one or more row-to-row operations.
    Type: Application
    Filed: October 17, 2002
    Publication date: April 22, 2004
    Inventors: Zhisong Huang, Jaime Grunlan, Pi Chang